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Memory device and electronic device including the same

專利號(hào)
US12219721B2
公開日期
2025-02-04
申請(qǐng)人
SAMSUNG ELECTRONICS CO., LTD.(KR)
發(fā)明人
Yusuf Cinar; Jae Hong Park; Han Hong Lee; Seon Gyun Baek; Won-Gi Hong
IPC分類
H05K5/02; H01R12/70; H01R12/72; H01R12/73; H01R13/621; H05K5/00; H05K7/20; H01L25/18; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
fastening,enclosure,memory,bdh,cvu,may,module,mcn,connector,face
地域: Suwon-si

摘要

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

說(shuō)明書

The widths of the top fastening pillars LU1 to LU4 based on the XY plane may be greater than the widths (or thicknesses) of the side covers CV_SF1, CV_SF2 and CV_SF3.

The first enclosure 121 may further include one or more inter-device fastening pillars DL1 to DL3 in which fixed holes DH1 to DH3 are placed, as illustrated in FIG. 4. The inter-device fastening pillars DL1 to DL3 protrude downward from the lower face BF of the first main cover CVU, like the top fastening pillars LU1 to LU4. The widths of the inter-device fastening pillars DL1 to DL3 based on the XY plane may be greater than the widths (or thicknesses) of the side covers CV_SF1, CV_SF2 and CV_SF3. The heights of the inter-device fastening pillars DL1 to DL3 are greater than the heights of the top fastening pillars LU1 to LU4 and may be greater than or equal to the heights of the side covers CV_SF1, CV_SF2 and CV_SF3. The planar shapes of the inter-device fastening pillars DL1 to DL3 may be, but are not limited to, a polygon such as a square, a rectangle or a rounded rectangle.

權(quán)利要求

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