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Memory device and electronic device including the same

專利號
US12219721B2
公開日期
2025-02-04
申請人
SAMSUNG ELECTRONICS CO., LTD.（KR）
發(fā)明人
Yusuf Cinar; Jae Hong Park; Han Hong Lee; Seon Gyun Baek; Won-Gi Hong
IPC分類
H05K5/02; H01R12/70; H01R12/72; H01R12/73; H01R13/621; H05K5/00; H05K7/20; H01L25/18; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
fastening,enclosure,memory,bdh,cvu,may,module,mcn,connector,face
地域： Suwon-si

摘要

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

說明書

Referring to FIGS. 2 to 8, the memory device 100, when assembled, may have a sealed structure in which the memory module 110 is completely enclosed through the first enclosure 121 and the second enclosure 122, except for the fourth side face SF4 on which the memory connector MCN is placed.

Specifically, the end portion of the first side cover CV_SF1 of the first enclosure 121 may be in contact with the upper face UF of the second main cover CVB on the first long side LS1 side. The side face of the second main cover CVB on the first long side LS1 side constitutes the first side face SF1 of the memory device 100 together with the outer face of the first side cover CV_SF1. Although the side face of the second main cover CVB on the first long side LS1 side and the outer face of the first side cover CV_SF1 are aligned with each other and may be placed on the same XZ plane, the embodiment is not limited thereto.

Further, the end portion of the second side cover CV_SF2 of the first enclosure 121 may be in contact with the upper face UF of the second main cover CVB on the second short side SS2 side. The side face of the second main cover CVB on the second short side SS2 side may constitute the second side face SF2 of the memory device 100 together with the outer face of the second side cover CV_SF2. Although the side face of the second main cover CVB on the second short side SS2 side and the outer side of the second side cover CV_SF2 are aligned with each other and may be placed on the same YZ plane, the embodiment is not limited thereto.

權(quán)利要求

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