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Memory device and electronic device including the same

專利號(hào)
US12219721B2
公開日期
2025-02-04
申請人
SAMSUNG ELECTRONICS CO., LTD.（KR）
發(fā)明人
Yusuf Cinar; Jae Hong Park; Han Hong Lee; Seon Gyun Baek; Won-Gi Hong
IPC分類
H05K5/02; H01R12/70; H01R12/72; H01R12/73; H01R13/621; H05K5/00; H05K7/20; H01L25/18; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
fastening,enclosure,memory,bdh,cvu,may,module,mcn,connector,face
地域： Suwon-si

摘要

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

說明書

Further, the end portion of the third side cover CV_SF3 of the first enclosure 121 may be in contact with the upper face UF of the second main cover CVB on the second long side LS2 side. The side face of the second main cover CVB on the second long side LS2 side may constitute the third side face SF3 of the memory device 100 together with the outer face of the third side cover CV_SF3. Although the side face of the second main cover CVB on the second long side LS2 side and the outer side of the third side cover CV_SF3 are aligned with each other and may be placed on the same XZ plane, the embodiment is not limited thereto.

The second main cover CVB in the second corner CNR2 and the third corner CNR3 includes a first chamfered part CAF1 and a second chamfered part CAF2, as illustrated in FIG. 8. These first and second chamfered parts CAF1 and CAF2 create respective openings that receive the second inter-device fastening pillar DL2 and the third inter-device fastening pillar DL3 of the first enclosure 121. The two side faces of the first chamfered part CAF1 of the second main cover CVB come into contact with the two side faces of the adjacent second inter-device fastening pillar DL2, and the two side faces of the second chamfered part CAF2 of the second main cover CVB may come into contact with the two side faces of the adjacent third inter-device fastening pillar DL3, respectively. Accordingly, the second corner CNR2 and the third corner CNR3 of the assembled memory device 100 may be sealed.

權(quán)利要求

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