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Memory device and electronic device including the same

專利號
US12219721B2
公開日期
2025-02-04
申請人
SAMSUNG ELECTRONICS CO., LTD.(KR)
發(fā)明人
Yusuf Cinar; Jae Hong Park; Han Hong Lee; Seon Gyun Baek; Won-Gi Hong
IPC分類
H05K5/02; H01R12/70; H01R12/72; H01R12/73; H01R13/621; H05K5/00; H05K7/20; H01L25/18; H05K1/11; H05K1/18
技術領域
fastening,enclosure,memory,bdh,cvu,may,module,mcn,connector,face
地域: Suwon-si

摘要

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

說明書

FIG. 12 is a perspective view showing a state in which the memory device is fastened to the host. FIG. 13 is a perspective view showing a state before the memory device is fastened to the host. FIG. 14 is a cross-sectional view showing the process of fastening the memory connector to the host connector.

Referring to FIGS. 12 to 14, the latch 210 of the host connector 200 before being fastened to the memory device 100 is in a state in which the latch body 210_BD is oriented in the horizontal direction and the hook 211 is directed downward. The hook 211 is located at a height lower than the upper face UF of the first main cover CVU of the first enclosure 121 with respect to the memory device 100 to be inserted.

The fourth side face SF4 of the memory device 100 is pushed into the front of the host connector 200 for fastening. At this time, the memory connector MCN is inserted into the inside of the connector hole COH, the third side cover CV_SF3 is inserted to the side slot part SLT1, and the first main cover CVU is inserted into the upper slot part SLT2, respectively. In the fastening process, the side slot part SLT1 and the upper slot part SLT2 may serve to guide the memory device 100 to be inserted in the correct direction.

權(quán)利要求

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