In this embodiment, the memory device 100 may be fixed to the frame 400 of the electronic device in the same manner as explained referring to FIGS. 15 to 17.
Hereinafter, other embodiments of the memory device will be explained. In the following embodiments, repeated explanation of the same members as those described above will be simplified or will not be provided, and differences will be mainly explained.
FIG. 19 is a cross-sectional view of the memory device according to another embodiment. FIG. 19 shows that a memory device may further include a gap filler GFL.
Referring to FIG. 19, the gap filler GFL may be placed between the memory module 110 and the enclosure assembly 120. For example, the gap filler GFL may be placed between the upper face UF of the memory module 110 and the lower face BF of the first main cover CVU of the first enclosure 121 and/or between the lower face BF of the memory module 110 and the upper face UF of the second main cover CVB of the second enclosure 122. In this way, if the gap filler GFL fills a vertical gap between the memory module 110 and the enclosure assembly 120, movement of the memory module 110 in the memory device 100 may be further prevented.
