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Memory device and electronic device including the same

專(zhuān)利號(hào)
US12219721B2
公開(kāi)日期
2025-02-04
申請(qǐng)人
SAMSUNG ELECTRONICS CO., LTD.（KR）
發(fā)明人
Yusuf Cinar; Jae Hong Park; Han Hong Lee; Seon Gyun Baek; Won-Gi Hong
IPC分類(lèi)
H05K5/02; H01R12/70; H01R12/72; H01R12/73; H01R13/621; H05K5/00; H05K7/20; H01L25/18; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
fastening,enclosure,memory,bdh,cvu,may,module,mcn,connector,face
地域： Suwon-si

摘要

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

說(shuō)明書(shū)

As the lower fin FNB is provided in the second enclosure 122_1, the surface area of the second enclosure 122 may be enlarged. When the surface area of the second enclosure 122_1 is enlarged, the heat capacity may increase.

Also, an additional space as a result of the protruding height of the lower fin FNB is generated above the lower fin FNB of the second enclosure 122_1. When the thermal gap filler GFL_H related to the heat capacity is filled in the additional space, the entire heat capacity of the memory device can be further increased.

In this embodiment, the height of the memory device may be increased by the sum of the protruding heights of the upper fin FNU and the lower fin FNB. If the height increase of the memory device by the fins FNU and FNB needs to be designed to about 6.5 mm as in the embodiments of FIGS. 21 and 22, protruding height of the upper fin FNU and the lower fin FNB may be adjusted accordingly. In an embodiment, the protruding height of the upper fin FNU and the protruding height of the lower fin FNB may be the same 3.25 mm, respectively.

權(quán)利要求

1
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