Ultra dense processors with embedded microfluidic cooling
摘要
說明書
In some embodiments, the microfluidic volume 736 receives one or more electrochemical fluids from a manifold 754 or other delivery element of the server stack 752 that directs charged electrochemical fluid to the stacked-die processor to provide electrical power as described in relation to any of the embodiments described herein. The electrochemical fluid(s) discharges at the stacked-die processor 724 to provide electrical power and receives heat from the stacked-die processor 724. The discharged and hot electrochemical fluid flows through a return conduit 756 to a charging device 758 to recharge the electrochemical fluid with energy from a power source 726. In some embodiments, the charging device 758 includes a heat exchanger 750 to exhaust the heat from the electrochemical fluid. In some embodiments, the heat exchanger 750 exhausts heat from the electrochemical fluid to the ambient atmosphere. In some embodiments, the heat exchanger 750 exhausts heat from the electrochemical fluid to another cooling fluid, such as in a secondary liquid cooling system.
