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Ultra dense processors with embedded microfluidic cooling

專利號
US12219734B2
公開日期
2025-02-04
申請人
Microsoft Technology Licensing, LLC(US WA Redmond)
發(fā)明人
Bharath Ramakrishnan; Husam Atallah Alissa; Christian L. Belady; Sean Michael James; Vaidehi Oruganti
IPC分類
H05K7/20; G06F1/20; H01M8/18
技術領域
die,fluid,in,heat,volume,second,transfer,first,stacked,processor
地域: WA WA Redmond

摘要

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

說明書

In some embodiments, the electrochemical fluid circulates through the electrochemical generator system, receiving electrical power from the electrical source and delivering the electrical power to the electrical load, substantially continuously. In some embodiments, the electrochemical fluid is stored in a storage tank until the electrical power is needed similarly to a battery, when pumps flow the electrochemical fluid. As described herein, a first electrochemical fluid and a second electrochemical fluid exchange ions across a first ion-transfer membrane in the first electrochemical chamber to discharge the first electrochemical fluid and produce electrical power. The first electrochemical fluid and a second electrochemical fluid exchange ions across a second ion-transfer membrane in the second electrochemical chamber to charge the first electrochemical fluid and store electrical power.

In some embodiments, at least a part of the electrochemical chamber configured to provide power is located in a microfluidic volume between dies on a stacked-die processor. For example, a first electrochemical fluid may be positioned in the microfluidic volume. In another example, a second electrochemical fluid may be positioned in the microfluidic volume. In yet another example, both the first electrochemical fluid and the second electrochemical fluid may be positioned in the microfluidic volume.

權利要求

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