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Ultra dense processors with embedded microfluidic cooling

專利號
US12219734B2
公開日期
2025-02-04
申請人
Microsoft Technology Licensing, LLC(US WA Redmond)
發(fā)明人
Bharath Ramakrishnan; Husam Atallah Alissa; Christian L. Belady; Sean Michael James; Vaidehi Oruganti
IPC分類
H05K7/20; G06F1/20; H01M8/18
技術(shù)領(lǐng)域
die,fluid,in,heat,volume,second,transfer,first,stacked,processor
地域: WA WA Redmond

摘要

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

說明書

In some embodiments, the heat transfer structures are straight fins that define two electrochemical chambers adjacent to one another, which are each divided by ion-transfer membranes positioned therein to create a first channel and a second channel in each electrochemical chamber. In some embodiments, the electrochemical chambers allow flow of the first electrochemical fluid in the first channel and the second electrochemical fluid in the second channel. In other examples, at least part of the heat transfer structure may be curved or have a curved portion. For example, a first heat transfer structure may be curved relative to another heat transfer structure such that the cross-sectional area of a channel varies in a flow direction of the electrochemical fluid. In at least one embodiment, the cross-sectional area of a channel increases in the direction of flow to decrease the velocity of the electrochemical fluid through the channel. In at least one embodiment, the cross-sectional area of a channel decreases in the direction of flow to increase the velocity of the electrochemical fluid through the channel.

權(quán)利要求

1
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