白丝美女被狂躁免费视频网站,500av导航大全精品,yw.193.cnc爆乳尤物未满,97se亚洲综合色区,аⅴ天堂中文在线网官网

Ultra dense processors with embedded microfluidic cooling

專利號
US12219734B2
公開日期
2025-02-04
申請人
Microsoft Technology Licensing, LLC(US WA Redmond)
發(fā)明人
Bharath Ramakrishnan; Husam Atallah Alissa; Christian L. Belady; Sean Michael James; Vaidehi Oruganti
IPC分類
H05K7/20; G06F1/20; H01M8/18
技術(shù)領(lǐng)域
die,fluid,in,heat,volume,second,transfer,first,stacked,processor
地域: WA WA Redmond

摘要

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

說明書

In some embodiments, the first electrochemical fluid in the first channel is separated from the second electrochemical fluid in the second channel by an ion-transfer membrane creates an electric potential between the first electrode(s) position in the first channel and the second electrode(s) positioned in the second channel. In some embodiments, both the first die and the second die have electrodes positioned in contact with one or more of the first electrochemical fluid and the second electrochemical fluid. The first die and second die can, therefore, both receive electrical power from the electrochemical fluids while the electrochemical fluids receive heat from the first die and second die to exhaust the heat therefrom. In some embodiments, the heat transfer structures further transfer heat to the electrochemical fluids. In some embodiments, at least one of the ion-transfer membranes is a heat transfer structure.

權(quán)利要求

1
微信群二維碼
意見反饋