Recirculating the recharged and cooled electrochemical fluid can allow the electrochemical fluid to provide electrical power and thermal management directly to the dies of a stacked-die processor substantially continuously. In at least one embodiment, delivery of electrochemical fluid to the microfluidic volume of a stacked-die processor can allow combined power delivery and thermal management and allow for smaller, more powerful, more efficient, and more reliable processors.

The present disclosure relates to systems and methods for combined power delivery and cooling to a processor according to at least the examples provided in the sections below:

• • [A1] In some embodiments, a processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.
  • [A2] In some embodiments, the electrochemical fluid of [A1] is an anolyte fluid, and a catholyte fluid is separated from the anolyte fluid by a membrane.
  • [A3] In some embodiments, the membrane and catholyte fluid of [A2] are located in the microfluidic volume.
  • [A4] In some embodiments, the heat transfer structure of [A3] is the membrane.