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Ultra dense processors with embedded microfluidic cooling

專利號(hào)
US12219734B2
公開(kāi)日期
2025-02-04
申請(qǐng)人
Microsoft Technology Licensing, LLC（US WA Redmond）
發(fā)明人
Bharath Ramakrishnan; Husam Atallah Alissa; Christian L. Belady; Sean Michael James; Vaidehi Oruganti
IPC分類
H05K7/20; G06F1/20; H01M8/18
技術(shù)領(lǐng)域
die,fluid,in,heat,volume,second,transfer,first,stacked,processor
地域： WA WA Redmond

摘要

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

說(shuō)明書

  • [A5] In some embodiments, the heat transfer structure of [A4] divides the microfluidic volume into at least a first channel and a second channel, wherein the anolyte fluid is located in the first channel and the catholyte fluid is located in the second channel.
  • [A6] In some embodiments, a cross-sectional area of the first channel of [A5] changes in a direction of flow of the anolyte fluid therein.
  • [A7] In some embodiments, the heat transfer structure of [A5] is curved in a direction of flow of the anolyte fluid.
  • [A8] In some embodiments, at least part of the membrane of [A2] includes the second die.
  • [A9] In some embodiments, the heat transfer structure of any of [A1] through [A8] includes a plurality of pin fins.
  • [A10] In some embodiments, the processing unit of any of [A1] through [A9] includes a charging device in fluid communication with the microfluidic volume and configured to recharge a discharged electrochemical fluid with a power source after the electrochemical fluid provides electrochemical energy to at least one of the first die and the second die.
  • [A11] In some embodiments, the processing unit of any of [A1] through [A10] includes a heat exchanger in communication with the microfluidic volume and configured to configured to exhaust heat from the electrochemical fluid.

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