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Ultra dense processors with embedded microfluidic cooling

專利號
US12219734B2
公開日期
2025-02-04
申請人
Microsoft Technology Licensing, LLC（US WA Redmond）
發(fā)明人
Bharath Ramakrishnan; Husam Atallah Alissa; Christian L. Belady; Sean Michael James; Vaidehi Oruganti
IPC分類
H05K7/20; G06F1/20; H01M8/18
技術(shù)領(lǐng)域
die,fluid,in,heat,volume,second,transfer,first,stacked,processor
地域： WA WA Redmond

摘要

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

說明書

  • [B3] In some embodiments, the first wafer of [B1] or [B2] further includes through-silicon vias (TSVs) electrically connecting the first die to the second die.
  • [B4] In some embodiments, the second wafer of [B3] further includes TSVs electrically connecting the third die to the fourth die.
  • [B5] In some embodiments, a first flow direction of the electrochemical fluid of any of [B1] through [B4] through the first microfluidic volume is opposite a second flow direction of the electrochemical fluid through the second microfluidic volume.
  • [C1] In some embodiments, a method of providing power and cooling to a stacked-die processor includes providing an electrochemical fluid to a microfluidic volume of the stacked-die processor, generating electrical power at the stacked-die processor with the electrochemical fluid, receiving heat from the stacked-die processor with the electrochemical fluid in the microfluidic volume, and exhausting the heat from the electrochemical fluid at a heat exchanger.
  • [C2] In some embodiments, the method of [C1] further includes recharging the electrochemical fluid at a charging device.
  • [C3] In some embodiments, generating the electrical power at the stacked-die processor with the electrochemical fluid of [C1] or [C2] includes transferring ions across an ion-transfer membrane located in the microfluidic volume.

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