Reverse-return parallel loop thermal management system for an electronic device
地域：
SC
SC Anderson
摘要
A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.
說明書
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A portion of the disclosure of this patent document contains material that is subject to copyright protection by the author thereof. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or patent disclosure for the purposes of referencing as patent prior art, as it appears in the Patent and Trademark Office, patent file or records, but otherwise reserves all copyright rights whatsoever.
One or more embodiments of the invention generally relate to an efficient electronic device cooling system, including a cooling system for servers. More particularly, certain embodiments of the invention relate to a reverse-return parallel loop system.
The following background information may present examples of specific aspects of the prior art (e.g., without limitation, approaches, facts, or common wisdom) that, while expected to be helpful to further educate the reader as to additional aspects of the prior art, is not to be construed as limiting the present invention, or any embodiments thereof, to anything stated or implied therein or inferred thereupon.
權(quán)利要求
What is claimed is:1. A reverse-return parallel loop thermal management system for an electronic device, comprising:a plurality of heat sinks with a series of thermal pathways configured to provide hydraulically balanced liquid coolant to each heat sink in said plurality of heat sinks, wherein each heat sink diverts at least a portion of said liquid coolant across a heat sink exchanging core, thereby at least partially vaporizing said liquid coolant, and wherein each heat sink diverting a remaining portion of the liquid coolant to a downstream heat sink; each heat sink in said plurality of heat sinks is configured to be in thermal communication with a heat source; each heat sink in said plurality of heat sinks having a liquid-in port, a liquid-out port, a vapor-inlet port, and a vapor-outlet port; each heat sink in said plurality of heat sinks is configured to have at least one thermal pathway, wherein said at least one thermal pathway begins at said liquid-in port and flows to a divide, thereby splitting said at least one thermal pathway in two separate thermal pathways, wherein a first path flows to said liquid-out port and a second path passes through said heat sink exchanging core, flows out through said vapor-outlet port; liquid coolant entering each heat sink and following a first thermal pathway flows through the first liquid outlet port as a liquid; and liquid coolant entering each heat sink and following a second thermal pathway flows through said heat sink exchanging core, wherein said liquid is at least partially vaporized before exiting said heat sink through said vapor-outlet port. 2. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 1 , further comprising:said vapor-outlet port on a first heat sink connecting, by way of a conduit, to a vapor-inlet port on a downstream heat sink; said liquid-in port on said first heat sink receiving liquid coolant from a liquid coolant supply; said liquid-out port on said first heat sink connecting, by way of a conduit, to a liquid-in port on a downstream heat sink; said vapor-outlet port on a last heat sink connecting, by way of a conduit, to a liquid coolant return, thereby returning said at least partially vaporized liquid coolant; said liquid-in port on said last heat sink receiving liquid coolant from an upstream heat sink; and said vapor-inlet port on said last heat sink receiving said at least partially vaporized liquid coolant from an upstream heat sink. 3. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 2 , further comprising:said vapor-inlet port on said first heat sink in said plurality of heat sinks is blinded; and said liquid-out port on said last heat sink in said plurality of heat sinks is blinded. 4. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 2 , wherein said conduit is comprised of a rigid material, wherein said rigid material is at least one of copper or plastic. 5. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 2 , wherein said conduit is comprised of a flexible material, wherein said flexible material is at least one of rubber, plastic, or fiberglass. 6. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 1 , wherein each heat sink in said plurality of heat sinks further includes a flow regulation valve, wherein said flow regulation valve is engaged by one or more actuators to control a flow of liquid coolant to thereby influence CPU temperature by adjusting thermal transmission from the CPU to the liquid coolant. 7. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 6 , wherein the one or more actuator is a thermal actuator capable of sensing temperature variation and thereby regulate the flow of liquid coolant by increasing or decreasing an opening of the flow regulation valve. 8. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 7 , wherein the thermal actuator is at least one of a wax thermal actuator, a bulb actuator, a diaphragm actuator, a bimetal actuator, or a servomotor with temperature sensor. 9. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 6 , wherein the one or more actuator is an electric actuator. 10. The reverse-return parallel loop thermal management system for an electronic device, as recited in claim 1 , wherein said heat sink exchanging core further comprises bunches of multilayered, radial microchannels. 11. A system, comprising:a cooling cycle for an electronic device, wherein said cooling cycle includes a plurality of heat sinks, at least one system heat exchanger, and at least one liquid pump; liquid coolant, wherein said liquid coolant cycles through said at least one heat exchanger and collects in a liquid reservoir; said at least one liquid pump routes said liquid coolant from said liquid reservoir, through a conduit, to a liquid-in port on a first heat sink in said plurality of heat sinks; said plurality of heat sinks cycles the liquid coolant over at least one CPU, wherein a thermal transfer of heat removes heat from said at least one CPU; a final heat sink routes the liquid coolant out through a vapor-outlet port in to a conduit, which connects said vapor-outlet port of said final heat sink to a vapor manifold of said system heat exchanger; said system heat exchanger is cooled by an external coolant in thermal communication with said liquid coolant, and enters said system heat exchanger through a coolant inlet, and exits said system heat exchanger through a coolant outlet; wherein said plurality of heat sinks further includes a series of thermal pathways configured to provide hydraulically balanced liquid coolant to each heat sink in said plurality of heat sinks, wherein each heat sink diverts at least a portion of said liquid coolant across a heat exchanging core, thereby at least partially vaporizing said liquid coolant, and diverting a remaining portion of the liquid coolant to a downstream heat sink; each heat sink in said plurality of heat sinks is configured to be in thermal communication with said at least one CPU; each heat sink in said plurality of heat sinks having a liquid-in port, a liquid-out port, a vapor-inlet port, and a vapor-outlet port; each heat sink in said plurality of heat sinks is configured to have at least one thermal pathway, wherein said at least one thermal pathway begins at said liquid-in port and flows to a divide, thereby splitting said at least one thermal pathway in two separate thermal pathways, wherein a first path flows to a liquid-out port and a second path passes through said heat exchanging core, and flows out through a vapor-outlet port; and wherein each heat sink in said plurality of heat sinks having individual or discrete heat exchanging core. 12. The system, as recited in claim 11 , wherein the liquid coolant is a single-phase fluid. 13. The system, as recited in claim 12 , wherein the single-phase fluid is at least one of water, a glycol solution, or a dielectric fluid. 14. The system, as recited in claim 11 , wherein the liquid coolant is a two-phase fluid. 15. The system, as recited in claim 14 , wherein the two-phase fluid is a refrigerant. 16. The system as recited in claim 11 , wherein:liquid coolant entering each heat sink and following a first thermal pathway flows through the liquid-out port as a liquid; and liquid coolant entering each heat sink and following a second thermal pathway flows through said heat exchanging core, wherein said liquid is at least partially vaporized before exiting said heat sink through said vapor-outlet port. 17. The system as recited in claim 16 , further comprising:said vapor-outlet port on said first heat sink connecting, by way of a conduit, to a vapor-inlet port on a downstream heat sink; said liquid-in port on said first heat sink receiving liquid coolant from a liquid coolant supply, wherein said liquid coolant supply is said liquid pump in said system heat exchanger; said liquid-out port on said first heat sink connecting, by way of a conduit, to a liquid-in port on a downstream heat sink; said vapor-outlet port on said last heat sink connecting, by way of a conduit, to a liquid coolant return, thereby returning said at least partially vaporized liquid coolant to said vapor manifold of said system heat exchanger; said liquid-in port on said last heat sink receiving liquid coolant from an upstream heat sink; and said vapor-inlet port on said last heat sink receiving said at least partially vaporized liquid coolant from an upstream heat sink. 18. The system as recited in claim 17 , wherein each heat sink in said plurality of heat sinks further includes a flow regulation valve, wherein said flow regulation valve is engaged by one or more actuators to control a flow of liquid coolant to thereby influence heat sources temperature by adjusting thermal transmission from the heat sources to the liquid coolant. 19. The system as recited in claim 18 , wherein said heat exchanging core further comprises bunches of multilayered, radial microchannels. 20. A reverse-return parallel loop system, comprising:a cooling cycle for an electronic device, wherein said cooling cycle includes at least two heat sinks, at least one system heat exchanger, and at least one liquid pump; liquid coolant, wherein said liquid coolant cycles through said at least one heat exchanger and collects in a liquid reservoir; said at least one liquid pump routes said liquid coolant from said liquid reservoir, through a conduit, to a liquid-in port on a first heat sink of said two heat sinks; said two heat sinks are configured to cycle the liquid coolant over two heat sources, wherein a thermal transfer of heat removes heat from said two heat sources; each heat sink has a liquid-inlet port, a liquid-outlet port, a vapor-inlet port, and a vapor-outlet port; said vapor-inlet port on said first heat sink in said at least two heat sinks is blinded; said liquid-out port on said second heat sink in said at least two heat sinks is blinded; a conduit connects the at least one liquid pump to a liquid-inlet port on a first heat sink, wherein the liquid coolant is split in to two thermal streams with a first stream heading through a liquid-outlet port on the first heat sink, and a second stream heading toward a heat exchange core of the first heat sink; said second stream becoming at least partially vaporized in said heat exchange core of said first heat sink, whereby said at least partially vaporized liquid coolant flows out of said vapor-outlet of said first heat sink toward a vapor inlet of a second heat sink by way of a conduit; said liquid-outlet port of said first heat sink connects via a conduit to a liquid-inlet port on the second heat sink of the system, wherein the liquid coolant flows through the heat exchanger core of the second heat sink, where it is at least partially vaporized by absorbing heat from a second heat sources, and merges with vapor from the first heat sink as it is carried out the vapor-outlet port and through the return conduit of the system to a vapor manifold of said system heat exchanger; said system heat exchanger is cooled by an external coolant in thermal communication with said liquid coolant, and enters heat exchanger of the system through a coolant inlet, and exits the heat exchanger of the system through a coolant outlet; said first sink further includes a flow regulation valve, wherein said flow regulation valve is engaged by one or more actuators to control a flow of liquid coolant to thereby influence heat sources, temperature by adjusting thermal transmission from the heat sources to the liquid coolant; said second heat sink further includes a flow regulation valve, wherein said flow regulation valve is engaged by one or more actuators to control a flow of liquid coolant to thereby influence heat sources temperature by adjusting thermal transmission from the heat sources to the liquid coolant; said one or more actuators in said first heat sink and second heat sink are thermal actuators capable of sensing temperature variation and thereby regulate the flow of liquid coolant by increasing or decreasing an opening of the flow regulation valve; and each heat exchanging core in said first heat sink and said second heat sink further comprise bunches of multilayered, radial microchannels.
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