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Reverse-return parallel loop thermal management system for an electronic device

專利號(hào)
US12219740B2
公開(kāi)日期
2025-02-04
申請(qǐng)人
Advanced Liquid Cooling Technologies Inc.(US SC Anderson)
發(fā)明人
Nan Chen; He Zhao; Yunshui Chen
IPC分類
H05K7/20
技術(shù)領(lǐng)域
vapor,heat,sink,port,may,liquid,sinks,outlet,be,inlet
地域: SC SC Anderson

摘要

A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

說(shuō)明書(shū)

Liquid supply hose 666 and vapor return hose 680 may run through a server chassis to be connected with microchannel heat exchanger 672. Liquid supply hose 666 and vapor return hose 680 may be composed of rigid materials, such as, without limitation, copper, plastic, etc. or flexible materials, such as, without limitation, rubber, plastic, fiberglass, etc. For example, if a high pressure refrigerant was used, the flexible hose could be a polyamide tube, polyester braid, PU sheath. If the working fluid was water, the tube could be PVC. Hard tunes, like copper, may also be used, though it involved higher installation costs and maintainability concerns. The type of tube used may depend on various factors, such as, without limitation, pressure rating of the refrigerant, cost of available materials, etc. Thus, minimal changes to a server chassis are required to incorporate vertical reverse-return loop system 600. Further, large supply and return manifolds may not be required in the present embodiment.

Microchannel heat exchanger 672 may include vapor manifold 678, heat exchanging core 682, liquid reservoir 670, and one or more liquid pumps 668. Return vapor may be supplied through vapor return hose 680 and distributed into the channels of heat exchanging core 682 via vapor manifold 678. Vapor may be condensed into liquid using cold liquid supplied through coolant inlet 674 and returned through coolant outlet 676. Vapor that is condensed into liquid may flow into liquid reservoir 670. Subsequently, one or more liquid pumps 668 in the liquid pump station may transfer liquid from liquid reservoir 670 into liquid supply hose 666.

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