Display substrate, manufacturing method thereof, and display device
地域：
Anhui
摘要
A display substrate, a manufacturing method thereof, and a display device. The method includes: forming a pixel definition layer transitional pattern on a base substrate, the pixel definition layer transitional pattern being provided at a lateral surface with an undercut; forming a common layer, which is broken at the undercut, on the base substrate; removing the undercut to obtain a pattern of a pixel definition layer; and forming a cathode on the base substrate.
說明書
This application is a Continuation of U.S. patent application Ser. No. 17/644,056 filed Dec. 13, 2021, which is a Continuation of U.S. patent application Ser. No. 16/079,131 filed Aug. 23, 2018, which is the U.S. national phase of PCT Application No. PCT/CN2018/074423 filed on Jan. 29, 2018, which claims priority to Chinese Patent Application No. 201710449807.7 filed on Jun. 14, 2017, which are incorporated herein by reference in their entireties.
The present disclosure relates to a display substrate, a manufacturing method thereof and a display device.
Due to such advantages as self-luminescence, high brightness, wide viewing angle, high contrast, being flexible and low power consumption, an organic light-emitting diodes (OLED) display device, as a new-generation display device, has attracted more and more attentions and has gradually replaced a conventional liquid crystal display device, which is widely used in mobile phone screens, computer displays and full-color televisions. Different from a conventional liquid crystal display technology, for an OLED display technology, it is unnecessary to provide back light, and a very thin organic material layer and a very thin glass substrate may be adopted. When a current flows through the organic material layer, the organic material layer may emit light. The OLED display device has such many advantages, for example, being capable of achieving a flexible display. A flexible OLED panel may be achieved, if a flexible plastic substrate is adopted as a carrier, and a thin film encapsulation process is adopted.
權(quán)利要求
What is claimed is:1. A display substrate, comprising a base substrate, a pixel definition layer arranged on the base substrate and a common layer, whereinthe pixel definition layer comprises a first film layer and a second film layer, the first film layer is arranged at a side of the second film layer adjacent to the base substrate, and an orthogonal projection of a top surface of the first film layer onto the base substrate completely falls within an orthogonal projection of a bottom surface of the second film layer onto the base substrate, wherein the common layer is arranged on a top surface of the second film layer, an orthogonal projection of the common layer on the base substrate overlaps the orthogonal projection of the top surface of the first film layer onto the base substrate. 2. The display substrate according to claim 1 , wherein an edge of the orthogonal projection of the top surface of the first film layer onto the base substrate is spaced apart by a certain distance from an edge of the orthogonal projection of the bottom surface of the second film layer onto the base substrate. 3. The display substrate according to claim 1 , wherein the first film layer comprises a first dam member and a second dam member, the second dam member is arranged at a side of the first dam member away from the base substrate. 4. The display substrate according to claim 3 , wherein an orthogonal projection of a top surface of the first dam member onto the base substrate coincides an orthogonal projection of a bottom surface of the second dam member onto the base substrate. 5. The display substrate according to claim 3 , wherein an orthogonal projection of a bottom surface of the second dam member onto the base substrate completely falls within an orthogonal projection of a top surface of the first dam member onto the base substrate. 6. The display substrate according to claim 3 , wherein an orthogonal projection of a top surface of the second dam member onto the base substrate completely falls within an orthogonal projection of a top surface of the first dam member onto the base substrate. 7. The display substrate according to claim 3 , wherein the second film layer comprises a third dam member, an orthogonal projection of a top surface of the second dam member onto the base substrate completely falls within an orthogonal projection of a bottom surface of the third dam member onto the base substrate, and an edge of the orthogonal projection of the top surface of the second dam member onto the base substrate is spaced apart by a certain distance from an edge of the orthogonal projection of the bottom surface of the third dam member onto the base substrate. 8. The display substrate according to claim 7 , wherein the first dam member, the second dam member, the third dam member have different patterns and/or thicknesses. 9. The display substrate according to claim 1 , wherein the common layer is broken at a boundary between the first film layer and the second film layer. 10. The display substrate according to claim 8 , wherein a sum of a thickness of the first dam member and a thickness of the second dam member is D, the thickness of the first dam member is 1/10D to ?D, a thickness of the third dam member is ?D to ?D. 11. A display device comprising the display substrate according to claim 1 . 12. A method for manufacturing a display substrate, comprising:forming a pixel definition layer transitional pattern on a base substrate, the pixel definition layer transitional pattern being provided at a lateral surface with an undercut; removing the undercut to obtain a pattern of a pixel definition layer; and forming the common layer on the base substrate; wherein the forming the pixel definition layer transitional pattern on the base substrate comprises: forming at least two dam members on the base substrate, wherein the at least two dam members are located in a direction perpendicular to the base substrate, the pixel definition layer transitional pattern comprises the at least two dam members, and the undercut is formed between two of the at least two dam members, wherein the forming the at least two dam members on the base substrate comprises: forming, on the base substrate, a first dam member, a second dam member arranged on the first dam member and a third dam member arranged on the second dam member, wherein an orthogonal projection of a top surface of the second dam member onto the base substrate completely falls within an orthogonal projection of a bottom surface of the third dam member onto the base substrate, and an edge of the orthogonal projection of the top surface of the second dam member onto the base substrate is spaced apart by a certain distance from an edge of the orthogonal projection of the bottom surface of the third dam member onto the base substrate, wherein the forming the common layer on the base substrate comprises: forming the common layer on the base substrate, wherein the common layer comprises a first common layer portion at a pixel region defined by the pixel definition layer transitional pattern and a second common layer portion at a top surface of the pixel definition layer transitional pattern. 13. The method according to claim 12 , wherein the forming, on the base substrate, the first dam member, the second dam member arranged on the first dam member and the third dam member arranged on the second dam member comprises:forming a first photosensitive material layer; exposing a portion of the first photosensitive material layer having a thickness d relative to an upper surface of the first photosensitive material layer to form a fully exposed film layer, the first photosensitive material layer having a thickness D, and D being larger than d; forming a second photosensitive material layer on the exposed first photosensitive material layer; exposing portions of the first photosensitive material layer and the second photosensitive material layer not shielded by a light-shielding pattern of a mask plate, an orthogonal projection of the light-shielding pattern onto the base substrate overlapping an orthogonal projection of the pixel definition layer onto the base substrate; and developing the exposed first photosensitive material layer and the exposed second photosensitive material layer to form the first dam member, the second dam member and the third dam member. 14. The method according to claim 13 , wherein the thickness d of the fully exposed film layer is 1/10D to ?D. 15. The method according to claim 14 , wherein a thickness d1 of the second photosensitive material layer is ?D to ?D, and d1 is larger than d. 16. The method according to claim 12 , wherein the forming, on the base substrate, the second dam member and the third dam member arranged on the second dam member comprises:forming a first photosensitive material layer; exposing the entire first photosensitive material layer; forming a second photosensitive material layer on the exposed first photosensitive material layer; exposing portions of the first photosensitive material layer and the second photosensitive material layer not shielded by a light-shielding pattern of a mask plate, an orthogonal projection of the light-shielding pattern onto the base substrate overlapping an orthogonal projection of the pixel definition layer onto the base substrate; and developing the exposed first photosensitive material layer and the exposed second photosensitive material layer to form the second dam member and the third dam member. 17. The method according to 12, wherein the first common layer portion and the second common layer portion are unconnected to each other. 18. The method according to claim 12 , wherein the forming the common layer on the base substrate comprises:forming a hole injection layer and a hole transport layer sequentially on the base substrate, each of the hole injection layer and the hole transport layer being broken at the undercut at the lateral surface of the pixel definition layer transitional pattern, one portion of each of the hole injection layer and the hole transport layer being located at the pixel region, the other portion being located at the top surface of the pixel definition transitional pattern; and forming an electron transport layer and an electron injection layer sequentially, each of the electron transport layer and the electron injection layer being broken at the undercut at the lateral surface of the pixel definition layer transitional pattern, one portion of each of the electron transport layer and the electron injection layer being located at the pixel region, the other portion being located at the top surface of the pixel definition transitional pattern. 19. The method according to claim 12 , further comprising: forming a cathode on the base substrate.
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