At Step 501. The substrate is cleaned. The cleaning manner includes at least one of organic cleaning or inorganic cleaning. The organic cleaning refers to cleaning with acetone, isoacetone, or deionized water, and inorganic cleaning refers to cleaning with phosphoric acid, sulfuric acid, or a piranha solution. In some examples, the cleaning method includes at least one of ultrasonic cleaning or heating cleaning.

At Step 502. A first photoresist is spin-coated as a primer.

After spin-coating, first baking is performed on the first photoresist. The temperature of the first baking is the soft baking temperature of the first photoresist. The first photoresist is a polymethyl methacrylate (PMMA) photoresist.

At Step 503. A second photoresist is spin-coated on the first photoresist layer as a pattern definition layer.

The first photoresist does not react with a developer of the second photoresist. In some examples, the second photoresist layer has an opposite light sensitive property from the first photoresist layer. In an example, the first photoresist layer is positive photoresist, and the second photoresist is negative photoresist.

Second baking is performed on the second photoresist. The temperature of the second baking is the soft baking temperature of the second photoresist.

At Step 504. Exposure patterning is performed on the second photoresist.

The exposure process includes ultraviolet exposure or laser direct writing, and the baking temperature is a pre-baking temperature of the second photoresist.

At Step 505. A structure used for depositing and lifting off a bridge brace after development and fixation is obtained.