Illustratively, referring to FIG. 7, the process of fabricating an air bridge corresponding to the method A includes the following steps:

At Step 700. A bridge brace material is deposited. The bridge brace material is deposited in the manner shown in FIG. 5.

At Step 701. A patterned photoresist is coated. The baking temperature is a soft baking temperature of the patterned photoresist.

At Step 702. Exposure patterning is performed. The exposure process includes ultraviolet exposure or laser direct writing. The baking temperature is a pre-baking temperature of the patterned photoresist. Patterned patterns in the patterning process include a separated air bridge pattern and a fully-enclosed air bridge pattern, where the fully-enclosed air bridge is an air bridge having an opening pattern at the pier portion and/or the approach bridge portion.

At Step 703. A structure of a bridge having an opening is obtained after development and fixation.

At Step 704. An oxide layer on a substrate is etched and removed.

At Step 705. A bridge material is deposited. The method for depositing the bridge material includes deposition methods with good directionality control such as electron beam deposition and molecular beam epitaxy.

At Step 706. Glue layers are released (removed). The temperature of lift-off ranges from 20° C. to 100° C., and lift-off methods include a soaking method or an ultrasonic method.