As described above, in the method for fabricating an air bridge provided in this embodiment, exposure patterning treatment is performed on a patterned photoresist, so as to arrange an opening structure running through a deck on the deck. In addition, in the process of fabricating an air bridge, a bridge brace material is released through the opening structure, and an etching material is released from the position of an opening to etch the bridge brace material. Therefore, the complete release of the bridge brace material is ensured, and bridge brace material residues are prevented from being left inside the bridge hole, thereby improving the overall device quality of the air bridge and the fabrication accuracy of the air bridge.

In the method provided in this embodiment, in the process of arranging an opening, an opening is arranged by coating a photoresist twice. The developing characteristics of the photoresist are used to arrange the opening on an air bridge. In this way, the fabrication efficiency of the air bridge is improved, and the opening is arranged and obtained by applying a relatively small number of times of photoresist coatings.

Second, descriptions are provided for a method for fabricating an air bridge corresponding to the method B. FIG. 9 is a flowchart of a method for fabricating an air bridge according to another exemplary embodiment of this disclosure. As shown in FIG. 9, the method includes the following steps:

At Step 901. A bridge brace material matching the air bridge in shape on is deposited a substrate.

The bridge brace material matches the air bridge in shape, that is, by depositing a bridge material on the bridge brace material, an air bridge with an accurate shape can be directly obtained.