Method for fabricating air bridge, air bridge structure, and superconducting quantum chip
地域：
Guangdong
摘要
This disclosure includes a method for fabricating an air bridge, an air bridge structure, and a superconducting quantum chip, and relates to the field of circuit structures. In some examples, a method for fabricating an air bridge includes forming an air bridge brace structure on a substrate, and forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure. The air bridge material layer with the one or more openings is formed based on a patterned photoresist layer with patterns corresponding to the one or more openings. The method further includes removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings.
說明書
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As described above, in the method for fabricating an air bridge provided in this embodiment, exposure patterning treatment is performed on a patterned photoresist, so as to arrange an opening structure running through a deck on the deck. In addition, in the process of fabricating an air bridge, a bridge brace material is released through the opening structure, and an etching material is released from the position of an opening to etch the bridge brace material. Therefore, the complete release of the bridge brace material is ensured, and bridge brace material residues are prevented from being left inside the bridge hole, thereby improving the overall device quality of the air bridge and the fabrication accuracy of the air bridge.
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