FIG. 8 is a schematic diagram of an exemplary process of arranging an opening at a bridge top portion using a method A according to the embodiment shown in FIG. 6.

FIG. 9 is a flowchart of a method for fabricating an air bridge corresponding to a method B according to an exemplary embodiment of this disclosure.

FIG. 10 is an exemplary schematic diagram of a fabrication process of an air bridge corresponding to a method B according to the embodiment shown in FIG. 9.

FIG. 11 is an electron micrograph of an opening of a fully-enclosed air bridge according to an exemplary embodiment of this disclosure.

To make the objectives, technical solutions, and advantages of this disclosure clearer, the following further describes exemplary implementations of this disclosure in detail with reference to the accompanying drawings.

An air bridge is a circuit structure, configured to implement planar circuit bridging using a three-dimensional bridge structure. The air bridge is a structure manufactured by using a micro-nano processing method. The introduction of an air bridge structure to a circuit can resolve the problems such as cross-bonding between low inductance and low fringe capacitance, and has enormous advantages compared with wire bonding technologies. The key to the fabrication of an air bridge is to ensure a firm structure, with which the air bridge can maintain its shape without collapse, fracture, or the like in a high-temperature and vibrating environment.