專利號：US14227929
申請人：INTEL CORPORATION
主分類號：H05K7/00
所在地：CA Santa Clara
An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier cou...
專利號：US14025135
申請人：ABB Technology AG
主分類號：H05K7/20
所在地：Zürich
An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electr...
專利號：US14104521
申請人：Samsung Electronics Co., Ltd.
主分類號：H05K5/02
所在地：Suwon-si, Gyeonggi-do
An electronic device is provided. The electronic device includes a main frame, an opening portion formed in the main frame, a recess portion formed al...
專利號：US13944140
申請人：PEGATRON CORPORATION
主分類號：G06F1/16
所在地：Taipei
A cover structure for an electronic device comprises a protective cover and a touch element. The protective cover is connected with the electronic dev...
專利號：US13755197
申請人：Murata Manufacturing Co., Ltd.
主分類號：H01G4/005
所在地：Nagaokakyo-shi, Kyoto-fu
A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on ...
專利號：US13738107
申請人：Apple Inc.
主分類號：H01H9/00
所在地：CA Cupertino
A control mechanism for an electronic device comprises a cover glass having an aperture defined therein. The aperture extends from an interior to an e...
專利號：US13727485
申請人：Fu Tai Hua Industry (Shenzhen) Co., Ltd.; HON HAI PRECISION INDUSTRY CO., LTD.
主分類號：H05K5/02
所在地：Shenzhen
An exemplary stand structure includes a base board, telescopic supporting rods, and a holding base. The supporting rods are retractable into the base ...
專利號：US14058360
申請人：Apple Inc.
主分類號：H05K5/00
所在地：CA Cupertino
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one ...
專利號：US14151822
申請人：Shun-Ying Cheng; Bing-Han Tsai; Chun-Chung Hsiao
主分類號：G02F1/1333
所在地：Hsin-Chu
A display device includes a casing, a frame, a backlight module, at least one cable, and a display panel. The casing has a display opening. The frame ...
專利號：US13712033
申請人：Takaharu Hondo
主分類號：H05K3/10
所在地：Sakura
The method includes: preparing a first substrate including first wirings; preparing a mold having a stamping surface that includes convex portions for...
專利號：US14492130
申請人：International Business Machines Corporation
主分類號：H05K3/06
所在地：NY Armonk
The method includes applying a magnetic etching ferrofluid, that contains an aqueous etchant solution within one or more reverse micelles responsive t...
專利號：US14122889
申請人：Panasonic Corporation
主分類號：H05K1/11
所在地：Osaka
Provided is a multilayer wiring board, wherein impedance matching can be achieved in a via connection section by means of a configuration, which has a...
專利號：US14347075
申請人：Tetsuro Miyahira; Yoshihiro Kato; Takaaki Ogashiwa; Hiroshi Takahashi
主分類號：B32B3/02
所在地：Tokyo
The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed...
專利號：US13641860
申請人：Thomas Gottwald
主分類號：H01L23/02
所在地：Dunningen-Seedorf
A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arr...
專利號：US14102832
申請人：International Business Machines Corporation
主分類號：H01L23/528
所在地：NY Armonk
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method f...
專利號：US14006047
申請人：Masami Hasegawa; Satoshi Hirayama; Naoki Kito
主分類號：H05K1/00
所在地：Konan
Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method...
專利號：US13936443
申請人：SHINKO ELECTRIC INDUSTRIES CO., LTD.
主分類號：H01L23/373
所在地：Nagano
A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an oppo...
專利號：US13902197
申請人：SHINKO ELECTRIC INDUSTRIES CO., LTD.
主分類號：H05K1/11
所在地：Nagano-shi, Nagano
A wiring board includes a core layer, a through-hole penetrating through the core layer in its thickness direction, a first wiring layer formed on a f...
專利號：US13792092
申請人：QUALCOMM Incorporated
主分類號：H05K1/02
所在地：CA San Diego
A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The pr...
專利號：US13707113
申請人：Intel Corporation
主分類號：H05K7/10
所在地：CA Santa Clara
Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement h...
專利號：US13934807
申請人：CANON COMPONENTS, INC.
主分類號：H05K1/02
所在地：Kodama-gun, Saitama
A flexible circuit board 3a for mounting a light emitting element has base films 31a and 31b, a wiring pattern 32 formed on a surface of the base film...
專利號：US13724981
申請人：PEKING UNIVERSITY FOUNDER GROUP CO., LTD.; ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO., LTD.
主分類號：H01B12/00
所在地：Beijing
A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a prin...
專利號：US14575720
申請人：THALES; CENTRE NATIONAL D'ETUDES SPATIALES
主分類號：H05K1/02
所在地：Neuilly-sur-Seine
A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the ...
專利號：US14817408
申請人：ASML Netherlands B.V.
主分類號：H05G2/00
所在地：Velhoven
Techniques for generating EUV light include directing a first pulse of radiation toward a target material droplet to form a modified droplet, the firs...
專利號：US14489411
申請人：ASML Netherlands B.V.
主分類號：H05G2/00
所在地：Veldhoven
A target material is provided at a target location, the target material including a material that emits extreme ultraviolet light when converted to pl...
專利號：US14680909
申請人：USHIO DENKI KABUSHIKI KAISHA
主分類號：H05G2/00
所在地：Tokyo
A light source device irradiates a material with a first beam, and directs a second beam toward a first position on the material, which is irradiated ...
專利號：US12943787
申請人：Frederic A. Bourke, Jr.; Zakaryae Fathi; Ian Nicholas Stanton; Michael J. Therien; Paul Rath Stauffer; Paolo MacCarini; Katherine Sarah Hansen; Diane Renee Fels; Cory Robert Wyatt; Mark Wesley Dewhirst
主分類號：G01N23/02
所在地：CT Greenwich
Methods and systems for producing a change in a medium. A first method and system (1) place in a vicinity of the medium at least one upconverter inclu...
專利號：US13944182
申請人：Panasonic Corporation
主分類號：H05B37/02
所在地：Osaka
Discharge lamp electronic ballast includes DC-DC converter circuit for converting voltage of DC power supply to output DC power, inverter circuit for ...
專利號：US13920894
申請人：SmartLabs, Inc.
主分類號：H01Q1/26
所在地：CA Irvine
An LED illumination device is configured to receive coded messages by at least one of radio signals in free space, electrically conducted signals by w...
專利號：US14394910
申請人：ADB BVBA
主分類號：H05B37/02
所在地：Zaventem
Constant current regulator (10) for supplying a series circuit (9) of a lighting installation with an output electrical power corresponding to a prede...
專利號：US13782639
申請人：Lutron Electronics Inc., Co.
主分類號：H05B37/02
所在地：PA Coopersburg
An amount of filament voltage supplied by a reconfigurable ballast may be adjusted based on a lamp type with which the ballast is operating. The filam...
專利號：US13683904
申請人：Naixing Kuang
主分類號：H05B37/02
所在地：Hangzhou
A switch-mode power supply and associated control circuit for a light-emitting device are disclosed. The switch-mode power supply having a first switc...
專利號：US14197288
申請人：TSMC Solid State Lighting Ltd.
主分類號：H05B33/08
所在地：Hsinchu
A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external ...
專利號：US14619645
申請人：Panasonic Intellectual Property Management Co., Ltd.
主分類號：H05B37/00
所在地：Osaka
A lighting device includes: first and second power feed terminals between which a light source of a light source device is configured to be electrical...
專利號：US13559451
申請人：Ching-Chuan Kuo; Yung Lin Lin
主分類號：G05F1/00
所在地：Taipei
A dimming controller can operate in a first mode or a second mode to control dimming of a light-emitting diode (LED) light source. The dimming control...
專利號：US14170760
申請人：Once Innovations, Inc.
主分類號：H05B33/08
所在地：MN Plymouth
Conditioning circuits are provided for driving two or more LED groups using a rectified AC input voltage. The conditioning circuits uses analog circui...
專利號：US13644972
申請人：Aydin Displays, Inc.
主分類號：H05B37/00
所在地：PA Birdsboro
Disclosed are LED backlight subassemblies and LCD displays making use thereof. The backlight subassembly includes at least one string of serially conn...
專利號：US13346625
申請人：Richard K. Williams; Kevin D'Angelo; David A. Brown; George A. Hariman
主分類號：H05B37/00
所在地：CA Cupertino
A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications includes multiple intelligent sa...
專利號：US14250416
申請人：Dialog Semiconductor GmbH
主分類號：H05B41/36
所在地：Kirchheim/Teck-Nabern
A driver circuit of solid state light bulb assemblies including light emitting diodes comprises a first power converter stage converting an input volt...
專利號：US13992069
申請人：Yoshikazu Sasaki; Shunsuke Saito
主分類號：G09G3/32
所在地：Kyoto
A detection resistor is arranged on a path of an LED string. A controller generates a gate pulse signal having a duty ratio adjusted such that the vol...
專利號：US13834153
申請人：Lutron Electronics Co., Inc.
主分類號：H05B37/02
所在地：PA Coopersburg
A load control device for controlling the amount of power delivered to an electrical load (e.g., an LED light source) comprises an isolated forward co...
專利號：US13814805
申請人：Chihh-Wa Lee
主分類號：H05B1/00
所在地：Tainan
The present invention is provided with a waterless detection method and a waterless detection device of a boiler iron and an iron applied with the dev...
專利號：US13612121
申請人：Jeyhan Karaoguz; James D. Bennett; Nambirajan Sashadri
主分類號：H04W36/00
所在地：CA Irvine
A method and apparatus supporting handoff using simulcasting of multimedia information via a gateway are disclosed. A gateway supporting both a person...
專利號：US13967159
申請人：Antonio Montalvo; Kevin G. Gard
主分類號：H04W88/10
所在地：NC Raleigh
Embodiments of the present invention may provide a receiver. The receiver may include an RF section and a quadrature mixture, coupled to the RF sectio...
專利號：US14163571
申請人：Broadcom Corporation
主分類號：H04W4/00
所在地：CA Irvine
Embodiments provide WiFi and LTE tailored transceiver radio frequency (RF) filtering techniques and configurations to enable coexistence between WiFi ...
專利號：US14118649
申請人：EMPIRE TECHNOLOGY DEVELOPMENT, LLC
主分類號：H04B7/15
所在地：DE Wilmington
Technologies are generally described for an aggregation of bandwidth from multiple wireless devices. In some examples, a source device may communicate...
專利號：US13919756
申請人：QUALCOMM Incorporated
主分類號：H04W4/00
所在地：CA San Diego
A wireless device supporting concurrent communication with multiple wireless systems of different radio access technologies (RATs) are disclosed. In a...
專利號：US13683336
申請人：Koji Akita; Takayoshi Ito; Seiichiro Horikawa; Hideo Kasami
主分類號：H04B7/00
所在地：Yokohama
A wireless communication device has a plurality of wireless units each configured to cover a different wireless communication range and be capable of ...
專利號：US13592061
申請人：Wei-Lun Hsu; Pen Hsieh; Chia-Hung Fan; Chen-Hua Fan
主分類號：H04W88/06
所在地：Hsinchu
A method, system and non-transitory computer storage readable medium comprise operating a Wide Area Network (WAN) device according to a first Internet...
專利號：US14254087
申請人：Apple Inc.
主分類號：H04W88/06
所在地：CA Cupertino
Operating a user equipment (UE) which comprises a first radio that is configured to operate according to a first radio access technology (RAT) and a s...