專利號(hào)：US14638304
申請(qǐng)人：HKR SEUFFER AUTOMOTIVE GMBH & CO. KG
主分類號(hào)：H05K7/20
所在地：Kupferzell
The invention relates to a cooling device for heat-emitting components, wherein at least one component is arranged on a printed circuit board and wher...
專利號(hào)：US13613940
申請(qǐng)人：Chao-Wen Lu
主分類號(hào)：H05K7/20
所在地：Taoyuan Hsien
A centrifugal fan includes an impeller and a housing. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axia...
專利號(hào)：US13846728
申請(qǐng)人：DELTA ELECTRONICS, INC.
主分類號(hào)：H05K7/20
所在地：Taoyuan Hsien
A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air d...
專利號(hào)：US14534752
申請(qǐng)人：ABB Oy
主分類號(hào)：H05K7/20
所在地：Helsinki
An exemplary electric apparatus includes a fan for generating a first airflow, a component space includes a secondary electric component, and a housin...
專利號(hào)：US13317510
申請(qǐng)人：Yuji Ohba; Junichi Ishimine; Tomoaki Haneda; Jun Takeda; Masamichi Iwasaki; Shinji Mizumura
主分類號(hào)：G05D23/00
所在地：Kawasaki
An air conditioner sucks air exhausted from an information processor, and cools down the sucked air. The air conditioner exhausts the cooled air. The ...
專利號(hào)：US14103321
申請(qǐng)人：Tyco Electronics Corporation
主分類號(hào)：G02B6/00
所在地：PA Berwyn
A cable backplane system includes cable connectors having cables extending therefrom. Each cable connector has a header holding signal contacts at a m...
專利號(hào)：US14316588
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：G02F1/1333
所在地：Seoul
A display apparatus includes a plurality of first brackets adhered to the rear panel. A first bracket has a recess on a first surface where an adhesiv...
專利號(hào)：US14124293
申請(qǐng)人：Mark David Senatori
主分類號(hào)：A47B96/06
所在地：TX The Woodlands
A mounting frame for a component of a computing system includes first supports and second supports. The first supports are to contact a top surface of...
專利號(hào)：US13910340
申請(qǐng)人：THE AEROSPACE CORPORATION
主分類號(hào)：H05K1/11
所在地：CA El Segundo
A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the dev...
專利號(hào)：US14228712
申請(qǐng)人：International Business Machines Corporation
主分類號(hào)：H05K7/14
所在地：NY Armonk
A shelf device facilitates access to electronic modules within an enclosure having multiple vertically stacked levels of module storage locations. A p...
專利號(hào)：US13818783
申請(qǐng)人：Atsuro Takeno; Takashi Maruyama
主分類號(hào)：H02J7/00
所在地：Wako
Provided is a charger, wherein capability of storing codes connected to the charger is improved. The charger is provided with: a housing case for hous...
專利號(hào)：US13955278
申請(qǐng)人：Samsung Electronics Co., Ltd
主分類號(hào)：H05K5/00
所在地：Suwon-si, Gyeonggi-do
A display apparatus comprises a main body including a touch screen disposed on a front surface thereof; an accessory unit rotatably disposed with resp...
專利號(hào)：US13948642
申請(qǐng)人：IBIDEN Co., Ltd.
主分類號(hào)：H05K3/20
所在地：Ogaki-shi
A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a secon...
專利號(hào)：US14219398
申請(qǐng)人：Tessera, Inc.
主分類號(hào)：B23K1/00
所在地：CA San Jose
A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the firs...
專利號(hào)：US13748341
申請(qǐng)人：Mutual-Tek Industries Co., Ltd.
主分類號(hào)：H05K3/02
所在地：Xinzhuang
A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are ...
專利號(hào)：US14791735
申請(qǐng)人：IBIDEN CO., LTD.
主分類號(hào)：H05K1/18
所在地：Ogaki
A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers ...
專利號(hào)：US13648842
申請(qǐng)人：Shinko Electric Industries Co., LTD.
主分類號(hào)：H05K1/18
所在地：Nagano-ken
A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penet...
專利號(hào)：US14337196
申請(qǐng)人：INVENSAS CORPORATION
主分類號(hào)：H05K1/11
所在地：CA San Jose
A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending i...
專利號(hào)：US14621003
申請(qǐng)人：EverDisplay Optronics (Shanghai) Limited
主分類號(hào)：H05K7/10
所在地：Shanghai
A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the l...
專利號(hào)：US14918620
申請(qǐng)人：International Business Machines Corporation
主分類號(hào)：H05K1/03
所在地：NY Armonk
A method is provided for customizing connections of conductors of a printed circuit board (PCB) including conductors and a cavity formed in a thicknes...
專利號(hào)：US14224863
申請(qǐng)人：MICROSOFT TECHNOLOGY LICENSING, LLC
主分類號(hào)：H05K9/00
所在地：WA Redmond
An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical ...
專利號(hào)：US14283372
申請(qǐng)人：ADVANCED FLEXIBLE CIRCUITS CO., LTD.
主分類號(hào)：H05K1/02
所在地：Taoyuan County
Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is fo...
專利號(hào)：US14259522
申請(qǐng)人：IBIDEN CO., LTD.
主分類號(hào)：H05K1/00
所在地：Ogaki-shi
An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer i...
專利號(hào)：US13648414
申請(qǐng)人：FLEXTRONICS AP, LLC
主分類號(hào)：H05K1/11
所在地：CO Broomfield
Methods of backdrilling printed circuit boards (PCBs) to remove via stubs and related apparatuses. The method may include removing a via stub through ...
專利號(hào)：US14464129
申請(qǐng)人：Cisco Technology, Inc.
主分類號(hào)：G06F17/50
所在地：CA San Jose
The subject technology provides configurations for a printed circuit board that includes a first reference plane, a first signal layer below the first...
專利號(hào)：US13075779
申請(qǐng)人：Takuya Suzuki
主分類號(hào)：H05K1/11
所在地：Tokyo
Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting sub...
專利號(hào)：US14599672
申請(qǐng)人：INTERNATIONAL BUSINESS MACHINES CORPORATION
主分類號(hào)：H01L21/76
所在地：NY Armonk
A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other ...
專利號(hào)：US14417370
申請(qǐng)人：Mitsubishi Electric Corporation
主分類號(hào)：H05K7/20
所在地：Chiyoda-ku
An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer...
專利號(hào)：US14359061
申請(qǐng)人：Junichi Miyamoto; Naoki Masuda; Shuichi Nakanishi
主分類號(hào)：H05B37/02
所在地：Tokyo
A light source apparatus according to the present invention includes a circuit board; a light source mounted on the circuit board; a first temperature...
專利號(hào)：US14407019
申請(qǐng)人：TRIDONIC GMBH & CO KG
主分類號(hào)：H05B37/02
所在地：Dornbirn
A power factor correction circuit (11) comprises an input for receiving an input voltage (UIN), an inductance (21) coupled to the input, a switching m...
專利號(hào)：US14876962
申請(qǐng)人：InnoLux Corporation
主分類號(hào)：H01J1/62
所在地：Miao-Li County
A display panel is disclosed, having a display region and a non-display region out of the display region, wherein the display region comprises a centr...
專利號(hào)：US13397965
申請(qǐng)人：Sana Esaki; Akinori Hiramatu
主分類號(hào)：H05B37/00
所在地：Ibaraki
A lighting device includes a lighting unit which controls a current being supplied to a load, in which light emitting modules, each having one or more...
專利號(hào)：US13640440
申請(qǐng)人：Jason Neudorf
主分類號(hào)：H05B37/02
所在地：Kitchener
There is provided a method of controlling solid state lighting (SSL) devices including receiving dimming information; translating the dimming informat...
專利號(hào)：US14510097
申請(qǐng)人：MIKRO MESA TECHNOLOGY CO., LTD.
主分類號(hào)：G01R31/26
所在地：Apia
A micro-light-emitting diode (micro-LED) includes a first type semiconductor layer, a second type semiconductor layer, a dielectric layer, and electro...
專利號(hào)：US14955827
申請(qǐng)人：NXP B.V.
主分類號(hào)：H05B33/08
所在地：Eindhoven
A controller for controlling a plurality of LED lighting strings is disclosed, the controller comprising, for each of the plurality of LED lighting st...
專利號(hào)：US14921508
申請(qǐng)人：AUTOMOTIVE LIGHTING ITALIA S.p.A.
主分類號(hào)：B60Q1/14
所在地：Venaria Reale
A method for controlling a motor-vehicle lighting device is provided that uses LEDs supplied with PWM signals temporally spaced apart from one another...
專利號(hào)：US12925059
申請(qǐng)人：Steven Huynh; Cuong Van Pham
主分類號(hào)：H05B33/08
所在地：CA Fremont
A single inductor multiple LED string driver comprises a switch control circuit and a current-sensing control circuit. The switch control circuit gene...
專利號(hào)：US14563652
申請(qǐng)人：Hubbell Incorporated
主分類號(hào)：H05B33/08
所在地：CT Shelton
A device and system for controlling a light source. The device has a positive terminal and a negative terminal for setting the high-end trim of a ligh...
專利號(hào)：US14559054
申請(qǐng)人：ASKION GmbH; GERALD WAGNER CONSULTING LLC
主分類號(hào)：A61L2/04
所在地：Gera
The invention relates to a method for heating volumes of media (11) in a closed receptacle (10) by means of an electromagnetic radiation (2), wherein ...
專利號(hào)：US14839337
申請(qǐng)人：TUNDRA COMPOSITES, LLC
主分類號(hào)：H05B6/10
所在地：MN White Bear Lake
The product of a molten alkali metal metalate phase separation can be processed into a purified metal from a metal source. Metal sources include nativ...
專利號(hào)：US12812068
申請(qǐng)人：Achim Luft; Andreas Schmidt
主分類號(hào)：H04W84/18
所在地：Braunschweig
An ad-hoc communication radio module is provided, which may include at least one of an ad-hoc communication reception circuit; and an ad-hoc communica...
專利號(hào)：US14638548
申請(qǐng)人：CANON KABUSHIKI KAISHA
主分類號(hào)：H04B5/00
所在地：Tokyo
The present invention provides a technique that, in the case where a first radio communication unit has acquired device information, and the execution...
專利號(hào)：US13944390
申請(qǐng)人：Electronics and Telecommunications Research Institute
主分類號(hào)：H04W76/02
所在地：Daejeon
A communication method of a terminal and a communication method of a base station for a direct communication link between terminals are disclosed. A b...
專利號(hào)：US13715083
申請(qǐng)人：Qurio Holdings, Inc.
主分類號(hào)：H04W76/02
所在地：NC Raleigh
A system and method for bypassing an access point in a wireless Local Area Network (LAN) for direct point-to-point data transfers are provided. A user...
專利號(hào)：US14378914
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：H04W76/02
所在地：Seoul
The present invention relates to a wireless communication system, and more specifically, disclosed are a method and an apparatus for filtering-based s...
專利號(hào)：US13679084
申請(qǐng)人：Nokia Corporation
主分類號(hào)：G06F15/16
所在地：Espoo
Disclosed is a method, system and computer programs to provide emergent behavior in a network of connected mobile user devices. The method includes ad...
專利號(hào)：US14509745
申請(qǐng)人：Intel Corporation
主分類號(hào)：H04W74/08
所在地：CA Santa Clara
Techniques for media access in wireless networks are disclosed. For instance, embodiments may provide a time interval for accessing a wireless communi...
專利號(hào)：US13524598
申請(qǐng)人：Par Ankel
主分類號(hào)：H04W24/08
所在地：Nodinge
A method in a base station, the method comprising, for a transmission time interval on the control channel: if an absolute grant is scheduled, transmi...
專利號(hào)：US14377481
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：H04W72/12
所在地：Seoul
Provided is a method for performing device-to-device communication between a first user equipment (UE) and a second UE in a wireless communication sys...
專利號(hào)：US13760581
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H04W72/12
所在地：Gyeonggi-do
A centralized scheduling method and apparatus is provided for minimizing inter-cell interference in the wireless communication system adopting femto-e...