專利號：US13870108
申請人：Valeo Systemes de Controle Moteur
主分類號：B23P19/00
所在地：Cergy Saint Christophe
A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type ...
專利號：US14474780
申請人：Dell Products L.P.
主分類號：H05K7/20
所在地：TX Round Rock
In accordance with embodiments of the present disclosure, a system may include a structural element and a heat pipe. The structural element may be for...
專利號：US14319396
申請人：EMC Corporation
主分類號：H05K7/20
所在地：MA Hopkinton
An electronic equipment chassis in one embodiment comprises a housing having a front portion and a rear portion, first and second rows of cooling modu...
專利號：US15374061
申請人：International Business Machines Corporation
主分類號：H05K13/00
所在地：NY Armonk
A method for forming a system. A cooling conduit is secured on a top surface of each rack container of rack units to allow a cooling fluid to flow thr...
專利號：US13723661
申請人：Liebert Corporation
主分類號：F25B7/00
所在地：OH Columbus
A pumped refrigerant cooling system having multiple pumping units for providing working fluid to a load to enable cooling of a space via the load. The...
專利號：US15201347
申請人：Terrella Energy Systems Ltd.
主分類號：H01L23/373
所在地：Mission
Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used i...
專利號：US14849104
申請人：DELTA ELECTRONICS, INC.
主分類號：H05K7/20
所在地：Taoyuan
A heat exchanging module comprises a casing, a plurality of first air guiding elements and a plurality of first separation elements. The first air gui...
專利號：US14607512
申請人：WAGO Verwaltungsgesellschaft mbH
主分類號：H05K7/20
所在地：Minden
Modular electronic system 1 with convection cooling, comprising a plurality of electronic modules 10, 20, 30, that each comprise an air inlet opening ...
專利號：US14699653
申請人：Nan Juen International Co., Ltd.
主分類號：F16L3/015
A cable management system includes a sliding rail setcable and management racks coupled to the sliding rail set. Each cable management rack includes a...
專利號：US14881323
申請人：Samsung Electronics Co., Ltd.
主分類號：H01R13/629
所在地：Gyeonggi-do
An electronic device comprising: an housing; a tray detachably disposed in a slot formed in the housing, wherein the tray includes: a mounting portion...
專利號：US14474857
申請人：Dell Products L.P.
主分類號：H05K7/12
所在地：TX Round Rock
In accordance with embodiments of the present disclosure, a system may include a structural base, a handle mechanically coupled to the structural base...
專利號：US14651248
申請人：Mitsubishi Electric Corporation
主分類號：H05K5/00
所在地：Tokyo
Provided is a vehicle-mounted electronic control device including a control unit reduced in size, weight, and costs with improved contact reliability ...
專利號：US15102803
申請人：GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD.; SHENZHEN FASTPRINT CIRCUIT TECH CO., LTD.; YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO., LTD.
主分類號：H05K1/00
所在地：Guangzhou
Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufact...
專利號：US13422499
申請人：Tomoko Monda; Minoru Mukai
主分類號：H05K3/22
所在地：Kawasaki
According to one embodiment, an electronic device includes a circuit board with an electronic component mounted thereon. The device, includes a measur...
專利號：US14314551
申請人：VALEO ETUDES ELECTRONIQUES
主分類號：B23P19/00
所在地：Creteil
A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a...
專利號：US14297755
申請人：Panasonic Corporation
主分類號：H05K3/30
所在地：Osaka
An electronic component mounting system includes a screen printing device, an inspection device, an electronic component mounting device, a feedback p...
專利號：US14840693
申請人：IBIDEN CO., LTD.
主分類號：H01L23/538
所在地：Ogaki
A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insu...
專利號：US15252547
申請人：TYCO ELECTRONICS CORPORATION; Tyco Electronics UK Ltd.
主分類號：H05K1/18
所在地：PA Berwyn
A solar junction box includes a housing having a base and walls defining a cavity. The base has an opening configured to receive a conductive foil. A ...
專利號：US14570490
申請人：Intel Corporation
主分類號：F16B19/00
所在地：CA Santa Clara
Generally discussed herein are systems, apparatuses, and methods that relate to an attachment device. According to an example, a device may include an...
專利號：US14969585
申請人：KYOCERA Corporation
主分類號：H05K1/00
所在地：Kyoto-shi, Kyoto
A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and...
專利號：US14327307
申請人：OLESON CONVERGENT SOLUTIONS, LLC
主分類號：H01L23/34
所在地：CA Santa Barbara
A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, inclu...
專利號：US14766085
申請人：LG CHEM, LTD.
主分類號：B32B3/00
所在地：Seoul
The present specification relates to a conductive structure body and a method for manufacturing the same.
專利號：US13997596
申請人：Sung Wuk Ryu; Seong Bo Shim; Seung Yul Shin
主分類號：H05K1/09
所在地：Seoul
A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating la...
專利號：US15240133
申請人：Sierra Circuits, Inc.
主分類號：H05K1/03
所在地：CA Sunnyvale
A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric...
專利號：US14857907
申請人：PHILIPS LIGHTING HOLDING B.V.
主分類號：H01R33/00
所在地：Eindhoven
A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines...
專利號：US14761209
申請人：Hanqing Jiang; Hongyu Yu; Goran Konjevod; Yong Xu
主分類號：H05K1/14
所在地：AZ Chandler
An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems ...
專利號：US15084864
申請人：Samsung Electro-Mechanics Co., Ltd.
主分類號：H05K1/11
所在地：Suwon-Si
A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disp...
專利號：US12869910
申請人：Shengli Lin
主分類號：H05K1/02
所在地：CA San Jose
Embodiments of the present invention are directed to providing a time delay to a shortened trace in a differential microstrip trace pair. By adding ba...
專利號：US14928166
申請人：FuKui Precision Component (Shenzhen) Co., Ltd.; HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Zhen Ding Technology Co., Ltd.
主分類號：H05K1/02
所在地：Shenzhen
A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate include...
專利號：US15070294
申請人：Samsung Electro-Mechanics Co., Ltd.
主分類號：H05K1/00
所在地：Suwon-si
Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes a core layer comprising a first surface and a second ...
專利號：US15074975
申請人：Mevion Medical Systems, Inc.
主分類號：H05H13/02
所在地：MA Lincoln
An example particle accelerator includes a coil to provide a magnetic field to a cavity; a particle source to provide a plasma column to the cavity; a...
專利號：US14274348
申請人：Lawrence Livermore National Security, LLC
主分類號：H05G2/00
所在地：CA Livermore
A method of x-ray and gamma-ray generation via laser Compton scattering uses the interaction of a specially-formatted, highly modulated, long duration...
專利號：US14635991
申請人：EAGLE HARBOR TECHNOLOGIES, INC.
主分類號：H05G1/22
所在地：WA Seattle
A pulse generator is disclosed that includes at least the following stages a driver stage, a transformer stage, a rectifier stage, and an output stage...
專利號：US14639995
申請人：Shailendra Suman
主分類號：H02J7/00
所在地：NC Matthews
In the field of appliances connected to the power grid, it is sometimes desirable for such appliances to function even in the absence of grid power. E...
專利號：US14712485
申請人：Musco Corporation
主分類號：F21S4/00
所在地：IA Oskaloosa
Apparatus, method, and system for improving visibility of objects against a background. Background luminance is monitored for an event or condition. U...
專利號：US14780996
申請人：EMPIRE TECHNOLOGY DEVELOPMENT LLC
主分類號：H05B33/14
所在地：DE Wilmington
Polarized white light emitting devices are provided that have a substrate coated with a film of boron chains embedded in carbon nanotubes. An orientat...
專利號：US14810984
申請人：Cree, Inc.
主分類號：H05B37/02
所在地：NC Durham
A lighting fixture including a light source, a housing, an image sensor, and a lens is disclosed. The housing is coupled to the light source and inclu...
專利號：US14813308
申請人：CREE, INC.
主分類號：H05B33/08
所在地：NC Durham
A solid state lighting apparatus can include a variable color input signal configured to indicate a target color of light output from the apparatus. A...
專利號：US14478319
申請人：Heraeus Noblelight America LLC
主分類號：H05B33/08
所在地：MD Gaithersburg
A light-emitting source for curing applications is disclosed. The light-emitting source comprises a first housing having a top wall and one or more si...
專利號：US14566613
申請人：LG Display Co., Ltd.
主分類號：H05B33/04
所在地：Seoul
There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border ...
專利號：US14440476
申請人：ABP INDUCTION SYSTEMS GMBH
主分類號：H05B6/06
所在地：Dortmund
A method and an apparatus for detecting a ground fault in an induction furnace as well as an induction furnace are described. When a ground fault is d...
專利號：US13892950
申請人：Amazon Technologies, Inc.
主分類號：H04W4/00
所在地：NV Reno
An item-providing system supplies items to a user device for consumption at the user device via communication infrastructure. In one representative im...
專利號：US13689183
申請人：MARVELL INTERNATIONAL LTD.
主分類號：H04L12/28
所在地：Hamilton
A preamble, a first portion of a data payload, a midamble, and a second portion of the data payload of a single data unit are generated. The midamble ...
專利號：US14774590
申請人：LG ELECTRONICS INC.
主分類號：H04W76/02
所在地：Seoul
There is provided a method for a method for reporting buffer status. The method may comprise: identifying a change of a radio bearer; and triggering a...
專利號：US15033545
申請人：Huawei Device Co., Ltd.
主分類號：H04W76/02
所在地：Shenzhen
A data transmission method, where the data transmission method includes acquiring, by a first terminal, an output signal of a sensor of the first term...
專利號：US14454158
申請人：Samsung Electronics Co., Ltd.
主分類號：H04W76/02
所在地：Suwon-si, Gyeonggi-do
A method and apparatus for a Wi-Fi direct connection are provided. The method for a Wi-Fi direct connection includes detecting an event for a group co...
專利號：US14428032
申請人：Telefonaktiebolaget L M Ericsson (publ)
主分類號：H04W4/00
所在地：Stockholm
Embodiments herein relate to a method in a first network node (16) for enabling device to device, D2D, communication between a first device (10) and a...
專利號：US14415443
申請人：China Academy of Telecommunications Technology
主分類號：H04W76/02
所在地：Beijing
Disclosed are a method, system and device for data transmission in the access point handover process, which is used to solve the problem existing in t...
專利號：US14497771
申請人：Huawei Technologies Co., Ltd.
主分類號：H04W4/00
所在地：Shenzhen
The present invention discloses a method and an apparatus for establishing a direct tunnel, which relate to the field of communications network techno...
專利號：US15040128
申請人：FUJITSU LIMITED
主分類號：H04B7/00
所在地：Kawasaki-shi, Kanagawa
A wireless communication device includes a memory and a processor coupled to the memory and configured to receive, from a first device, a first identi...