專利號：US14610306
申請人：Digi International Inc.
主分類號：H05K9/00
所在地：MN Minnetonka
Systems and methods for serviceable EMI shielding are provided. In one embodiment, an electronics device comprises: a circuit board; at least one comp...
專利號：US14687511
申請人：Huawei Technologies Co., Ltd.
主分類號：H05K7/10
所在地：Shenzhen
An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a subst...
專利號：US14699109
申請人：FUJITSU LIMITED
主分類號：H05K7/20
所在地：Kawasaki-shi, Kanagawa
A modular data center includes a fan creating a first cooling wind from outside air, an air conditioner creating a second cooling wind having a temper...
專利號：US14513062
申請人：Dell Products L.P.
主分類號：H05K5/00
所在地：TX Round Rock
A thermal ducting rail receives a rack device in a rack chassis. The thermal ducting rail includes air flow guiding elements that enable cooling air f...
專利號：US15437491
申請人：International Business Machines Corporation
主分類號：F03B13/20
所在地：NY Armonk
A water-based computing system is described. In one embodiment, the system comprises a plurality of interconnected computer nodes each placed in a wat...
專利號：US13418461
申請人：Andre Mitchell
主分類號：F25D17/06
所在地：IL Rockford
A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channe...
專利號：US14664272
申請人：MSI Computer (Shenzhen) Co., Ltd.
主分類號：H05K7/20
所在地：Shenzhen
A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet...
專利號：US15134188
申請人：SolarCity Corporation
主分類號：H05K7/18
所在地：CA San Mateo
A multi-component inverter rack formed from sheet metal is disclosed. Some of the sheet metal derived parts used to form the multi-component inverter ...
專利號：US15241346
申請人：FUJITSU LIMITED
主分類號：H05K7/20
所在地：Kawasaki-shi, Kanagawa
The invention relates to an assembly comprising a rack server insert and a server rack for accommodating multiple rack server inserts. A rack installa...
專利號：US14903442
申請人：CONTI TEMIC MICROELECTRONIC GMBH
主分類號：H05K5/02
所在地：Nuremberg
A multi-part sealing system is provided for a housing of a motor vehicle control unit. The housing includes a first housing part and at least one addi...
專利號：US15175904
申請人：LG ELECTRONICS INC.
主分類號：H05K5/02
所在地：Seoul
There are disclosed a display device including a display module configured to display a screen, a case configured to mount the display module therein,...
專利號：US14918110
申請人：Cree, Inc.
主分類號：H05K5/00
所在地：NC Durham
A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power...
專利號：US14267977
申請人：AU Optronics Corporation; Jieng Tai International Electric Corp.
主分類號：H05K5/00
所在地：Hsin-Chu
An electronic device and a display module used therein are provided. The display module includes a display panel, a backlight module and a sensing ant...
專利號：US14388734
申請人：PANASONIC CORPORATION
主分類號：H01R12/62
所在地：Osaka
Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second subs...
專利號：US14239549
申請人：Antonius Petrus Marinus Dingemans
主分類號：H05K3/34
所在地：Tilburg
There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry ...
專利號：US14582873
申請人：NCC Nano, LLC
主分類號：C23C18/14
所在地：TX Dallas
A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent ar...
專利號：US14481273
申請人：Inktec Co., Ltd.
主分類號：H05K3/12
所在地：Ansan-si, Kyeongki-do
The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive...
專利號：US14524318
申請人：NITTO DENKO CORPORATION
主分類號：H05K3/10
所在地：Osaka
A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal suppor...
專利號：US14978264
申請人：Intel Corporation
主分類號：H05K1/00
所在地：CA Santa Clara
A flexible integrated circuit that includes a first dielectric layer having a first section at one polarity and a second section at an opposing polari...
專利號：US14266723
申請人：Flextronics AP, LLC
主分類號：H05K1/14
所在地：CO Broomfield
An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more e...
專利號：US15503378
申請人：IMEC VZW; Universiteit Gent
主分類號：H05K1/09
所在地：Leuven
The present disclosure relates to a smart textile product and a method for manufacturing a smart textile product. The smart textile product is provide...
專利號：US14437824
申請人：Shenzhen China Star Optoelectronics Technology Co., Ltd.
主分類號：G02F1/1345
所在地：Shenzhen, Guangdong
The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold ...
專利號：US15031369
申請人：TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
主分類號：H01P3/08
所在地：Stockholm
A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged acro...
專利號：US15095581
申請人：Microsoft Technology Licensing, LLC
主分類號：H05K1/00
所在地：WA Redmond
In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide inte...
專利號：US15212485
申請人：APPLIED MATERIALS, INC.
主分類號：H05H1/46
所在地：CA Santa Clara
Methods and apparatus for plasma processing are provided herein. The method for controlling current ratio in a substrate processing chamber may includ...
專利號：US14246095
申請人：Cynthia A. Tozian Cool
主分類號：H05F3/02
所在地：MA Reading
The described devices, “grounded [ungrounded] stimulation devices” and “devices with [without] EMF removal”, assist in maintaining and/or restoring bo...
專利號：US15207124
申請人：LG INNOTEK CO., LTD.
主分類號：H05B37/02
所在地：Seoul
Disclosed are a lighting control method and a lighting control system. The lighting control apparatus makes communication with lighting devices, regis...
專利號：US15236799
申請人：IDS-IP Holdings, LLC
主分類號：H05B37/02
所在地：PR San Juan
The present invention relates to a system, method, and apparatus for powering intelligent lighting networks. The power for the intelligent lighting ne...
專利號：US14819949
申請人：Ford Global Technologies, LLC
主分類號：B60Q1/00
所在地：MI Dearborn
According to one aspect of the present invention, a light assembly of a vehicle is provided herein. The light assembly includes an array of light sour...
專利號：US15357996
申請人：Wilson Yu Sang Mak
主分類號：H05B37/02
所在地：Kwai Chung NT.
The present application relates to a method for controlling a lamp based on a switching action. By applying the present application, switching of a wo...
專利號：US14288063
申請人：EverDisplay Optronics (Shanghai) Limited
主分類號：H05B33/08
所在地：Shanghai
A pixel driving circuit includes a light-emitting working unit, a driving unit, a data signal input, a initial voltage input, a driving power input an...
專利號：US15297134
申請人：DXY Technology Co., Limited
主分類號：H05B37/02
所在地：Shenzhen
The present invention provides a control method for a smart light, comprising: displaying control information of connected smart lights as a first kin...
專利號：US15182704
申請人：Paul Palfreyman; Paul Jungwirth; Jane Wei Yang; Michael A. Tischler
主分類號：H05B37/00
所在地：Vancouver
In accordance with certain embodiments, lighting systems feature lightsheets including multiple illumination units or modules electrically interconnec...
專利號：US15263541
申請人：LG INNOTEK CO., LTD.
主分類號：F21V25/00
所在地：Seoul
A ballast stabilizer-compatible lamp including a leakage current protection circuit includes a first input stage configured to receive first external ...
專利號：US14186613
申請人：HiDeep Inc.
主分類號：H05B37/02
所在地：Seongnam-si, Gyeonggi-do
An LED lighting device using a ballast may be provided that includes: an LED unit which includes at least one LED device; a rectifier which rectifies ...
專利號：US14788822
申請人：Miele & Cie. KG
主分類號：H05B6/64
所在地：Guetersloh
A cooking appliance includes a cooking chamber with cooking chamber wall, a microwave heat source configured to heat food, and a support device config...
專利號：US13773872
申請人：Ebersp?cher catem GmbH & Co. KG
主分類號：H05B3/02
所在地：Herxheim
A heat generating element includes at least one PTC element, contact sheets flatly lying against the PTC element on either side, a housing which forms...
專利號：US14947344
申請人：Huawei Technologies Co., Ltd.
主分類號：H04W84/12
所在地：Shenzhen, Guangdong
Embodiments provide an information transmission method, a base station, user equipment, and a system, which relate to the field of information transmi...
專利號：US15397449
申請人：LG ELECTRONICS INC.
主分類號：H04W76/04
所在地：Seoul
A method for controlling uplink transmissions on discontinuous reception (DRX) operation, by a wireless device, in a wireless communication system, th...
專利號：US15476145
申請人：Verizon Patent and Licensing Inc.
主分類號：H04W76/04
所在地：VA Arlington
A base station may establish a radio resource control (RRC) connection with a first user device. The base station may determine a bearer attribute of ...
專利號：US14840511
申請人：Kabushiki Kaisha Toshiba
主分類號：H04W76/04
所在地：Minato-ku, Tokyo
A sensor data collecting device includes a first circuit and a controller. The controller has a first state and a second state and acquires data of on...
專利號：US15024818
申請人：NTT DOCOMO, INC.
主分類號：H04W76/02
所在地：Tokyo
A P-CSCF (310) includes a terminating call processing unit (311) which receives SIP INVITE from an S-CSCF. The SIP INVITE includes an identifier of UE...
專利號：US15408115
申請人：Huawei Technologies Co., Ltd.
主分類號：H04B7/00
所在地：Shenzhen, Guangdong
Embodiments of the present invention provide a short range communications method, device, and system, and relate to the field of communications, so th...
專利號：US14627503
申請人：QUALCOMM Incorporated
主分類號：H04W76/02
所在地：CA San Diego
The disclosure relates in some aspects to the establishment, discovery, and creation of virtual wireless communication networks. A device can create a...
專利號：US15044261
申請人：InterDigital Technology Corporation
主分類號：H04W72/12
所在地：DE Wilmington
A method and apparatus for accessing a contention-based uplink random access channel (RACH) in a single carrier frequency division multiple access (SC...
專利號：US14622166
申請人：Huawei Technologies Co., Ltd.
主分類號：H04W72/08
所在地：Shenzhen
Embodiments of the present invention provides a method, an apparatus, and a system for resource scheduling, related to the field of communications, co...
專利號：US14090373
申請人：EchoStar Technologies L.L.C.
主分類號：H04W72/08
所在地：CO Englewood
A system includes a server configured to monitor wireless interference between at least two media content delivery devices. The server coordinates com...
專利號：US15428658
申請人：NETWORK PERFORMANCE RESEARCH GROUP LLC
主分類號：H04W4/02
所在地：CA Campbell
The present invention relates to wireless networks and more specifically directed to providing or acquiring an exemplary country code identifier or re...
專利號：US14691260
申請人：CISCO TECHNOLOGY, INC.
主分類號：H04W72/04
所在地：CA San Jose
A method is provided in one example embodiment and may include determining one or more uplink inter cell interference coordination (ICIC) parameters f...
專利號：US15086053
申請人：Industrial Technology Research Institute
主分類號：H04W72/04
所在地：Hsinchu
A method for scheduling a pilot signal, a control node and a wireless device are proposed. The control node manages an i-th cell among N cells of a ne...