專(zhuān)利號(hào)：US14412913
申請(qǐng)人：SIEMENS AKTIENGESELLSCHAFT
主分類(lèi)號(hào)：G06F19/00
所在地：München
A fitting system is provided that includes a plurality of fitting lines for fitting printed circuit boards with electronic components. A method for al...
專(zhuān)利號(hào)：US15231121
申請(qǐng)人：Mitsubishi Electric Corporation
主分類(lèi)號(hào)：H05K7/20
所在地：Tokyo
Provided is a semiconductor device having a small footprint, where the semiconductor device includes multiple power modules and a cooling structure fo...
專(zhuān)利號(hào)：US15389327
申請(qǐng)人：Amazon Technologies, Inc.
主分類(lèi)號(hào)：H05K7/20
所在地：WA Seattle
A data center may include a tape library rack module along with rack computer systems. The rack computer systems may be configured to provide computin...
專(zhuān)利號(hào)：US15296177
申請(qǐng)人：Accedian Networks Inc.
主分類(lèi)號(hào)：H05K7/20
所在地：Saint-Laurent
An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the el...
專(zhuān)利號(hào)：US14871282
申請(qǐng)人：Dot Hill Systems Corporation
主分類(lèi)號(hào)：G06F1/16
所在地：CO Longmont
A self-biasing storage device sled for mounting a storage device within a chassis is provided. The self-biasing storage device sled includes a bezel, ...
專(zhuān)利號(hào)：US15097613
申請(qǐng)人：INVENTEC TECHNOLOGY CO., LTD; INVENTEC CORPORATION
主分類(lèi)號(hào)：H05K7/20
所在地：Minhang District, Shanghai
The invention provides an electronic device. By reasonably and tidily arranging modules such as a mainboard, a fan module, a power supply module and a...
專(zhuān)利號(hào)：US14295854
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類(lèi)號(hào)：H03K17/94
所在地：Gyeonggi-do
A protecting cover for an electronic device is provided, the protecting cover including a front cover portion positioned on a front surface of the ele...
專(zhuān)利號(hào)：US15420874
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類(lèi)號(hào)：H01R11/00
所在地：Suwon-si
A connector apparatus a display apparatus including the connector are provided. The connector apparatus includes: a pair of connectors configured to b...
專(zhuān)利號(hào)：US15163093
申請(qǐng)人：Denso Corporation
主分類(lèi)號(hào)：H05K7/14
所在地：Kariya, Aichi-pref.
A power converter includes a case body provided with a device main body part having a power conversion part accommodated therein, a lid member coverin...
專(zhuān)利號(hào)：US15193301
申請(qǐng)人：ILLINOIS TOOL WORKS INC.
主分類(lèi)號(hào)：H01L23/36
所在地：IL Glenview
A rectifier module comprises a conductive housing made of injection molded aluminum or aluminum alloy. Diodes are inserted into recesses formed in the...
專(zhuān)利號(hào)：US15240723
申請(qǐng)人：Eaton Corporation
主分類(lèi)號(hào)：H02B1/38
所在地：OH Cleveland
Motor control centers have units or bucket assemblies with a front panel configured to pivot about a long axis associated with a bottom long side ther...
專(zhuān)利號(hào)：US14842338
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類(lèi)號(hào)：H05K1/00
所在地：Yongin, Gyeonggi-Do
A display device including a flexible substrate that includes a display part to display an image; a driving integrated chip (IC) that supplies a drivi...
專(zhuān)利號(hào)：US14794956
申請(qǐng)人：IBIDEN CO., LTD.
主分類(lèi)號(hào)：H05K3/00
所在地：Ogaki-shi
A method for manufacturing a wiring board includes preparing a core structure, forming on a first surface of the core structure a first buildup struct...
專(zhuān)利號(hào)：US14639789
申請(qǐng)人：Invensas Corporation
主分類(lèi)號(hào)：H05K3/10
所在地：CA San Jose
In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The...
專(zhuān)利號(hào)：US14229476
申請(qǐng)人：INTEL CORPORATION
主分類(lèi)號(hào)：H05K1/18
所在地：CA Santa Clara
Passive electrical devices are described with a polymer carrier. In one example, a conductive layer is formed over a polymer substrate in a pattern to...
專(zhuān)利號(hào)：US15413714
申請(qǐng)人：FUJITSU LIMITED
主分類(lèi)號(hào)：H05K1/00
所在地：Kawasaki-shi, Kanagawa
An electronic device includes: a wiring substrate;a plurality of components having different heights mounted on one surface of the wiring substrate; a...
專(zhuān)利號(hào)：US15399664
申請(qǐng)人：Micron Technology, Inc.
主分類(lèi)號(hào)：H05K7/00
所在地：ID Boise
Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a fi...
專(zhuān)利號(hào)：US14641316
申請(qǐng)人：Apple Inc.
主分類(lèi)號(hào)：H01R12/00
所在地：CA Cupertino
Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic d...
專(zhuān)利號(hào)：US14068655
申請(qǐng)人：International Business Machines Corporation
主分類(lèi)號(hào)：H05K1/03
所在地：NY Armonk
An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable ...
專(zhuān)利號(hào)：US13758843
申請(qǐng)人：Crane Electronics, Inc.
主分類(lèi)號(hào)：H05K1/18
所在地：WA Redmond
A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stack...
專(zhuān)利號(hào)：US14989921
申請(qǐng)人：SK hynix Inc.
主分類(lèi)號(hào)：H05K1/11
所在地：Icheon-si, Gyeonggi-do
A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a fi...
專(zhuān)利號(hào)：US15261080
申請(qǐng)人：Infineon Technologies AG
主分類(lèi)號(hào)：H02M7/00
所在地：Neubiberg
An electronics assembly includes a plurality of first semiconductor chips each having a first load terminal and a second load terminal, a conductor st...
專(zhuān)利號(hào)：US15325550
申請(qǐng)人：Siemens Aktiengesellschaft
主分類(lèi)號(hào)：H05K1/02
所在地：Munich
A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The h...
專(zhuān)利號(hào)：US13152419
申請(qǐng)人：Akira Harao; Mototatsu Matsunaga; Yasuhiro Sugiura; Minoru Kubota
主分類(lèi)號(hào)：H05K1/03
所在地：Makinohara
A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface ...
專(zhuān)利號(hào)：US13716734
申請(qǐng)人：FUJI ENGINEERING CO., LTD.; FUJIGIKEN CO., LTD.; WEST NIPPON EXPRESSWAY COMPANY LIMITED
主分類(lèi)號(hào)：B23K10/00
所在地：Osaka
A plasma spraying apparatus includes a cathode, a first gas nozzle surrounding a head of the cathode therewith to form a first gas path outside of the...
專(zhuān)利號(hào)：US13693241
申請(qǐng)人：Magnachip Semiconductor, Ltd.
主分類(lèi)號(hào)：H05B37/03
所在地：Cheongju-si
A detection circuit configured to detect a short in a plurality of LED arrays is provided. The detection circuit includes a voltage measuring unit, a ...
專(zhuān)利號(hào)：US15296032
申請(qǐng)人：Michael Wein
主分類(lèi)號(hào)：H05B37/02
所在地：TX Houston
A wearable accessory having an embedded processor in a substrate for creating a synchronously presented lighting effect at a controlled access venue a...
專(zhuān)利號(hào)：US14869909
申請(qǐng)人：ABL IP Holding LLC
主分類(lèi)號(hào)：H05B37/02
所在地：GA Atlanta
A lighting system for and method of commissioning LED light fixtures is disclosed. The LED light fixtures include a controller unit that is programmed...
專(zhuān)利號(hào)：US14619818
申請(qǐng)人：AmTRAN Technology Co., Ltd.
主分類(lèi)號(hào)：G09G3/32
所在地：New Taipei
A circuit of light-emitting elements connected between two power terminals is disclosed in the present disclosure. The circuit of light-emitting eleme...
專(zhuān)利號(hào)：US15355230
申請(qǐng)人：Lutron Electronics Co., Inc.
主分類(lèi)號(hào)：H05B37/02
所在地：PA Coopersburg
A method for controlling an amount of power delivered to an electrical load may include controlling an average magnitude of a load current towards a t...
專(zhuān)利號(hào)：US14818540
申請(qǐng)人：HOLDIP Limited
主分類(lèi)號(hào)：H05B37/02
所在地：Douglas
A power adaptor (20) is provided, comprising an input (22) for connection to an AC power supply, and a resonant circuit (34) coupled to the input (22)...
專(zhuān)利號(hào)：US14798060
申請(qǐng)人：Bernard Fryshman
主分類(lèi)號(hào)：H05B6/12
所在地：NY Brooklyn
An induction stove and induction cookware are disclosed herein. The induction stove includes a first arm, a second arm, and a third arm together formi...
專(zhuān)利號(hào)：US11884313
申請(qǐng)人：Yoshiaki Hirota
主分類(lèi)號(hào)：H05B6/10
所在地：Futtsu
An induction heating apparatus for heating a traveling metal plate includes an induction coil for surrounding the metal plate. The induction coil incl...
專(zhuān)利號(hào)：US14634711
申請(qǐng)人：APPLIED MATERIALS, INC.
主分類(lèi)號(hào)：H05B3/26
所在地：CA Santa Clara
Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a body having a support surface; and a fir...
專(zhuān)利號(hào)：US14155050
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類(lèi)號(hào)：A21B1/22
所在地：Hsin-Chu
Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for process...
專(zhuān)利號(hào)：US14813261
申請(qǐng)人：EDWARDS VACUUM LLC
主分類(lèi)號(hào)：H05B1/02
所在地：NY Sanbom
A process equipment heating system has a group of electric heaters and a heater checking system. The heater checking system is configured to determine...
專(zhuān)利號(hào)：US14697753
申請(qǐng)人：BROADCOM CORPORATION
主分類(lèi)號(hào)：H04W88/10
所在地：CA Irvine
Dual band wireless local area network (WLAN) transceiver. A wireless communication device includes at least two different transceivers (or radios) the...
專(zhuān)利號(hào)：US15408034
申請(qǐng)人：CommScope Technologies LLC
主分類(lèi)號(hào)：G02B6/36
所在地：NC Hickory
A cell site includes a tower, a multi-service terminal mounted to the tower and a base transceiver station in communication with the multi-service ter...
專(zhuān)利號(hào)：US14834256
申請(qǐng)人：InterDigital Patent Holdings, Inc.
主分類(lèi)號(hào)：H04W76/06
所在地：DE Wilmington
A method and apparatus are disclosed for multi cell wireless communication, wherein a status of a secondary serving cell is determined. On the conditi...
專(zhuān)利號(hào)：US14791520
申請(qǐng)人：Apple Inc.
主分類(lèi)號(hào)：H04W76/06
所在地：CA Cupertino
A method includes a wireless mobile device communicating with a wireless network via an evolved high rate packet data (eHRPD) interface. The wireless ...
專(zhuān)利號(hào)：US14666929
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類(lèi)號(hào)：H04W4/00
所在地：Suwon-si, Gyeonggi-do
A method and an apparatus for monitoring device-to-device (D2D) transmission in a connected state in a communication system supportive of a D2D scheme...
專(zhuān)利號(hào)：US15203682
申請(qǐng)人：Keyssa Systems, Inc.
主分類(lèi)號(hào)：H04B5/00
所在地：CA Campbell
Methods, systems, and apparatus for EM communications. One of the apparatus includes a first device comprising: a first contactless connector and a se...
專(zhuān)利號(hào)：US14877314
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類(lèi)號(hào)：H04W76/02
所在地：Suwon-si, Gyeonggi-do
A random access method and an apparatus of a terminal for performing random access procedure to multiple base stations in parallel in a Long Term Evol...
專(zhuān)利號(hào)：US14733262
申請(qǐng)人：Nokia Solutions and Networks Oy
主分類(lèi)號(hào)：H04W76/02
所在地：Espoo
In a communication system where a primary cell is controlled by a first base station and a secondary cell is controlled by a second, different base st...
專(zhuān)利號(hào)：US14209988
申請(qǐng)人：Keyssa, Inc.
主分類(lèi)號(hào)：H04B7/00
Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless commun...
專(zhuān)利號(hào)：US15314765
申請(qǐng)人：LG ELECTRONICS INC.
主分類(lèi)號(hào)：H04W76/02
所在地：Seoul
The present invention is related to a method and an apparatus for avoiding collision in a Bluetooth reconnection procedure. A method and an apparatus ...
專(zhuān)利號(hào)：US14985669
申請(qǐng)人：InterDigital Patent Holdings, Inc.
主分類(lèi)號(hào)：H04W4/00
所在地：DE Wilmington
A method for fast initial link setup (FILS) for use in a wireless station, is disclosed. The method comprises receiving a FILS discovery (FD) frame fr...
專(zhuān)利號(hào)：US15017523
申請(qǐng)人：Apple Inc.
主分類(lèi)號(hào)：H04W76/02
所在地：CA Cupertino
The embodiments set forth herein disclose techniques for enabling a user device to seamlessly establish a secure, high-bandwidth wireless connection w...
專(zhuān)利號(hào)：US14606769
申請(qǐng)人：Brother Kogyo Kabushiki Kaisha
主分類(lèi)號(hào)：H04W76/02
所在地：Nagoya-shi, Aichi-ken
A wireless communication device may form a wireless network in which the wireless communication device operates as a master station, terminate a wirel...
專(zhuān)利號(hào)：US14953774
申請(qǐng)人：Comcast Cable Communications, LLC
主分類(lèi)號(hào)：H04W74/08
所在地：PA Philadelphia
Control message(s) are transmitted to a wireless device. The control message(s) comprise configuration parameters of cells comprising secondary cells,...