專利號(hào)：US14977687
申請(qǐng)人：Rockwell Automation Technologies, Inc.
主分類號(hào)：H01R43/00
所在地：OH Mayfield Heights
Industrial motor control apparatus and techniques are presented for mitigating incident energy associated with an internal arcing. Interior enclosure ...
專利號(hào)：US15432708
申請(qǐng)人：ANDAQ TECHNOLOGY CO., LTD.
主分類號(hào)：H05K9/00
所在地：Taipei
An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulat...
專利號(hào)：US15284437
申請(qǐng)人：Amazon Technologies, Inc.
主分類號(hào)：H05K7/20
所在地：WA Seattle
A system for removing heat from electrical systems includes a dehumidification device including a desiccant, an evaporative cooling device, air moving...
專利號(hào)：US15064118
申請(qǐng)人：FUJITSU LIMITED
主分類號(hào)：H05K7/20
所在地：Kawasaki-shi, Kanagawa
An air-conditioning apparatus is an air-conditioning apparatus, for an air-conditioning target space in which a rack including a device as a heat-prod...
專利號(hào)：US15256436
申請(qǐng)人：Amazon Technologies, Inc.
主分類號(hào)：H05K7/20
所在地：WA Seattle
A data center can include an inflatable enclosure in which rack computer systems can be installed and can provide computing capacity. The inflatable e...
專利號(hào)：US15811587
申請(qǐng)人：Amazon Technologies, Inc.
主分類號(hào)：H05K7/20
所在地：WA Seattle
A computer system includes a chassis, one or more hard disk drives coupled to the chassis, and one or more air passages under at least one of the hard...
專利號(hào)：US15280567
申請(qǐng)人：Enphase Energy, Inc.
主分類號(hào)：H05K7/20
所在地：CA Petaluma
An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclo...
專利號(hào)：US14656599
申請(qǐng)人：International Business Machines Corporation
主分類號(hào)：H05K7/20
所在地：NY Armonk
An apparatus for minimizing the volume of coolant leaked in liquid cooled electronic equipment, the apparatus including a server rack, a plurality of ...
專利號(hào)：US15565198
申請(qǐng)人：Mitsubishi Electric Corporation
主分類號(hào)：H05K7/20
所在地：Chiyoda-ku
An electronic device includes a sealable housing, constituent surfaces of which are configured by a conductor, a plurality of heat generating componen...
專利號(hào)：US15636938
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H05K7/16
所在地：Suwon-si
A display apparatus which enables a display to rotate with a tilting angle across a large range is provided. This allows a user to, conveniently use t...
專利號(hào)：US15925378
申請(qǐng)人：Nanolumens Acquisition, Inc.
主分類號(hào)：H05K5/00
所在地：GA Norcross
A retractable display configured as a plurality of interlinked display subassemblies or panels, a transport box having a lid configured to enclose the...
專利號(hào)：US15127928
申請(qǐng)人：JOLED INC.
主分類號(hào)：G02F1/1333
所在地：Tokyo
An image display apparatus includes: a display unit which includes a display panel that displays an image on a front face, and a chassis disposed on a...
專利號(hào)：US14388400
申請(qǐng)人：I Lin Tseng; Tzu Chun Chen
主分類號(hào)：H01K3/10
所在地：Taichung
A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, an...
專利號(hào)：US15276759
申請(qǐng)人：Yaron Cohen
主分類號(hào)：B23P19/00
所在地：Netivot
An apparatus for assembling a LED lighting fixture contains a power cable, an elongated coupler, a base plate, a protruding terminal, a receiving term...
專利號(hào)：US14886607
申請(qǐng)人：Murata Manufacturing Co., Ltd.
主分類號(hào)：H05K3/32
所在地：Kyoto
A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a p...
專利號(hào)：US15056291
申請(qǐng)人：Apple Inc.
主分類號(hào)：H05K7/10
所在地：CA Cupertino
Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating contai...
專利號(hào)：US15252247
申請(qǐng)人：Unimicron Technology Corp.
主分類號(hào)：H05K3/00
所在地：Taoyuan
A manufacturing method of a circuit board and a piezochromic stamp are provided. A circuit pattern is formed on a dielectric substrate. A dielectric l...
專利號(hào)：US15238151
申請(qǐng)人：Coilcraft, Incorporated
主分類號(hào)：H05K1/18
所在地：IL Cary
An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at l...
專利號(hào)：US14983594
申請(qǐng)人：Industrial Technology Research Institute
主分類號(hào)：H05K1/02
所在地：Hsinchu
A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. T...
專利號(hào)：US15871585
申請(qǐng)人：Apple Inc.
主分類號(hào)：H05K1/00
所在地：CA Cupertino
Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation comp...
專利號(hào)：US14792284
申請(qǐng)人：SCHREINER GROUP GMBH & CO. KG
主分類號(hào)：H05K1/02
所在地：Oberschleissheim
A sensor device for integration in an electrical circuit, including a support layer (12′), which is formed with a release layer; at least one flexible...
專利號(hào)：US15491430
申請(qǐng)人：3M INNOVATIVE PROPERTIES COMPANY
主分類號(hào)：H05K1/09
所在地：MN St. Paul
The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern is disposed on the f...
專利號(hào)：US15275785
申請(qǐng)人：Applied Optoelectronics, Inc.
主分類號(hào)：H05K1/02
所在地：TX Sugar Land
A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a therm...
專利號(hào)：US15217057
申請(qǐng)人：Hanon Systems
主分類號(hào)：H05K1/02
所在地：Daejeon
An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within...
專利號(hào)：US15753146
申請(qǐng)人：ISHIDA CO., LTD.; JOB CORPORATION
主分類號(hào)：G01N23/04
所在地：Kyoto-shi, Kyoto
An inspection sorting apparatus includes an X-ray tube with an anode electrode and a cathode electrode, a tank housing the X-ray tube and having insul...
專利號(hào)：US15313982
申請(qǐng)人：Hitachi, Ltd.
主分類號(hào)：H05G1/26
所在地：Chiyoda-ku, Tokyo
A learning unit in learning mode generates a cluster from a cluster analysis of data formed from frequency constituent data and state data, obtained f...
專利號(hào)：US14330231
申請(qǐng)人：Orion Energy Systems, Inc.
主分類號(hào)：H05B41/38
所在地：WI Manitowoc
A lighting fixture system for lamps includes one or more lamps and one or more ballasts configured to provide controlled power to the one or more lamp...
專利號(hào)：US15518708
申請(qǐng)人：PHILIPS LIGHTING HOLDING B.V.
主分類號(hào)：H05B37/02
所在地：Eindhoven
Inventive methods and apparatus for management of outdoor lighting networks. In particular, methods and apparatus are provided that enable the operati...
專利號(hào)：US14753269
申請(qǐng)人：ELDOLAB HOLDING B.V.
主分類號(hào)：H05B37/02
所在地：Son en Breugel
A control unit for controlling an illumination parameter of one or more light sources of a plurality of light sources is described. The control unit b...
專利號(hào)：US15382575
申請(qǐng)人：David Bowers; Thomas Poliquin; Dustin Cochran; Matthew D. Weaver; Jay Hurley; James Kingman; Bryant Grigsby; Sanjoy Ghose
主分類號(hào)：H05B37/02
所在地：CA San Jose
Various embodiments relate to systems and methods for controlling one or more LED-based lighting sources that are coupled to a logic module by a ribbo...
專利號(hào)：US14244141
申請(qǐng)人：Ford Global Technologies, LLC
主分類號(hào)：B60Q3/82
所在地：MI Dearborn
A light bar is provided and includes an elongated carrier having a surface extending along the carrier. Capacitive sensors are spaced along the carrie...
專利號(hào)：US15703300
申請(qǐng)人：Lutron Electronics Co., Inc.
主分類號(hào)：H05B33/08
所在地：PA Coopersburg
A load control device for regulating an average magnitude of a load current conducted through an electrical load may operate in different modes. The l...
專利號(hào)：US15153901
申請(qǐng)人：WHIRLPOOL CORPORATION
主分類號(hào)：H05B6/12
所在地：MI Benton Harbor
An induction cooking heater including an inductor having a number of magnetic field concentration bars located beneath the inductor. The inductor havi...
專利號(hào)：US15589490
申請(qǐng)人：NuWave, LLC
主分類號(hào)：H05B1/02
所在地：IL Libertyville
A system and method for induction cooking using an induction cooking unit, an interface adapted to receive, store, and execute a plurality of instruct...
專利號(hào)：US15169833
申請(qǐng)人：Eberspacher catem GmbH & Co. KG
主分類號(hào)：H05B3/08
所在地：Herxheim
An electric heating device including a heater housing in which a partition separates a circulation chamber, through which a medium to be heated can fl...
專利號(hào)：US15327384
申請(qǐng)人：Deutsche Telekom AG
主分類號(hào)：H04W36/00
所在地：Bonn
A method for improved communication between network nodes of a mobile communication network includes: establishing a communication interface between f...
專利號(hào)：US15472895
申請(qǐng)人：HUAWEI TECHNOLOGIES CO., LTD.
主分類號(hào)：H04W76/28
所在地：Shenzhen
Embodiments of the present invention disclose a data transmission method and a terminal. The method includes: detecting, by a terminal in an idle stat...
專利號(hào)：US15152278
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H04W76/02
所在地：CA San Diego
A UE may receive, via a first communication link that uses a first radio access technology (RAT), information that identifies a threshold associated w...
專利號(hào)：US15371865
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H04W76/14
所在地：CA San Diego
Certain aspects of the present disclosure relate to methods and apparatus for wireless communication, and more specifically to opportunistic wide area...
專利號(hào)：US15226543
申請(qǐng)人：FUJI XEROX CO., LTD.
主分類號(hào)：H04W76/10
所在地：Tokyo
An information processing apparatus includes a connection information obtainer, an identification information obtainer, and a controller. The connecti...
專利號(hào)：US15352155
申請(qǐng)人：Institute For Information Industry
主分類號(hào)：H04W74/08
所在地：Taipei
A wireless device, a base station, a random access method and a preamble configuration method are provided. The mobile communication system defines a ...
專利號(hào)：US15108857
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：H04W74/08
所在地：Seoul
One embodiment of the present specification provides a method for performing a random access procedure for coverage enhancement. The method can compri...
專利號(hào)：US15027219
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：H04W74/08
所在地：Seoul
The present invention relates to a wireless communication system. More specifically, disclosed are an operation method and apparatus using a sectorize...
專利號(hào)：US15713536
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H04W72/12
所在地：CA San Diego
A control resource region of an New Radio system slot structure may be separated into control resource sets, only some of which may be used for contro...
專利號(hào)：US14886704
申請(qǐng)人：CoCo Communications Corp.
主分類號(hào)：H04B7/00
所在地：WA Seattle
A facility for performing employing multiple frequencies in a secure distributed hierarchical convergence network is described. The facility receives ...
專利號(hào)：US15021295
申請(qǐng)人：SoftBank Corp.
主分類號(hào)：H04W52/24
所在地：Tokyo
A base station apparatus of small-cell base station is provided, by which interference from a small-cell in downlink signals of macro cell can be supp...
專利號(hào)：US15636254
申請(qǐng)人：Huawei Technologies Co., Ltd.
主分類號(hào)：H04W72/04
所在地：Shenzhen
A method and an apparatus for aligning antenna beams in a high-low frequency co-site network, where the method includes performing antenna alignment o...
專利號(hào)：US15040907
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H04W72/04
所在地：CA San Diego
Aspects of the present disclosure provide techniques for wireless communications by a user equipment (UE). An exemplary method, performed by a UE, gen...
專利號(hào)：US14710165
申請(qǐng)人：Telefonaktiebolaget L M Ericsson (publ)
主分類號(hào)：H04L12/835
所在地：Stockholm
In one example embodiment, a method for allocating resources for device-to-device communications in a wireless communications network includes receivi...
專利號(hào)：US15345540
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H04W72/04
所在地：CA San Diego
Certain aspects of the present disclosure relate to methods and apparatus for uplink grant design for Narrow-Band Internet of Things (NB-IoT). A metho...