專利號：US17525079
申請人：Winbond Electronics Corp.
主分類號：H10N70/00
所在地：Taichung
A semiconductor structure includes a substrate, a first electrode, a vacancy supply layer, a sidewall barrier layer, an oxygen reservoir layer, a resi...
專利號：US17335817
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H10N50/80
所在地：Hsinchu
A method for fabricating a magnetic tunneling junction (MTJ) structure is described. A first dielectric layer is deposited on a bottom electrode and p...
專利號：US17135637
申請人：Taiwan Semiconductor Manufacturing Co., Ltd.
主分類號：H10N50/10
所在地：Hsinchu
An exemplary method that forms spacer stacks with metallic compound layers is disclosed. The method includes forming magnetic tunnel junction (MTJ) st...
專利號：US16923770
申請人：Murata Manufacturing Co., Ltd.
主分類號：H10N30/30
所在地：Nagaokakyo
A piezoelectric device that includes a film that has a first main surface and a second main surface, and has piezoelectricity; a first substrate; and ...
專利號：US17346292
申請人：SKYWORKS SOLUTIONS, INC.
主分類號：H10N30/071
所在地：CA Irvine
Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to re...
專利號：US17979783
申請人：VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
主分類號：H10N30/067
所在地：Singapore
A method of forming a microphone device includes: forming a through-hole in a substrate wafer; providing a second wafer; bonding the second wafer to t...
專利號：US18310623
申請人：DUK SAN NEOLUX CO., LTD.
主分類號：C07D251/24
所在地：Cheonan-si
Provided are a novel compound capable of improving the light-emitting efficiency, stability, and lifespan of an element; an organic electronic element...
專利號：US16762146
申請人：WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
主分類號：C07D239/26
所在地：Wuhan
An N heterocyclic planar photocoupler output material is provided, and includes a structural formula as follows: R1—R2—R1. The N heterocyclic planar p...
專利號：US16732136
申請人：WUHAN TIANMA MICROELECTRONICS CO., LTD.; WUHAN TIANMA MICROELECTRONICS CO., LTD. SHANGHAI BRANCH
主分類號：H10K85/60
所在地：Wuhan
A compound having a D-(π)-σ-(π)-A chemical structure and improving brightness and efficiency of light-emitting is described. In an embodiment, the com...
專利號：US17089707
申請人：Samsung Display Co., Ltd.
主分類號：H01L27/32
所在地：Yongin-si
A display apparatus includes: a first pixel, a second pixel, and a third pixel respectively configured to emit different colors; a first partition wal...
專利號：US17220349
申請人：SHARP KABUSHIKI KAISHA
主分類號：H10K59/35
所在地：Sakai
A light emitting structure comprises a substrate, a sub-pixel stack over a surface of the substrate, a bank surrounding the sub-pixel stack and formin...
專利號：US16957378
申請人：Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
主分類號：H10K59/131
所在地：Wuhan
The present disclosure provides a display panel including a display area, a ring-shaped wiring area, and a light-transmitting area. The display panel ...
專利號：US17694393
申請人：SAMSUNG DISPLAY CO., LTD.
主分類號：H10K59/131
所在地：Yongin-si
A display apparatus includes a substrate having a bending region between a first region and a second region, the bending region being configured to be...
專利號：US17297665
申請人：Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.
主分類號：G09G3/00
所在地：Chengdu
Disclosed are a display panel and a display device. The display panel includes: at least one group of gate driving signal lines, the gate driving sign...
專利號：US17644056
申請人：HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H01L23/00
所在地：Anhui
A display substrate, a manufacturing method thereof, and a display device. The method includes: forming a pixel definition layer transitional pattern ...
專利號：US17317811
申請人：LG Display Co., Ltd.
主分類號：H01L27/32
所在地：Seoul
The present disclosure relates to a flexible display device including: a substrate over which a thin film transistor is disposed, an intermediate laye...
專利號：US17100521
申請人：Samsung Display Co., Ltd.
主分類號：G09G3/32
所在地：Yongin-si
Provided is a display apparatus having improved image quality and high resolution, and including a first pixel, a second pixel, and a third pixel spac...
專利號：US17987910
申請人：Universal Display Corporation
主分類號：H01L21/00
所在地：NJ Ewing
A transparent emissive device is provided. The device may include one or more OLEDs having an anode, a cathode, and an organic emissive layer disposed...
專利號：US17444276
申請人：Samsung Display Co., Ltd.
主分類號：H01L21/00
所在地：Yongin-si
A display device includes: a substrate including a first display area, a second display area, and a third display area which are arranged along a row ...
專利號：US17827385
申請人：BOE Technology Group Co., Ltd.
主分類號：H10K50/844
所在地：Beijing
The present disclosure is related to a display substrate. The display substrate may include a base substrate, a display structure on a display area of...
專利號：US17353378
申請人：Samsung Display Co., Ltd.
主分類號：H01L27/12
所在地：Yongin-si
A display apparatus includes a first barrier layer including a first display area, a second display area including transmission areas, and a non-displ...
專利號：US17243003
申請人：Samsung Display Co., Ltd.
主分類號：H01L51/52
所在地：Yongin-si
A display device includes: a substrate including an opening area, a peripheral area surrounding the opening area, and a display area surrounding the p...
專利號：US17337361
申請人：XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
主分類號：H01L33/42
所在地：Xiamen
A method of manufacturing a flip-chip light emitting diode includes: providing a transparent substrate and a temporary substrate, and bonding the tran...
專利號：US16859763
申請人：Samsung Display Co., Ltd.
主分類號：H10K50/11
所在地：Yongin-si
An organic light-emitting device includes: a first electrode; a second electrode; and an organic layer between the first electrode and the second elec...
專利號：US16487023
申請人：Epishine AB
主分類號：H01L51/44
所在地：Norrk?ping
The present invention relates to a method for laminating solar cell modules comprising a plurality of solar cells electrically connected in series. Th...
專利號：US17748601
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H01L21/02
所在地：Hsin-Chu
Some embodiments relate to a method for forming a memory device. The method includes forming a lower dielectric layer over a conductive wire. A stack ...
專利號：US17574010
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H01L21/02
所在地：Hsin-Chu
In some embodiments, the present disclosure relates to a method of forming an integrated chip including forming a ferroelectric layer over a bottom el...
專利號：US17153740
申請人：Micron Technology, Inc.
主分類號：H10B43/35
所在地：ID Boise
A method of forming a microelectronic device includes forming a microelectronic device structure. The microelectronic device structure includes a stac...
專利號：US17190717
申請人：Kioxia Corporation
主分類號：H10B43/20
所在地：Tokyo
According to one embodiment, a semiconductor storage device includes: a plurality of first wiring layers stacked in a first direction; a first memory ...
專利號：US17340073
申請人：Winbond Electronics Corp.
主分類號：H10B12/00
所在地：Taichung
Provided are a semiconductor memory device with guard pillars and a manufacturing method thereof. The semiconductor memory device includes a substrate...
專利號：US17364281
申請人：Micron Technology, Inc.
主分類號：H10B12/00
所在地：ID Boise
A method of forming a microelectronic device comprises forming a first microelectronic device structure comprising a first semiconductor structure, a ...
專利號：US17364154
申請人：Micron Technology, Inc.
主分類號：H10B12/00
所在地：ID Boise
A method used in forming memory circuitry comprises forming transistors individually comprising one source/drain region and another source/drain regio...
專利號：US17376350
申請人：Samsung Display Co., LTD.
主分類號：H05K5/00
所在地：Yongin-si
A display device includes a flexible display portion, a case which accommodates the display portion, and a blocking layer which is disposed between th...
專利號：US17263062
申請人：Fuji Polymer Industries Co., Ltd.
主分類號：H05K9/00
所在地：Nagoya
An electromagnetic wave absorbing thermally conductive composition contains a matrix resin component, metal soft magnetic particles, and thermally con...
專利號：US17266830
申請人：ABB Schweiz AG
主分類號：H05K7/20
所在地：Baden
A method of controlling the cooling of servers in a data center including a plurality of server racks each including a plurality of servers, the cooli...
專利號：US17484079
申請人：BAIDU USA LLC
主分類號：H05K7/20
所在地：CA Sunnyvale
In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liqui...
專利號：US18092386
申請人：CHATSWORTH PRODUCTS, INC.
主分類號：G06F1/16
所在地：CA Simi Valley
An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one ...
專利號：US17380314
申請人：Dell Products L.P.
主分類號：H05K7/20
所在地：TX Round Rock
A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an en...
專利號：US17180277
申請人：CyberSecure IPS, LLC
主分類號：H05K7/14
所在地：MD Prince Frederick
In certain embodiments, cable patching may be facilitated. For example, identifiers corresponding to available ports for devices or objects within rac...
專利號：US17243852
申請人：Panduit Corp.
主分類號：H05K7/00
所在地：IL Tinley Park
A data center cabinet has a base frame and a top cap attached to the base frame. The top cap has a main panel having a front edge, rear edge, first si...
專利號：US17227043
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H05K5/02
所在地：Suwon-si
A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connecte...
專利號：US17362401
申請人：SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
主分類號：H01F5/00
所在地：Koka
A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surf...
專利號：US17947397
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：G11C5/04
所在地：Suwon-si
A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at l...
專利號：US17368906
申請人：Samsung Electronics Co., Ltd.
主分類號：H05K1/02
所在地：Gyeonggi-do
An electronic device includes a housing including a first plate, a second plate, and a side member including a first conductive member and a second co...
專利號：US17496791
申請人：Unimicron Technology Corp.
主分類號：H05K1/02
所在地：Taoyuan
Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, a...
專利號：US17335591
申請人：Cisco Technology, Inc.
主分類號：H05K1/02
所在地：CA San Jose
A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed cir...
專利號：US17885358
申請人：VARIAN MEDICAL SYSTEMS, INC.
主分類號：A61N5/10
所在地：CA Palo Alto
A remote diagnostic monitoring of operating states for physical components of a particle accelerator system includes generating, by at least one proce...
專利號：US16329455
申請人：CINOGY GMBH
主分類號：H05H1/24
所在地：Duderstadt
The invention relates to an electrode arrangement for forming a dielectric barrier plasma discharge between an electrode (1) supplied with an AC high ...
專利號：US18161301
申請人：LuminAID Lab, LLC
主分類號：H05B47/00
所在地：NH Littleton
A solar-powered lamp is disclosed. The lamp includes a plurality of radiating extensions, each being formed from a plurality of flat panels that can f...
專利號：US17691200
申請人：Lutron Technology Company LLC
主分類號：H05B47/19
所在地：PA Coopersburg
A remote control device for controlling lighting devices may be configured to detect an excessive user interaction (e.g., a continued user interaction...