專利號：US16595912
申請人：Eugenus, Inc.
主分類號：H10N70/00
所在地：CA San Jose
The disclosed technology generally relates to a barrier layer comprising titanium silicon nitride, and more particularly to a barrier layer for nonvol...
專利號：US17416094
申請人：Northeastern University
主分類號：H10N70/20
所在地：MA Boston
2D heterostructures comprising Bi2Se3/MoS2, Bi2Se3/MoSe2, Bi2Se3/WS2, Bi2Se3/MoSe2. 2xS2x, or mixtures thereof in which oxygen is intercalated between...
專利號：US17645178
申請人：Lam Research Corporation
主分類號：H10N70/00
所在地：CA Fremont
Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve f...
專利號：US17296896
申請人：TDK CORPORATION
主分類號：H10N52/80
所在地：Tokyo
A spin-orbit torque magnetization rotational element includes: a first insulating layer with first and second openings; a first conductive portion for...
專利號：US17508819
申請人：BEIHANG UNIVERSITY
主分類號：G11C11/16
所在地：Beijing
The present disclosure provides a multi-bit memory cell, an analog-to-digital converter, a device and a method. The multi-bit memory cell comprises: a...
專利號：US17724920
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H10N50/80
所在地：Hsin-Chu
The present disclosure relates to an integrated circuit. The integrated circuit includes a an inter-layer dielectric (ILD) structure laterally surroun...
專利號：US17717518
申請人：Kioxia Corporation
主分類號：H10N50/80
所在地：Tokyo
A magnetic memory device includes a substrate; a first magnetoresistive effect element; and a second magnetoresistive effect element provided at a sid...
專利號：US17075255
申請人：Cirrus Logic International Semiconductor Ltd.
主分類號：H01L41/04
所在地：Edinburgh
The present disclosure relates to circuitry for driving a piezoelectric transducer. The circuitry may be implemented as an integrated circuit and comp...
專利號：US17241620
申請人：Taiwan Semiconductor Manufacturing Co., Ltd.
主分類號：H10N30/053
所在地：Hsin-Chu
In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an...
專利號：US16795230
申請人：SOLUS ADVANCED MATERIALS CO., LTD.
主分類號：H10K85/60
所在地：Iksan-si
Disclosed are a novel organic compound, and an organic electroluminescent element having improved characteristics, such as luminous efficiency, drivin...
專利號：US16898744
申請人：Samsung Electronics Co., Ltd.
主分類號：H10K85/30
所在地：Suwon-si
Provided are an organometallic compound represented by Formula 1, an organic light-emitting device including the organometallic compound, and a diagno...
專利號：US16535491
申請人：UDC IRELAND LIMITED
主分類號：H01L51/00
所在地：Dublin
The present invention relates to an electroluminescence device having high luminous efficiency (for example, external quantum efficiency) and high dur...
專利號：US17501271
申請人：L3Harris Technologies, Inc.
主分類號：H10K59/131
所在地：FL Melbourne
One embodiment illustrated herein includes an optical device. The optical device includes a stacked device, formed in a single semiconductor chip, con...
專利號：US17043358
申請人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H10K59/60
所在地：Beijing
The present disclosure relates to an organic light-emitting display substrate, manufacturing method thereof, and organic light-emitting display device...
專利號：US17628516
申請人：BOE Technology Group Co., Ltd.
主分類號：H10K59/38
所在地：Beijing
Provided are a display apparatus and a manufacturing method therefor, the display apparatus comprising: a plurality of mutually independent subpixel r...
專利號：US16339414
申請人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H10K59/38
所在地：Beijing
A display panel and a display device are provided, the display panel include a substrate, an EL display unit group and a filter layer. The EL display ...
專利號：US17545447
申請人：SAMSUNG DISPLAY CO., LTD.
主分類號：H01L21/00
所在地：Yongin-si
A display apparatus disposed on an object including a first surface having a first shape and a second surface having a second shape different from the...
專利號：US17203430
申請人：Wuhan Tianma Micro-Electronics Co., Ltd.; Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
主分類號：H01L21/00
所在地：Wuhan
A display panel, a display control method and a display device are provided. The display panel includes a display region and a non-display region, and...
專利號：US18113053
申請人：InnoLux Corporation
主分類號：H10K59/35
所在地：Miao-Li County
An electronic device includes a first electronic unit and a second electronic unit. The first electronic unit emits a blue light having a first spectr...
專利號：US17717194
申請人：Japan Display Inc.
主分類號：H10K50/844
所在地：Tokyo
The aim is to improve the bending resistance a display device. The display device in one embodiment includes a substrate including a first surface and...
專利號：US17358905
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H10K50/16
所在地：Suwon-si
Light emitting device, method of manufacturing the light emitting device, and display device including the light emitting device are disclosed. The li...
專利號：US17223952
申請人：Samsung Display Co., Ltd.
主分類號：H10K50/12
所在地：Yongin-si
A light-emitting device including a first electrode; a second electrode facing the first electrode; and interlayer arranged between the first electrod...
專利號：US17265013
申請人：SHARP KABUSHIKI KAISHA
主分類號：H01L51/50
所在地：Sakai
An electroluminescent element according to an aspect of the disclosure includes: a pair of a cathode electrode and an anode electrode; a light-emittin...
專利號：US17631566
申請人：Semiconductor Energy Laboratory Co., Ltd.
主分類號：G09G5/00
所在地：Kanagawa-ken
A novel functional panel that is highly convenient, useful, or reliable is provided. The functional panel includes a first element and a second elemen...
專利號：US17533115
申請人：Takaya Ito; Ryota Arai; Tomoya Hirano
主分類號：H10K39/10
所在地：Shizuoka
A photoelectric conversion module includes photoelectric conversion elements electrically coupled. The photoelectric conversion elements each sequenti...
專利號：US17231287
申請人：Universal Display Corporation
主分類號：H10K85/30
所在地：NJ Ewing
This invention discloses metal complexes containing a ligand comprising a carborane moiety. Organic electroluminescent devices comprising these metal ...
專利號：US17678429
申請人：KIOXIA CORPORATION
主分類號：H01L21/768
所在地：Tokyo
According to one embodiment, a semiconductor storage device includes a stacked body above a substrate. The stacked body includes a first stacked regio...
專利號：US17396609
申請人：Kepler Computing Inc.
主分類號：H01L21/00
所在地：CA San Francisco
Non lead-based perovskite ferroelectric devices for high density memory and logic applications and methods of fabrication are described. While various...
專利號：US17147897
申請人：Samsung Electronics Co., Ltd.
主分類號：H01L29/78
所在地：Suwon-si
A semiconductor device includes a substrate including a first region and a second region, a first gate stack on the first region and including a first...
專利號：US17746671
申請人：Micron Technology, Inc.
主分類號：H01L27/1157
所在地：ID Boise
Some embodiments include a memory array having a vertical stack of alternating insulative levels and wordline levels. Channel material extends along t...
專利號：US17533451
申請人：NANYA TECHNOLOGY CORPORATION
主分類號：H01L29/78
所在地：New Taipei
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a su...
專利號：US17484988
申請人：NANYA TECHNOLOGY CORPORATION
主分類號：H01L27/108
所在地：New Taipei
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a su...
專利號：US17505398
申請人：SK hynix Inc.
主分類號：H10B12/00
所在地：Gyeonggi-do
A semiconductor memory device includes: a peripheral circuit portion including an interconnection; first and second word line stacks that are spaced a...
專利號：US17455668
申請人：NANYA TECHNOLOGY CORPORATION
主分類號：H01L29/94
所在地：New Taipei
A method of fabricating the semiconductor device includes forming a bit line structure over a substrate, forming a spacer structure on a sidewall of t...
專利號：US16899148
申請人：Google LLC
主分類號：H05K7/20
所在地：CA Mountain View
The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includ...
專利號：US17210067
申請人：BAIDU USA LLC
主分類號：H05K7/20
所在地：CA Sunnyvale
A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structur...
專利號：US16723865
申請人：Intel Corporation
主分類號：H05K7/20
所在地：CA Santa Clara
Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid...
專利號：US17464504
申請人：QUANTA COMPUTER INC.
主分類號：H05K7/20
所在地：Taoyuan
A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a suppo...
專利號：US17903547
申請人：Nvidia Corporation
主分類號：H05K7/14
所在地：CA Santa Clara
Systems and methods for datacenter are disclosed. In at least one embodiment, a system or method herein causes a process for a structure that includes...
專利號：US17865228
申請人：PassiveLogic, Inc.
主分類號：H05K7/14
所在地：UT Salt Lake city
Tools and techniques are described to modify a defined space state depending on number of users in the space and/or preferences of users in the space....
專利號：US17474491
申請人：PURE STORAGE, INC.
主分類號：H05K7/14
所在地：CA Mountain View
An apparatus includes a body having one or more protrusions from a surface of the body, wherein each of the protrusions has a corresponding coupling p...
專利號：US18029861
申請人：IKEA Supply AG
主分類號：H05K5/02
所在地：Pratteln
A panel-shaped electronic device (100) configured to be mounted to a wall (200), the panel-shaped electronic device (100) comprising: a front side (12...
專利號：US18016443
申請人：SHANDONG YINGXIN COMPUTER TECHNOLOGIES CO., LTD.
主分類號：H05K5/02
所在地：Shandong
The present application discloses an electronic device and a connection module therefor. The connection module includes a first connection piece and a...
專利號：US17354623
申請人：TERRA FERMA, LLC
主分類號：H05K5/02
所在地：CO Colorado Springs
A ruggedized programable switch accepts multiple forms of current from a plurality of sources and thereafter conditions and balances the current to pr...
專利號：US17500590
申請人：AcLeap Power Inc.
主分類號：H05K5/00
所在地：Taipei
An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surroun...
專利號：US17105768
申請人：IBIDEN CO., LTD.
主分類號：H05K1/02
所在地：Gifu
A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductor...
專利號：US17554101
申請人：DONGWOO FINE-CHEM CO., LTD.
主分類號：H05K1/09
所在地：Iksan-si
A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is ...
專利號：US17974083
申請人：Samsung Electronics Co., Ltd.
主分類號：H05K1/02
所在地：Gyeonggi-do
Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a s...
專利號：US17060213
申請人：Consolidated Nuclear Security, LLC
主分類號：H05H6/00
所在地：TN Oak Ridge
An annular radioisotope target and method therefor that includes an inner cladding tube and a helical coil-shaped foil ribbon disposed over the inner ...
專利號：US17674048
申請人：INPAQ TECHNOLOGY CO., LTD.
主分類號：H05F3/04
所在地：Zhunan Township, Miaoli County
The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed...