專利號：US17324833
申請人：SK hynix Inc.
主分類號：H10B63/00
所在地：Icheon
A sputtering target and a method for fabricating an electronic device using the same are provided. A sputtering target may include a carbon-doped GeSb...
專利號：US17518571
申請人：UNITED MICROELECTRONICS CORP.
主分類號：H10N52/01
所在地：Hsin-Chu
A method for fabricating a semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) stack on a substrate; forming a fir...
專利號：US17500971
申請人：UNITED MICROELECTRONICS CORP.
主分類號：H10N52/01
所在地：Hsin-Chu
A method for fabricating a semiconductor device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, forming ...
專利號：US18219320
申請人：Godo Kaisha IP Bridge 1
主分類號：H10N50/85
所在地：Tokyo
The output voltage of an MRAM is increased by means of an Fe(001)/MgO(001)/Fe(001) MTJ device, which is formed by microfabrication of a sample prepare...
專利號：US17854289
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H10N50/80
所在地：Hsinchu
In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode lay...
專利號：US17365779
申請人：Northeastern University
主分類號：H10N50/10
所在地：MA Boston
A sputter growth method for a crystalline ordered topological insulator (TI) material on an amorphous substrate, which is possible to use at a CMOS-co...
專利號：US17367454
申請人：City University of Hong Kong
主分類號：H01L41/18
所在地：Hong Kong
The present invention provides a flexible piezoelectric composite including a three-dimensional interconnected piezoelectric ceramic framework based o...
專利號：US17109953
申請人：Xerox Corporation
主分類號：H10N30/04
所在地：CT Norwalk
An apparatus 10 for poling piezoelectric material includes a platen 22 which holds a sample 20 of piezoelectric material to be poled and a stage 30 to...
專利號：US17334776
申請人：Ethan James Ciccotelli
主分類號：H01L35/30
所在地：VT Norwich
A method and device incorporating the use of Zinc Oxide to generate electrical power directly from heat, with minimal or no complex and inefficient me...
專利號：US17077240
申請人：LG DISPLAY CO., LTD.
主分類號：H10K85/60
所在地：Seoul
An organic light emitting diode (OLED) includes a first emitting material layer disposed adjacently to a first electrode and a second emitting materia...
專利號：US17118699
申請人：IDEMITSU KOSAN CO., LTD.
主分類號：H10K85/60
所在地：Tokyo
An organic electroluminescence device includes an anode, an emitting layer and a cathode, in which the emitting layer includes a first compound, a sec...
專利號：US17698247
申請人：UDC IRELAND LIMITED
主分類號：H10K85/60
所在地：Dublin
Disclosed are electroluminescent devices that comprise organic layers that contain certain organic compounds containing one ore more pyrimidine moieti...
專利號：US16042014
申請人：Universal Display Corporation
主分類號：H10K85/30
所在地：NJ Ewing
The present invention includes novel polycyclic alkyl amino carbenes as ligands for metal complexes. These compounds may be useful as emitter material...
專利號：US17380715
申請人：eMagin Corporation
主分類號：C23C16/34
所在地：NY Hopewell Junction
Shadow masks comprising a multi-layer membrane having a mechanical pre-bias that compensates the effect of gravity on the membrane are disclosed. A sh...
專利號：US17283714
申請人：Samsung Display Co., Ltd.
主分類號：H10K59/38
所在地：Yongin-si
A display device includes a base substrate including a first sub-pixel area, a second sub-pixel area, and a third sub-pixel area, first to third thin ...
專利號：US17265241
申請人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H10K59/35
所在地：Beijing
The disclosure provides a display substrate, a manufacturing method thereof and a display device. The display substrate has a plurality of subpixel re...
專利號：US17732500
申請人：InnoLux Corporation
主分類號：H10K59/18
所在地：Miao-Li County
An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a met...
專利號：US17620276
申請人：Sharp Kabushiki Kaisha
主分類號：H10K59/131
所在地：Sakai
A second connection wire is electrically connected to a first connection wire via a display-side contact portion and terminal-side contact portion in ...
專利號：US17269042
申請人：SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
主分類號：H10K59/13
所在地：Atsugi
A display panel is provided. The display panel includes a display region, a functional layer, a first insulating film, and a first conductive film; th...
專利號：US17255979
申請人：CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H10K59/131
所在地：Sichuan
A display substrate and a display device are provided. The display substrate includes a base and subpixels. The subpixel includes: a data line pattern...
專利號：US18080367
申請人：LG DISPLAY CO., LTD.
主分類號：H10K50/84
所在地：Seoul
An organic light emitting display device including a dam structure disposed in a non-display area of a substrate and an alignment mark disposed outsid...
專利號：US17493508
申請人：Applied Materials, Inc.
主分類號：H10K50/858
所在地：CA Santa Clara
Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light ...
專利號：US17071364
申請人：SAMSUNG ELECTRONICS CO., LTD.; CALIFORNIA INSTITUTE OF TECHNOLOGY
主分類號：H10K39/32
所在地：Suwon-si
An image sensor includes a first light sensor layer including light sensing cells configured to sense first light of an incident light and generate el...
專利號：US17538236
申請人：ZHEJIANG JINKO SOLAR CO., LTD.
主分類號：H10K30/88
所在地：Zhejiang
Provided is a photovoltaic module, including: a substrate, at least one solar cell string and a packaging portion, wherein a bottom of the packaging p...
專利號：US17577131
申請人：Tsinghua University; HON HAI PRECISION INDUSTRY CO., LTD.
主分類號：H01L23/00
所在地：Beijing
A thin film transistor includes a gate electrode, a gate insulating layer, a carbon nanotube structure, a source electrode and a drain electrode. The ...
專利號：US17981469
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：G11C11/18
所在地：Hsinchu
Provided are a memory device and a method of forming the same. The memory device includes: a selector; a magnetic tunnel junction (MTJ) structure, dis...
專利號：US17650154
申請人：IMEC vzw
主分類號：H10B53/30
所在地：Leuven
A ferroelectric device, for instance, a metal-ferroelectric-metal (MFM) capacitor, a ferroelectric random access memory (Fe-RAM), or a ferroelectric f...
專利號：US17523044
申請人：Taiwan Semiconductor Manufacturing Company Limited
主分類號：H10B51/30
所在地：Hsinchu
A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first ...
專利號：US17929879
申請人：SANDISK TECHNOLOGIES LLC
主分類號：H10B51/20
所在地：TX Addison
A memory device includes a semiconductor channel, a gate electrode, and a stack located between the semiconductor channel and the gate electrode. The ...
專利號：US17654779
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H10B43/27
所在地：Suwon-si
A vertical type semiconductor device includes a substrate that has a plurality of trenches, a support pattern that fills the plurality of trenches and...
專利號：US17149782
申請人：MACRONIX INTERNATIONAL CO., LTD.
主分類號：H10B43/27
所在地：Hsinchu
A memory device includes a source element, a drain element, channel layers, control electrode layers, and a memory layer. The channel layers are indiv...
專利號：US17931929
申請人：MACRONIX INTERNATIONAL CO., LTD.
主分類號：H10B43/20
所在地：Hsinchu
A memory device includes a substrate, a first dielectric structure, a second dielectric structure, a channel structure, a source structure, and a drai...
專利號：US18178527
申請人：Winbond Electronics Corp.
主分類號：H01L21/00
所在地：Taichung
Provided is a method of manufacturing a memory device and a patterning method. The patterning method includes following steps. A control structure inc...
專利號：US16506823
申請人：TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
主分類號：H01L29/66
所在地：Hsinchu
A semiconductor device is provided. The semiconductor device includes a semiconductor substrate and a first gate stack. An isolation feature is formed...
專利號：US17716194
申請人：Samsung Electronics Co., Ltd.
主分類號：H10B12/00
所在地：Suwon-si
A semiconductor memory device includes a substrate having a memory cell region where a plurality of active regions are defined; a word line having a s...
專利號：US17877050
申請人：Taiwan Semiconductor Manufacturing Co., Ltd.
主分類號：H01L27/11
所在地：Hsin-Chu
An integrated circuit (IC) that includes a memory cell having a first p-type active region, a first n-type active region, a second n-type active regio...
專利號：US17457285
申請人：Murata Manufacturing Co., Ltd.
主分類號：H05K9/00
所在地：Kyoto-fu
A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mo...
專利號：US17576742
申請人：Dell Products L.P.
主分類號：H05K5/00
所在地：TX Round Rock
A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components...
專利號：US17576680
申請人：Dell Products L.P.
主分類號：H05K7/00
所在地：TX Round Rock
A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a...
專利號：US17288760
申請人：Telefonaktiebolaget LM Ericsson (publ)
主分類號：F28F7/00
所在地：Stockholm
A heatsink with an air-partitioning baffle. In one embodiment, the heatsink comprises a plurality of fins defining a plurality of channels, an inlet c...
專利號：US17305083
申請人：Panduit Corp.
主分類號：H05K7/00
所在地：IL Tinley Park
A removable transport caster assembly secured to side to side beams or front to back beams in a data center cabinet in a data center. The removable tr...
專利號：US17393572
申請人：Micron Technology, Inc.
主分類號：H05K1/18
所在地：ID Boise
Memory devices including a substrate supporting at least one semiconductor device thereon. The substrate includes an interface sized, shaped, and conf...
專利號：US16018889
申請人：C3Nano Inc.
主分類號：H10K30/00
所在地：CA Hayward
A method of forming a transparent electrically conductive film including depositing a dispersion of metal nanowires onto a substrate surface, deliveri...
專利號：US17763511
申請人：PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
主分類號：H05K1/18
所在地：Son en Breugel
Capacitor assembly, comprising a printed circuit board comprising a first conductive trace and a second conductive trace, and a first row of capacitor...
專利號：US17217394
申請人：Cilag GmbH International
主分類號：H05K1/02
所在地：Zug
Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly phy...
專利號：US17051948
申請人：Neutron Therapeutics LLC
主分類號：H05H5/03
所在地：MA Danvers
According to some embodiments, an electrostatic particle accelerator may include an assembly having a motor and support plate; an acceleration tube; o...
專利號：US17244072
申請人：Plassein Technologies Ltd. LLC
主分類號：H05H1/36
所在地：NV Las Vegas
A novel plasma generation and containment system includes a first electrode, a second electrode, a power source, and an electromagnet. The first elect...
專利號：US16972080
申請人：BAOSHAN IRON & STEEL CO., LTD.
主分類號：H05B6/10
所在地：Shanghai
An induction heating system for a silicon steel core with a self-adhesive coating that includes an induction heating device having a columnar inductio...
專利號：US18261861
申請人：BOXYZ, INC.
主分類號：F21K9/238
所在地：Tokyo
A light includes a plurality of light-emitting elements; a first substrate having a first surface on which the light-emitting elements are arranged at...
專利號：US18239788
申請人：LuminAID Lab, LLC
主分類號：H05B47/00
所在地：NH Littleton
A solar-powered lamp is disclosed. The lamp includes a plurality of radiating extensions, each being formed from a plurality of flat panels that can f...