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專利號(hào):US17078351 申請(qǐng)人:Western Digital Technologies, Inc. 主分類號(hào):G11C11/00 所在地:CA San Jose
This disclosure relates to a low-resistance a multi-layer electrode and method of making a multi-layer electrode. Silicon is deposited on a substrate ...
專利號(hào):US17283037 申請(qǐng)人:JAPAN SCIENCE AND TECHNOLOGY AGENCY 主分類號(hào):H10N69/00 所在地:Saitama
A superconducting complex quantum computing circuit includes a circuit substrate in which a wiring pattern of a circuit element including quantum bits...
專利號(hào):US17489150 申請(qǐng)人:International Business Machines Corporation 主分類號(hào):H10N60/80 所在地:NY Armonk
High-saturation power Josephson ring modulators and fabrication of the same are provided. A Josephson ring modulator can comprise a plurality of matri...
專利號(hào):US17491028 申請(qǐng)人:TDK CORPORATION 主分類號(hào):G11C11/16 所在地:Tokyo
According to an embodiment, there is provided an integrated device including: a substrate; and a laminated structure stacked on the substrate, in whic...
專利號(hào):US17567211 申請(qǐng)人:SAMSUNG ELECTRONICS CO., LTD. 主分類號(hào):H10N50/80 所在地:Suwon-si
A magnetoresistive random access memory (MRAM) device and a method of manufacturing the same, the device including a substrate; a memory unit includin...
專利號(hào):US17209251 申請(qǐng)人:UNITED MICROELECTRONICS CORP. 主分類號(hào):H10N50/80 所在地:Hsin-Chu
A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, an inter-metal dielectric (IMD) laye...
專利號(hào):US17122809 申請(qǐng)人:International Business Machines Corporation 主分類號(hào):H10N50/10 所在地:NY Armonk
A memory device, and a method of forming the same, includes a bottom electrode above an electrically conductive structure, the electrically conductive...
專利號(hào):US16541309 申請(qǐng)人:Xi'an Jiaotong University; Penn State Research Foundation 主分類號(hào):H10N30/853 所在地:Shaanxi
A method of preparing a piezoelectric single crystal with high piezoelectricity and near- perfect transparency. The method includes depositing electro...
專利號(hào):US16445279 申請(qǐng)人:Commissariat A L'Energie Atomique et aux Energies Alternatives 主分類號(hào):H10N30/072 所在地:Paris
A method for producing a piezoelectric transducer device is provided, including a membrane including at least one silicon and/or silicon nitride layer...
專利號(hào):US17022150 申請(qǐng)人:UNITED MICROELECTRONICS CORP. 主分類號(hào):H10N30/05 所在地:Hsinchu
A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and...
專利號(hào):US17143213 申請(qǐng)人:KABUSHIKI KAISHA TOSHIBA 主分類號(hào):H02M1/15 所在地:Tokyo
A power generation element includes a first crystal region including Alx1Ga1-x1N (0
專利號(hào):US16732153 申請(qǐng)人:Shanghai Tianma AM-OLED Co., Ltd.; WUHAN TIANMA MICROELECTRONICS CO., LTD. SHANGHAI BRANCH 主分類號(hào):C07D209/86 所在地:Shanghai
A compound having a structure shown in Chemical Formula 1 is described. In an embodiment, Ar is C6-C20 aryl or C5-C20 heteroaryl; D1 and D2 are electr...
專利號(hào):US16669770 申請(qǐng)人:Samsung Electronics Co., Ltd. 主分類號(hào):H10K85/30 所在地:Suwon-si
A composition including a first compound represented by Formula 1 and a second compound represented by Formula 2 and an organic light-emitting device ...
專利號(hào):US17142818 申請(qǐng)人:Samsung Display Co., LTD. 主分類號(hào):H01L27/32 所在地:Yongin-si
A display device includes a supporting substrate including a polymeric material, base substrate disposed on an upper surface of the supporting substra...
專利號(hào):US17125355 申請(qǐng)人:LG Display Co., Ltd. 主分類號(hào):H01L27/32 所在地:Seoul
An organic light emitting display device includes a substrate having a display area displaying an image and a non-display area surrounding the display...
專利號(hào):US17380074 申請(qǐng)人:Samsung Display Co., Ltd. 主分類號(hào):H10K59/35 所在地:Yongin-Si
A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a fir...
專利號(hào):US17972010 申請(qǐng)人:Samsung Display Co., Ltd. 主分類號(hào):H10K59/131 所在地:Yongin-si
A display device includes a first substrate and a second substrate, and the first substrate includes a plurality of connection lines disposed to exten...
專利號(hào):US17394339 申請(qǐng)人:SAKAI DISPLAY PRODUCTS CORPORATION 主分類號(hào):H10K59/124 所在地:Sakai
The present invention is equipped with: a substrate (10) that has a surface upon which a drive circuit containing a TFT (20) is formed; a planarizing ...
專利號(hào):US17319263 申請(qǐng)人:Samsung Display Co., LTD. 主分類號(hào):H10K59/124 所在地:Yongin-si
A display device includes a substrate including a first pixel area, a second pixel area spaced apart from the first pixel area, and a valley area betw...
專利號(hào):US17129169 申請(qǐng)人:Samsung Display Co., Ltd. 主分類號(hào):H01L27/14 所在地:Yongin-si
A display apparatus includes a display area including pixels; a non-display area adjacent to the display area; a first planarization layer located in ...
專利號(hào):US17929691 申請(qǐng)人:SAMSUNG DISPLAY CO., LTD. 主分類號(hào):G09G3/32 所在地:Yongin-si
A display device may include a plurality of pixels each including a light emitting element. A first scan line and a second scan line, are disposed in ...
專利號(hào):US18146337 申請(qǐng)人:SAMSUNG DISPLAY CO., LTD. 主分類號(hào):H01L21/00 所在地:Yongin-si
A display device includes: a first main pixel being configured to emit light of a first color, and a second main pixel being configured to emit light ...
專利號(hào):US16813517 申請(qǐng)人:Samsung Display Co., Ltd. 主分類號(hào):H01L51/00 所在地:Yongin-si
A display device includes an electronic panel, a window, an optical sheet, and a stress control member. The electronic panel includes a first non-bend...
專利號(hào):US17689375 申請(qǐng)人:Japan Display Inc. 主分類號(hào):H10K50/844 所在地:Tokyo
The display device includes a substrate including a first resin layer, a second resin layer overlapping the first resin layer, and a first inorganic i...
專利號(hào):US17231387 申請(qǐng)人:Applied Materials, Inc. 主分類號(hào):H10K50/844 所在地:CA Santa Clara
Flexible display devices, such as flexible cover lens films, are discussed and provided herein. The flexible cover lens film has good strength, elasti...
專利號(hào):US17053658 申請(qǐng)人:TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 主分類號(hào):H10K50/842 所在地:Shenzhen
A display motherboard is provided. The display motherboard is provided with barrier walls on at least one of an array substrate or a cover plate in a ...
專利號(hào):US17401307 申請(qǐng)人:LG Display Co., Ltd. 主分類號(hào):H10K50/84 所在地:Seoul
A foldable display apparatus comprises a display panel including a folding area and a non-folding area at one or more sides of the folding area; and a...
專利號(hào):US17892564 申請(qǐng)人:SAMSUNG ELECTRONICS CO., LTD. 主分類號(hào):H01L51/50 所在地:Suwon-si
An electroluminescent device includes a first electrode and a second electrode facing each other; a hole transport layer between the first electrode a...
專利號(hào):US17600906 申請(qǐng)人:SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 主分類號(hào):H10K50/00 所在地:Atsugi
A solid-state relay having favorable electrical characteristics is provided. The solid-state relay includes a first circuit and a second circuit. The ...
專利號(hào):US16317371 申請(qǐng)人:SONY CORPORATION 主分類號(hào):B82Y40/00 所在地:Tokyo
To provide a semiconductor film capable of realizing further enhancement of photoelectric conversion efficiency.The semiconductor film includes semico...
專利號(hào):US17663187 申請(qǐng)人:Kepler Computing Inc. 主分類號(hào):H10B53/30 所在地:CA San Francisco
Approaches for integrating FE memory arrays into a processor, and the resulting structures are described. Simultaneous integrations of regions with fe...
專利號(hào):US16885303 申請(qǐng)人:Taiwan Semiconductor Manufacturing Co., Ltd. 主分類號(hào):H01L21/00 所在地:Hsinchu
A ferroelectric memory device includes a first conductive region, a second conductive region and a ferroelectric structure. The second conductive regi...
專利號(hào):US17674422 申請(qǐng)人:Taiwan Semiconductor Manufacturing Co., Ltd. 主分類號(hào):H01L27/15 所在地:Hsinchu
A method of forming a semiconductor device includes: forming a first fin protruding above a substrate; forming first source/drain regions over the fir...
專利號(hào):US17458692 申請(qǐng)人:Taiwan Semiconductor Manufacturing Company, Ltd. 主分類號(hào):H10B51/20 所在地:Hsinchu
A semiconductor device includes a first conductive structure extending along a vertical direction and a second conductive structure extending along th...
專利號(hào):US17394548 申請(qǐng)人:Kioxia Corporation 主分類號(hào):H01L21/02 所在地:Tokyo
In one embodiment, a semiconductor device includes a stacked film alternately including a plurality of electrode layers and a plurality of insulating ...
專利號(hào):US17328991 申請(qǐng)人:SUNRISE MEMORY CORPORATION 主分類號(hào):G11C5/02 所在地:CA Fremont
A memory structure, includes active columns of polysilicon formed above a semiconductor substrate, each active column includes one or more vertical NO...
專利號(hào):US17167221 申請(qǐng)人:MACRONIX INTERNATIONAL CO., LTD. 主分類號(hào):H10B43/27 所在地:Hsinchu
A memory device includes a substrate, a laminated structure and a memory string. The laminated structure is disposed on the substrate. The laminated s...
專利號(hào):US17202193 申請(qǐng)人:TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 主分類號(hào):H10B41/42 所在地:Hsinchu
A semiconductor device includes a non-volatile memory. The non-volatile memory includes a first dielectric layer disposed on a substrate, a floating g...
專利號(hào):US17876103 申請(qǐng)人:Taiwan Semiconductor Manufacturing Company, Ltd. 主分類號(hào):H10B20/20 所在地:Hsinchu
A memory device includes a first memory cell having a first polysilicon line associated with a first read word line and intersecting a first active re...
專利號(hào):US16944756 申請(qǐng)人:Taiwan Semiconductor Manufacturing Co., Ltd. 主分類號(hào):H01L23/52 所在地:Hsin-Chu
A semiconductor structure includes first and second transistors each having a source terminal, a drain terminal, and a gate terminal. The semiconducto...
專利號(hào):US17696945 申請(qǐng)人:Intel Corporation 主分類號(hào):H01L27/108 所在地:CA Santa Clara
Described herein are embedded dynamic random-access memory (eDRAM) memory cells and arrays, as well as corresponding methods and devices. An exemplary...
專利號(hào):US17508720 申請(qǐng)人:NANYA TECHNOLOGY CORPORATION 主分類號(hào):H10B12/00 所在地:New Taipei
The present disclosure relates to a method for preparing a semiconductor device. The method includes forming a source region and a drain region in a s...
專利號(hào):US17517345 申請(qǐng)人:Kepler Computing Inc. 主分類號(hào):G11C11/00 所在地:CA San Francisco
To compensate switching of a dielectric component of a non-linear polar material based capacitor, an explicit dielectric capacitor is added to a memor...
專利號(hào):US17156714 申請(qǐng)人:The ESAB Group, Inc. 主分類號(hào):H05K7/20 所在地:SC Florence
A power supply includes a casing; an AC-to-DC converter; an inverter electrically coupled to the AC-to-DC converter; a transformer having a primary si...
專利號(hào):US17032196 申請(qǐng)人:Ohio State Innovation Foundation 主分類號(hào):H05K7/20 所在地:OH Columbus
A low inductance power module with low power loop inductance and high-power density is provided. The power module may include a vertical power loop st...
專利號(hào):US17359823 申請(qǐng)人:BAIDU USA LLC 主分類號(hào):H05K7/20 所在地:CA Sunnyvale
A design for servers and racks, includes a supply connector module including a supply connector connected to a first holder to connect a supply line c...
專利號(hào):US17351477 申請(qǐng)人:Nanning FuLian FuGui Precision Industrial Co., Ltd. 主分類號(hào):H05K7/20 所在地:Nanning
A heat-dissipation device with detachability against the adhesion of a paste includes a heat-dissipation structure and a detachment device. The heat-d...
專利號(hào):US17328526 申請(qǐng)人:Dell Products L.P. 主分類號(hào):H05K7/20 所在地:TX Round Rock
A thermal module for cooling a plurality of component and cooling a bottom cover of a sealed chassis. A pair of fans are positioned in the chassis, wh...
專利號(hào):US16984326 申請(qǐng)人:QUANTA COMPUTER INC. 主分類號(hào):H05K7/14 所在地:Taoyuan
A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism ...
專利號(hào):US17009415 申請(qǐng)人:MICRON TECHNOLOGY, INC. 主分類號(hào):H05K7/10 所在地:ID Boise
A device stand for a portable device, comprising a foldable extension leg which supports the portable device at a cable connection instead of directly...