專利號：US15139185
申請人：BOE TECHNOLOGY GROUP CO., LTD.; HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
主分類號：B23P19/00
所在地：Beijing
The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating...
專利號：US15196114
申請人：De Yu Zang; Michael M. Salour; James G. Grote
主分類號：H05K9/00
所在地：CA Irvine
An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. T...
專利號：US15461480
申請人：CORETRONIC CORPORATION
主分類號：H05K7/20
所在地：Hsin-Chu
An electronic device including an electronic module, a casing, and at least one air port is provided. The casing accommodates the electronic module. T...
專利號：US15849141
申請人：Raymond & Lae Engineering, Inc.
主分類號：H05K5/00
所在地：CO Fort Collins
A method for enhancing the cooling efficiency of a computer room air conditioning unit, in a data center, is provided. Raised floor panels are carried...
專利號：US15823346
申請人：Nokia Solutions and Networks Oy
主分類號：H05K7/20
所在地：Espoo
A connector assembly and heat sink configured to be received by a radio unit are provided. An example connector assembly includes a printed wiring boa...
專利號：US15393263
申請人：Intel Corporation
主分類號：G06F1/16
所在地：CA Santa Clara
A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are discl...
專利號：US15275498
申請人：ASIA VITAL COMPONENTS CO., LTD.
主分類號：F28F7/00
所在地：New Taipei
A water-cooling radiator structure includes at least one first and at least one second sealing element and a first water-cooling radiator main body fo...
專利號：US15645267
申請人：NATIONAL INSTRUMENTS CORPORATION
主分類號：G06F1/20
所在地：TX Austin
Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide c...
專利號：US15532164
申請人：SENQCIA CORPORATION
主分類號：H05K7/14
所在地：Tokyo
A double-floor member includes at least one first guide rail (24) that is fixed to an upper surface and at least one first connecting member (27) that...
專利號：US15310149
申請人：BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
主分類號：H05K1/11
所在地：Beijing
A sealant and a preparation method thereof, a display panel motherboard and a manufacturing method thereof are disclosed. The sealant includes a main ...
專利號：US13754799
申請人：NVIDIA Corporation
主分類號：H05K3/00
所在地：CA Santa Clara
A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the st...
專利號：US15210370
申請人：SAMSUNG DISPLAY CO., LTD.
主分類號：G09G3/20
所在地：Yongin-si, Gyeonggi-do
A display device includes a display panel having a first area and a second area that is adjacent to the first area in a first direction, a first print...
專利號：US15296198
申請人：RAYTHEON COMPANY
主分類號：H05K1/14
所在地：MA Waltham
A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a ...
專利號：US15398778
申請人：IBIDEN CO., LTD.
主分類號：H05K1/11
所在地：Ogaki
A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer cove...
專利號：US14907613
申請人：FUJIKURA LTD.
主分類號：H05K1/02
所在地：Tokyo
A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, inclu...
專利號：US15828479
申請人：SONY CORPORATION
主分類號：H05K1/02
所在地：Tokyo
A display unit includes: a display section (11) having flexibility; and a bending control section (12a, 12b) configured to limit a movable shaft in be...
專利號：US16019933
申請人：Timothy Chen; Andrew Hussey; Hao Wang
主分類號：H05B33/00
所在地：OH Aurora
A driver circuit receiving wireless communication over a wireless network is disclosed. The driver circuit includes a lighting load, a main driver, an...
專利號：US15943183
申請人：Express Imaging Systems, LLC
主分類號：H05B37/02
所在地：WA Renton
Systems and methods which leverage the wireless communication capability present in wireless-enabled luminaires where the lamps include a short-range ...
專利號：US15534804
申請人：DST Innovations Limited
主分類號：H01J1/62
所在地：Bridgend
An electroluminescent element comprises at least the following layers, in sequence: a first substrate (1), a first conductive layer (2), a first diele...
專利號：US15506976
申請人：Sharp Kabushiki Kaisha
主分類號：H01L23/58
所在地：Sakai, Osaka
An organic electroluminescence device according to one aspect of the present invention includes: a base material in which a recess is provided at an u...
專利號：US15959493
申請人：ANPEC ELECTRONICS CORPORATION
主分類號：H05B33/08
所在地：Hsinchu
Disclosed is an LED fault detection circuit, including a current source, a detection resistor and a first circuit, coupled between an LED string and a...
專利號：US15768178
申請人：PHILIPS LIGHTING HOLDING B.V.
主分類號：H05B33/00
所在地：Eindhoven
Presented are concepts for controlling cove lighting. Once such concept provides cove lighting adapted to output decorative light for illuminating the...
專利號：US15563585
申請人：PHILIPS LIGHTING HOLDING B.V.
主分類號：H05B33/08
所在地：Eindhoven
The present invention relates to a lighting device (100) capable of creating dynamic color shadows. The lighting device (100) comprises multiple light...
專利號：US15348940
申請人：LedEngin, Inc.
主分類號：H05B33/08
所在地：CA San Jose
A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least fou...
專利號：US15949851
申請人：Eminvent, LLC
主分類號：H05B33/08
所在地：NJ Englewood
A method of controlling illumination, including transmitting location information from a communication device to a computer; receiving illumination da...
專利號：US15279998
申請人：Seoul Semiconductor Co., Ltd.
主分類號：H05B33/08
所在地：Ansan-si
A direct type backlight unit disposed under a liquid crystal panel includes a backlight module including a printed circuit board including blocks arra...
專利號：US15867086
申請人：GARDENIA INDUSTRIAL LIMITED
主分類號：H05B33/08
所在地：Tortola
A power supply includes an AC input power connector; an AC-DC converter circuit coupled to the AC input power connector; a constant-current constant-v...
專利號：US14903743
申請人：CORNING INCORPORATED
主分類號：C03C3/087
所在地：NY Corning
Aluminosilicate glasses whose composition is free of alkali metals and contain, as a weight percentage of oxides, 60 to 70% SiO2, 13 to 22% Al2O3, 0 t...
專利號：US13906118
申請人：Jiping Li
主分類號：H05B6/00
所在地：CA Palo Alto
Methods and apparatus for measuring the melt depth of a substrate during pulsed laser melting are provided. The apparatus can include a heat source, a...
專利號：US14794958
申請人：TüRK & HILLINGER GMBH
主分類號：H05B3/00
所在地：Tuttlingen
An electric heater (100, 200, 300, 400, 500, 600) includes a metal sheath (101, 201, 301, 401, 501, 601) defining an interior space, an electric heati...
專利號：US15699797
申請人：InterDigital Patent Holdings, Inc.
主分類號：H04W84/10
所在地：DE Wilmington
Techniques for supporting utilization of femtocell service capabilities for services are disclosed. A network device may be configured to implement a ...
專利號：US15614522
申請人：QUALCOMM Incorporated
主分類號：H04W16/18
所在地：CA San Diego
Techniques are described for wireless communication. A base station may indicate to a UE, in a pre-wakeup period, whether the base station will transm...
專利號：US15460081
申請人：Motorola Mobility LLC
主分類號：H04W24/08
所在地：IL Chicago
For monitoring and handling a radio link failure in inactive state, a method detects the radio link failure at a mobile communication device in the in...
專利號：US15150374
申請人：Federated Wireless, Inc.
主分類號：H04W72/04
所在地：VA Arlington
Systems and methods for providing mobile services are disclosed. In one implementation, an access point (AP) is provided, which may include a set of o...
專利號：US14765333
申請人：Doron Shaul Shalev
主分類號：H04W72/04
所在地：Alfei-Menashe
A communication system includes a 3rd Generation Partnership Project (3GPP) Core Network (CN); a 3GPP Home Node-B GateWay (HNB-GW); a Communication Ap...
專利號：US14373760
申請人：Sony Corporation
主分類號：H04W4/00
所在地：Tokyo
The present invention relates to a method for operating a terminal device (106) of a wireless communication system (100). The terminal device (106) is...
專利號：US15501545
申請人：NOKIA SOLUTIONS AND NETWORKS OY
主分類號：H04W74/08
所在地：Espoo
An example method includes generating, by a first user device, a first number representing a contention resolution priority for the first user device ...
專利號：US15521364
申請人：Telefonaktiebolaget LM Ericsson (publ)
主分類號：H04W72/14
所在地：Stockholm
Systems and methods related to Downlink-Uplink Decoupling (DUDe) in mixed licensed and unlicensed carrier wireless system are disclosed. In some embod...
專利號：US15107796
申請人：Telefonaktiebolaget LM Ericsson (publ)
主分類號：H04W72/14
所在地：Stockholm
There is provided mechanisms for data transmission on a contention based physical data channel (PDCH). The method is performed by a wireless device. T...
專利號：US14818112
申請人：LG ELECTRONICS INC.
主分類號：H04W4/00
所在地：Seoul
The present invention relates to a wireless communication system. More specifically, the present invention relates to a method and a device for avoidi...
專利號：US15889561
申請人：Intel IP Corporation
主分類號：H04W72/12
所在地：CA Santa Clara
Embodiments of a station (STA) and method for communication on primary and secondary channel resources are generally described herein. The STA may tra...
專利號：US14231332
申請人：FUJITSU CONNECTED TECHNOLOGIES LIMITED
主分類號：H04W72/08
所在地：Kawasaki-shi, Kanagawa
A method of scheduling wireless communications may include assigning a first band of a wireless communications standard for wireless communications be...
專利號：US15891121
申請人：Verizon Patent and Licensing Inc.
主分類號：H04W72/00
所在地：VA Arlington
A device may detect a trigger to configure a coverage enhancement mode for a wireless device. The wireless device may be associated with a particular ...
專利號：US15415559
申請人：SONY CORPORATION
主分類號：H04W72/04
所在地：Tokyo
A communications device transmitting/receiving signals to/from a mobile communications network includes one or more network elements providing a wirel...
專利號：US15251759
申請人：LG ELECTRONICS INC.
主分類號：H04W4/00
所在地：Seoul
Disclosed are a method and an apparatus for uplink transmission. A method for uplink transmission for a machine-type communication (MTC) terminal comp...
專利號：US15962241
申請人：Huawei Technologies Co., Ltd.
主分類號：H04W72/04
所在地：Shenzhen
Methods and devices are provided for communicating data in a wireless channel. In one example, a method includes adapting the transmission time interv...
專利號：US15868934
申請人：Newracom, Inc.
主分類號：H04W72/04
所在地：CA Irvine
A method for communicating a signaling field in a wireless communications system comprises transmitting, by a wireless device, a frame through a mediu...
專利號：US15329572
申請人：LG ELECTRONICS INC.
主分類號：H04W72/00
所在地：Seoul
The present invention relates to a wireless communication system, specifically to a method comprising the steps of: configuring a PCell of a licensed ...
專利號：US15278318
申請人：Futurewei Technologies, Inc.
主分類號：H04W72/04
所在地：TX Plano
A method includes determining a first subframe on which to transmit a first downlink control information (DCI) message and determining a second subfra...
專利號：US15876196
申請人：MediaTek Singapore Pte. Ltd.
主分類號：H04W72/04
所在地：Singapore
Apparatus and methods are provided for TDM uplink transmission on multiple serving cells with single transmitter. In one novel aspect, the UE selects ...