專利號(hào)：US16756457
申請(qǐng)人：YAMAHA HATSUDOKI KABUSHIKI KAISHA
主分類號(hào)：H05K13/04
所在地：Iwata
An informing device includes a loading section feeding automatically a subsequent component tape that is preset in the tape feeder when the component ...
專利號(hào)：US17196763
申請(qǐng)人：PEGATRON CORPORATION
主分類號(hào)：H05K9/00
所在地：Taipei
An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board mo...
專利號(hào)：US16991654
申請(qǐng)人：CareFusion 303, Inc.
主分類號(hào)：H05K9/00
所在地：CA San Diego
A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes...
專利號(hào)：US17127594
申請(qǐng)人：Nan Chen; He Zhao; Yunshui Chen
主分類號(hào)：H05K7/20
所在地：Templestowe
A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that...
專利號(hào)：US17108808
申請(qǐng)人：Nan Chen; He Zhao; Yunshui Chen
主分類號(hào)：H05K7/20
所在地：Templestowe
A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower bloc...
專利號(hào)：US16009129
申請(qǐng)人：Microsoft Technology Licensing, LLC
主分類號(hào)：H05K7/20
所在地：WA Redmond
A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a...
專利號(hào)：US16764062
申請(qǐng)人：Siemens Aktiengesellschaft
主分類號(hào)：H05K7/20
所在地：Munich
A low-voltage switching device with a nominal device current range of up to 650 A, includes a defined cooling arrangement with a structure that has a ...
專利號(hào)：US16745134
申請(qǐng)人：Seagate Technology LLC
主分類號(hào)：H05K7/14
所在地：CA Cupertino
A system includes an enclosure with a first side wall, a second side wall, and a first wall assembly. The first wall assembly extends between the firs...
專利號(hào)：US16919424
申請(qǐng)人：HONGFUJIN PRECISION ELECTRONICS(TIANJIN) CO., LTD.
主分類號(hào)：H05K7/14
所在地：Tianjin
An electronic device includes a housing, a first electronic component, a second electronic component, two resilient assemblies, and two rotating lever...
專利號(hào)：US16781923
申請(qǐng)人：PEGATRON CORPORATION
主分類號(hào)：H05K5/00
所在地：Taipei
A locking mechanism includes a first shell, a second shell, a waterproof ring and a locking component. The first shell has a first carrying surface, a...
專利號(hào)：US16553808
申請(qǐng)人：KIOXIA CORPORATION
主分類號(hào)：H05K5/02
所在地：Minato-ku
A memory system of embodiments includes a container, a first circuit board, a second circuit board, and an optical cable. The container has a hole con...
專利號(hào)：US16905817
申請(qǐng)人：Apple Inc.
主分類號(hào)：G06F1/16
所在地：CA Cupertino
Electronic devices may be provided that contain multiple housing portions. The housing portions may be coupled together using hinges. The hinges may i...
專利號(hào)：US16456550
申請(qǐng)人：LG Display Co., Ltd.
主分類號(hào)：H05K5/00
所在地：Seoul
A display device includes: a display panel and a back cover which is disposed on one surface of the display panel and has a plurality of openings in w...
專利號(hào)：US17048806
申請(qǐng)人：SUMITOMO ELECTRIC INDUSTRIES, LTD.
主分類號(hào)：B32B3/00
所在地：Osaka
A printed circuit board according to an embodiment of the present disclosure includes a base film having an insulating property, and a conductive patt...
專利號(hào)：US16698127
申請(qǐng)人：Metrospec Technology, L.L.C.
主分類號(hào)：B23K1/00
所在地：MN Mendota Heights
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes ...
專利號(hào)：US17244399
申請(qǐng)人：DUJUD LLC
主分類號(hào)：H05K3/12
所在地：GA Atlanta
Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectiv...
專利號(hào)：US16709743
申請(qǐng)人：FLEX LTD
主分類號(hào)：H05K3/00
所在地：Singapore
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the ele...
專利號(hào)：US16789666
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H05K7/00
所在地：Gyeonggi-do
According to an embodiment, it is possible to provide an electronic device including: a housing; a first printed circuit board disposed in the housing...
專利號(hào)：US17008222
申請(qǐng)人：Intel Corporation
主分類號(hào)：H05K1/11
所在地：CA Santa Clara
A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a fi...
專利號(hào)：US17026567
申請(qǐng)人：Vicor Corporation
主分類號(hào)：H05K1/11
所在地：MA Andover
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities ...
專利號(hào)：US17041391
申請(qǐng)人：SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
主分類號(hào)：H05K1/11
所在地：Guangdong
A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding porti...
專利號(hào)：US17097931
申請(qǐng)人：LG Display Co., Ltd.
主分類號(hào)：H05K1/00
所在地：Seoul
A display device includes a flexible first substrate including a display part, a bending part provided at one side of the display part, and a pad part...
專利號(hào)：US16919740
申請(qǐng)人：SZ DJI TECHNOLOGY CO., LTD.
主分類號(hào)：H05K1/02
所在地：Shenzhen
A circuit board includes a board body including a wiring; a micro-control unit, arranged on the board body; and an inertial measurement unit arranged ...
專利號(hào)：US16620349
申請(qǐng)人：KYOCERA Corporation
主分類號(hào)：H01L33/56
所在地：Kyoto
A circuit board according to the present disclosure includes a substrate, a conductor layer arranged on the substrate, a reflective layer arranged on ...
專利號(hào)：US15674388
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H01L23/488
所在地：Hsinchu
A method includes attaching a substrate to a carrier, aligning external connectors on a first surface of a first semiconductor package to first conduc...
專利號(hào)：US16993764
申請(qǐng)人：DY 4 SYSTEMS, INC.
主分類號(hào)：H04B3/32
所在地：Kanata
A system for reducing near-end crosstalk (NEXT) includes a first electrical component contributing to a first NEXT pulse of a first polarity and a sec...
專利號(hào)：US14610299
申請(qǐng)人：Monolith Materials, Inc.
主分類號(hào)：H05H1/34
Design advances for improving the performance of a plasma torch. The use of one or more of various advances described herein can improve the efficienc...
專利號(hào)：US16708796
申請(qǐng)人：Electronic Theatre Controls, Inc.
主分類號(hào)：H05B47/155
所在地：WI Middleton
Systems and methods for determining lighting fixture arrangement information (e.g., position and/or orientation). A lighting beam from the lighting fi...
專利號(hào)：US16941869
申請(qǐng)人：SHENZHEN GUANKE TECHNOLOGIES CO., LTD
主分類號(hào)：H05B45/10
所在地：Shenzhen
A variable resistance power adjustment device and lamp. The variable resistance power adjustment device includes a mounting base, keycap and resistanc...
專利號(hào)：US17069147
申請(qǐng)人：Food Industry Research and Development Institute
主分類號(hào)：H05B6/64
所在地：Hsinchu
A compound heating apparatus includes a microwave generating unit and an infrared radiation generator disposed in a casing outwardly of a heating cham...
專利號(hào)：US16678803
申請(qǐng)人：LG Electronics Inc.
主分類號(hào)：H05B6/12
所在地：Seoul
An induction heating device includes a working coil, an inverter including a first switching element and a second switching element; a gate driver inc...
專利號(hào)：US16463591
申請(qǐng)人：Bridgestone Corporation
主分類號(hào)：H05B6/10
所在地：Tokyo
An electromagnetic induction heating apparatus for heating a fluid includes a tubular insulating member (10) through which the fluid flows, and the tu...
專利號(hào)：US16353655
申請(qǐng)人：LG ELECTRONICS INC.
主分類號(hào)：H05B6/06
所在地：Seoul
An induction heating device includes first and second working coils connected electrically in parallel, an inverter unit configured to switch at least...
專利號(hào)：US16247401
申請(qǐng)人：Walter Crandell
主分類號(hào)：H05B3/46
所在地：IL St. Charles
A crushable ceramic heater core for an electric heater device which has a cylinder-like body of crushable ceramic material and grooves along the perip...
專利號(hào)：US15689611
申請(qǐng)人：Arnoldo Reta; Sai Guruva Avuthu; MaryAlice Gill; Nabel M. Ghalib; Mark Edward Sussman
主分類號(hào)：H05B1/02
所在地：FL St. Petersburg
The disclosure provides an apparatus, system and method for a flexible heater suitable for embedding in a wearable. The flexible heater comprises a co...
專利號(hào)：US16755879
申請(qǐng)人：GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
主分類號(hào)：H04W80/00
所在地：Guangdong
Disclosed in the embodiments of the disclosure are a method for transmitting data, a terminal device and a network device. The method includes: a term...
專利號(hào)：US16692597
申請(qǐng)人：Cisco Technology, Inc.
主分類號(hào)：H04W76/40
所在地：CA San Jose
A radio access network (RAN) entity (e.g. an eNodeB) may be configured to facilitate multicast communication in a local private Third Generation Partn...
專利號(hào)：US16875323
申請(qǐng)人：Huawei Technologies Co., Ltd.
主分類號(hào)：H04W76/28
所在地：Shenzhen
An indication signal configuration method and device are provided, and relate to the field of communications technologies. The method includes: sendin...
專利號(hào)：US16869970
申請(qǐng)人：Sprint Spectrum L.P.
主分類號(hào)：H04W24/10
所在地：KS Overland Park
When a first access node is serving a UE with standalone connectivity on a first frequency band and is considering setup of dual-connectivity service ...
專利號(hào)：US16766908
申請(qǐng)人：Telefonaktiebolaget LM Ericsson (publ)
主分類號(hào)：H04W76/15
所在地：Stockholm
Examples disclosed herein include a method performed by a wireless device for transmitting a Packet Data Convergence Protocol (PDCP) protocol data uni...
專利號(hào)：US16754225
申請(qǐng)人：GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
主分類號(hào)：H04W76/15
所在地：Guangdong
Disclosed are an interference processing method, a terminal device, a network device, and a computer storage medium. The method comprises: when a term...
專利號(hào)：US16914870
申請(qǐng)人：Donald H. Reinhart, Jr.
主分類號(hào)：H04W76/11
所在地：PA West Easton
A method to identify user equipment devices connected to a wireless network, the method including, at a signaling node, including a non-transitory mem...
專利號(hào)：US16693087
申請(qǐng)人：Samsung Electronics Co., Ltd
主分類號(hào)：H04W76/11
所在地：Suwon-si
An electronic device according to one embodiment disclosed in the disclosure includes a communication circuit for supporting wireless communication in...
專利號(hào)：US16915224
申請(qǐng)人：Nokia Technologies Oy
主分類號(hào)：H04W74/08
所在地：Espoo
There is disclosed an apparatus. The apparatus comprises means for using a first random access type in a random access procedure; and in response to d...
專利號(hào)：US16913995
申請(qǐng)人：Ahmad Jalali; Kasra Jalali
主分類號(hào)：H04W74/08
所在地：CA Rancho Santa Fe
In a beamforming system, each User Equipment (UE) transmits an uplink probe. Each Base Station (BS) carries out a spatial search of the uplink probes,...
專利號(hào)：US16332713
申請(qǐng)人：Telefonaktiebolaget LM Ericsson (publ)
主分類號(hào)：H04W74/08
所在地：Stockholm
A method and device for data transmission. A terminal device determines a desired resource for transmitting message 3 according to the capability of t...
專利號(hào)：US16787138
申請(qǐng)人：NIPPON TELEGRAPH AND TELEPHONE CORPORATION
主分類號(hào)：H04W74/08
所在地：Tokyo
A predetermined STA includes a station information collection unit collecting from the STA itself and other STAs station information used for selectio...
專利號(hào)：US16689963
申請(qǐng)人：QUALCOMM INCORPORATED
主分類號(hào)：H04W4/00
所在地：CA San Diego
Wireless communications systems and methods related to constraining no-listen-before-talk (LBT)-based transmissions during link direction switches in ...
專利號(hào)：US15586958
申請(qǐng)人：Sharp Kabushiki Kaisha; FG Innovation Company Limited
主分類號(hào)：H04W72/14
所在地：Sakai
A UE is described that includes a higher layer processor configured to receive a dedicated RRC configuration message which configures a License Assist...
專利號(hào)：US16670919
申請(qǐng)人：Lenovo (Singapore) PTE. LTD.
主分類號(hào)：H04W72/14
所在地：New Tech Park
Apparatuses, methods, and systems are disclosed for preempting an uplink resource allocation. One apparatus includes a processor and a transceiver tha...