專利號：US17392268
申請人：Winbond Electronics Corp.
主分類號：H10N70/00
所在地：Taichung
A resistive random access memory, including a first electrode layer and a second electrode layer disposed opposite to each other, a variable resistanc...
專利號：US16577539
申請人：Microsoft Technology Licensing, LLC
主分類號：G06N10/00
所在地：WA Redmond
A hybrid heterostructure includes a semiconductor layer comprising indium antimonide, a superconductor layer comprising aluminum, and a screening laye...
專利號：US17051680
申請人：ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA
主分類號：H10N50/80
所在地：AZ Tucson
Advanced magnetic tunneling junctions (MTJs) that dramatically reduce power consumption (switching energy, ESw) while maintaining a reasonably high tu...
專利號：US17445557
申請人：IMEC vzw
主分類號：H01L51/50
所在地：Leuven
According to an aspect, there is provided a method of forming a magnetic tunneling junction (MTJ) device, including: forming a layer stack including a...
專利號：US16628765
申請人：DAIKIN INDUSTRIES, LTD.; OSAKA UNIVERSITY
主分類號：H01L41/193
所在地：Osaka
An object of the present invention is to provide a vibration sensor in which the frequency dependence of the output is small. The present invention pr...
專利號：US17198040
申請人：HOWE INDUSTRIES LLC
主分類號：H10N10/13
所在地：AZ Scottsdale
A thermoelectric converter including a thermoelectric generator and a radiation source. The thermoelectric generator includes a hot source, a cold sou...
專利號：US16908973
申請人：ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
主分類號：H10K85/60
所在地：Chungcheongnam-do
The present disclosure relates to a plurality of host materials and an organic electroluminescent device comprising the same. By comprising the host m...
專利號：US17744046
申請人：Samsung Display Co., LTD.
主分類號：G02F1/13
所在地：Yongin-si
A display device includes a substrate including a first region, a second region, and a bending region between the first region and the second region, ...
專利號：US17488675
申請人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H05K5/00
所在地：Beijing
Disclosed are a display assembly and a display device. The display assembly includes: a flexible display screen; a support layer located on a non-disp...
專利號：US17455477
申請人：Samsung Display Co., Ltd.
主分類號：H10K71/00
所在地：Yongin-si
An OLED display and a method of manufacturing thereof are disclosed. In one aspect, the display includes a scan line formed over a substrate and confi...
專利號：US17627794
申請人：CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號：H10K59/88
所在地：Sichuan
A display panel has a display area including a light-transmitting region, at least one first region and a second region. The display panel includes su...
專利號：US17178182
申請人：Samsung Display Co., LTD.
主分類號：H10K59/38
所在地：Yongin-si
A display panel includes light emitting elements which generate source light, pixel regions from which light is emitted, a layer including light contr...
專利號：US16704437
申請人：SAMSUNG DISPLAY CO., LTD.
主分類號：H10K59/131
所在地：Yongin-si
Provided is a display device. The display device includes: a substrate; a gate line disposed on the substrate; a transistor including a part of the ga...
專利號：US17201053
申請人：Samsung Display Co., Ltd.
主分類號：H01L29/08
所在地：Yongin-Si
A display apparatus in which a display area is expanded so that an image may be displayed even in an area where components are arranged\is provided. T...
專利號：US17354416
申請人：Wuhan Tianma Micro-Electronics Co., Ltd.
主分類號：H10K59/124
所在地：Wuhan
Provided are a display panel, a method for manufacturing a display panel, and a display device. The display panel includes: a base substrate; an insul...
專利號：US17745299
申請人：Sony Semiconductor Solutions Corporation
主分類號：H10K59/122
所在地：Kanagawa
Display devices and electronic apparatus are disclosed. In one example, a display device includes first and second light emitting units on a substrate...
專利號：US15931462
申請人：KOPIN CORPORATION
主分類號：H10K59/122
所在地：MA Westborough
Apparatuses, systems, and methods are described to enhance images rendered on an Organic Light Emitting Diode (OLED) display. An OLED device is formed...
專利號：US17743379
申請人：Samsung Display Co., Ltd.
主分類號：H01L51/52
所在地：Yongin-si
An organic light emitting diode (OLED) display including: a substrate; an organic light emitting diode formed on the substrate; a metal oxide layer fo...
專利號：US17302759
申請人：Kateeva, Inc.
主分類號：H01L29/08
所在地：CA Newark
Optoelectronic devices that include a composite film in a multilayered encapsulation stack are provided. Also provided are methods of forming the ligh...
專利號：US17180622
申請人：SAMSUNG DISPLAY CO., LTD.
主分類號：H10K50/844
所在地：Yongin-si
A method of manufacturing a display apparatus includes providing a substrate, forming a display unit defining an opening portion in a display region o...
專利號：US16997212
申請人：Samsung Display Co., Ltd.
主分類號：H10K50/844
所在地：Yongin-Si
A display panel includes a light emitting element and an encapsulation layer on the light emitting element. The encapsulation layer covers the light e...
專利號：US17600016
申請人：Huawei Technologies Co., Ltd.
主分類號：G06F3/041
所在地：Shenzhen
A foldable display stack for an electronic device comprising a covering structure comprising a first cover layer and a polarizing layer, a second cove...
專利號：US16959158
申請人：WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
主分類號：H10K50/80
所在地：Wuhan
A flexible display panel and a fabricating method thereof are described. The fabricating method has steps of: providing a substrate comprising a hard ...
專利號：US17364493
申請人：Panasonic Intellectual Property Management Co., Ltd.
主分類號：H01L23/00
所在地：Osaka
An imaging device includes: pixels arranged one-dimensionally or two-dimensionally, each of the pixels including an electrode that is electrically con...
專利號：US16926239
申請人：Taiwan Semiconductor Manufacturing Co., Ltd.
主分類號：H01L23/528
所在地：Hsinch
The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a g...
專利號：US17308499
申請人：International Business Machines Corporation
主分類號：H10B63/00
所在地：NY Armonk
A resistive memory device includes a magnetic tunnel junction structure. The magnetic tunnel junction structure includes a free magnetic layer. The fr...
專利號：US17401415
申請人：International Business Machines Corporation
主分類號：H10B61/00
所在地：NY Armonk
A spin-orbit torque magnetoresistive random-access memory device formed by fabricating a spin-Hall-effect (SHE) layer above and in electrical contact ...
專利號：US17346090
申請人：Kepler Computing Inc.
主分類號：H10B53/40
所在地：CA San Francisco
A process integration and patterning flow used to pattern a memory array area for an embedded memory without perturbing a fabricating process for logi...
專利號：US17317663
申請人：SK hynix Inc.
主分類號：H10B51/30
所在地：Icheon-si
A semiconductor device according to an embodiment includes a substrate, a bit line structure and a source line structure respectively extending in a d...
專利號：US17659990
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H10B43/35
所在地：Suwon-si
A three-dimensional memory device is provided. The three-dimensional memory device may include a substrate, a cell stack, a string selection line gate...
專利號：US17859631
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H10B43/27
所在地：Suwon-si
A three-dimensional semiconductor device including a conductive layer disposed on a substrate and including a first conductivity-type impurity; an ins...
專利號：US17576164
申請人：Kioxia Corporation
主分類號：H01L29/76
所在地：Tokyo
A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a pl...
專利號：US17118932
申請人：Kioxia Corporation
主分類號：H10B41/27
所在地：Tokyo
A semiconductor storage device according to one embodiment includes a stacked body, a pillar, a contact, and a region. In the stacked body, a pluralit...
專利號：US17320049
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H10B20/20
所在地：Hsin-Chu
A semiconductor device includes a program word line and a read word line over an active region. Each of the program word line and the read word line e...
專利號：US17528505
申請人：NANYA TECHNOLOGY CORPORATION
主分類號：H10B12/00
所在地：New Taipei
A memory array and a method for preparing the memory are provided. The memory array includes a semiconductor substrate, an isolation structure and con...
專利號：US17377672
申請人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號：H01L27/11
所在地：Hsinchu
Integrated circuits (IC) are provided. An IC includes a plurality of first cells arranged in a first line, and a plurality of second cells arranged in...
專利號：US17631815
申請人：FUJI CORPORATION
主分類號：B23P19/00
所在地：Chiryu
An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control sectio...
專利號：US17778009
申請人：Carl Freudenberg KG
主分類號：H05K9/00
所在地：Weinheim
A flexible laminate for shielding against electromagnetic radiation includes: a) at least one metal foil; and b) a sheet-like substrate made of a fibe...
專利號：US17747841
申請人：Nortek Air Solutions Canada, Inc.
主分類號：G06F1/20
所在地：Saskatoon
Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery...
專利號：US17474084
申請人：Molex, LLC
主分類號：H05K7/20
所在地：IL Lisle
The present disclosure provides a connector assembly comprising a cage and a heat sink. The cage has a receiving space and a wall constituting the rec...
專利號：US17677197
申請人：OVH
主分類號：H05K7/18
所在地：Roubaix
A method is provided for positioning a data center rack relative to a rack-supporting frame. The method includes connecting at least one front attachm...
專利號：US17340325
申請人：Amir Khalaji
主分類號：H05K7/14
所在地：CA Irvine
A modular power supply system including an enclosure and a casing assembly contained within the enclosure. The casing assembly includes a plurality of...
專利號：US17945000
申請人：CHATSWORTH PRODUCTS, INC.
主分類號：H05K5/02
所在地：CA Simi Valley
An electronic equipment enclosure includes a frame structure and at least one panel secured to the frame structure. The at least one panel includes on...
專利號：US17078368
申請人：KACO GmbH + Co. KG
主分類號：H05K5/02
所在地：Kirchardt
The valve for pressure compensation and/or for emergency venting of a container, preferably of a housing of a vehicle battery, has a housing (6) with ...
專利號：US17588457
申請人：IBIDEN CO., LTD.
主分類號：H05K1/02
所在地：Gifu
A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection condu...
專利號：US17817446
申請人：SHINKO ELECTRIC INDUSTRIES CO., LTD.
主分類號：H05K1/11
所在地：Nagano
An interconnect substrate includes a core layer including a resin layer mainly composed of a non-photosensitive thermosetting resin and a through inte...
專利號：US17319633
申請人：SAMSUNG ELECTRONICS CO., LTD.
主分類號：H05K1/02
所在地：Suwon-si
Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method fo...
專利號：US17470038
申請人：CHIPBOND TECHNOLOGY CORPORATION
主分類號：H05K1/18
所在地：Hsinchu
A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic...
專利號：US17662432
申請人：Unimicron Technology Corp.
主分類號：H05K1/02
所在地：Taoyuan
An electronic circuit assembly includes an interposer substrate, a wiring substrate, an electrical connective part and an electronic component. The in...
專利號：US17898907
申請人：Samsung Electronics Co., Ltd.
主分類號：H05K1/18
所在地：Suwon-si
A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and incl...