專利號(hào)：US17178190
申請(qǐng)人：Applied Materials, Inc.
主分類號(hào)：H10N60/01
所在地：CA Santa Clara
A method of fabricating a device including a superconductive layer includes depositing a seed layer on a substrate at a first temperature, the seed la...
專利號(hào)：US18132992
申請(qǐng)人：UNITED MICROELECTRONICS CORP.
主分類號(hào)：H10N50/80
所在地：Hsin-Chu
The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view o...
專利號(hào)：US17270681
申請(qǐng)人：Everspin Technologies, Inc.
主分類號(hào)：H10N50/01
所在地：AZ Chandler
A method of fabricating a magnetoresistive device may comprise forming an electrically conductive region and forming a first seed region on one side o...
專利號(hào)：US16723363
申請(qǐng)人：Frore Systems Inc.
主分類號(hào)：H10N30/50
所在地：CA San Jose
A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least ...
專利號(hào)：US18533907
申請(qǐng)人：HARBIN INSTITUTE OF TECHNOLOGY
主分類號(hào)：H10N10/01
所在地：Heilongjiang
The present disclosure provides a preparation method of a contact material with high thermal stability and low contact resistance based on an MgAgSb-b...
專利號(hào)：US17785417
申請(qǐng)人：Merck Patent GmbH
主分類號(hào)：C07D405/14
所在地：Darmstadt
The present invention describes dibenzofuran derivatives substituted by electron-deficient heteroaryl groups, and electronic devices, especially organ...
專利號(hào)：US17357485
申請(qǐng)人：The Regents of the University of Michigan
主分類號(hào)：H10K85/60
所在地：MI Ann Arbor
An organic light emitting device comprises an anode and a cathode, at least one organic layer configured between the anode and the cathode, and at lea...
專利號(hào)：US16541519
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類號(hào)：H10K85/60
所在地：Yongin-si
An organic light-emitting device includes a first electrode, a second electrode facing the first electrode, and an organic layer between the first ele...
專利號(hào)：US17370752
申請(qǐng)人：SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
主分類號(hào)：G09G5/00
所在地：Atsugi
When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an...
專利號(hào)：US17209849
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類號(hào)：H10K77/10
所在地：Yongin-si
A display device includes a plurality of islands and a bridge connecting the plurality of islands to each other. Each of the plurality of islands incl...
專利號(hào)：US17188744
申請(qǐng)人：Samsung Display Co., LTD.
主分類號(hào)：H10K71/00
所在地：Yongin-si
A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending ...
專利號(hào)：US17586052
申請(qǐng)人：SEIKO EPSON CORPORATION
主分類號(hào)：H10K59/82
所在地：Tokyo
An organic EL device includes a counter electrode, a first reflection layer provided so as to be separate from the counter electrode by a first optica...
專利號(hào)：US17310325
申請(qǐng)人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H10K59/35
所在地：Beijing
The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The display substrate includes a display ar...
專利號(hào)：US18318644
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K59/131
所在地：Yongin-si
An organic light emitting diode display includes: a substrate including a display area and a non-display area adjacent to the display area; a pixel th...
專利號(hào)：US18094861
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K59/38
所在地：Yongin-Si
A display device includes: a substrate; signal lines including a gate line, a data line, and a driving voltage line that collectively define an outer ...
專利號(hào)：US17590038
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K59/121
所在地：Yongin-si
Disclosed herein is an organic light emitting diode display, including a substrate, a first thin film transistor including a first active pattern on t...
專利號(hào)：US17256091
申請(qǐng)人：BOE Technology Group Co., Ltd.
主分類號(hào)：H10K50/822
所在地：Beijing
A display substrate and a manufacturing method thereof, a display panel and a display apparatus are provided. The display substrate includes a display...
專利號(hào)：US18151954
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類號(hào)：H01L51/54
所在地：Yongin-si
An organic light-emitting device includes: a first pixel electrode on a first emission region, a second pixel electrode on a second emission region, a...
專利號(hào)：US17919554
申請(qǐng)人：Semiconductor Energy Laboratory Co., Ltd.
主分類號(hào)：H10K39/34
所在地：Atsugi
A display device with an imaging function is provided. A high-resolution imaging device or display device is provided. The display device includes fir...
專利號(hào)：US17549162
申請(qǐng)人：COMMISSARIAT à L'éNERGIE ATOMIQUE ET AUX éNERGIES ALTERNATIVES; WEEBIT NANO LTD
主分類號(hào)：G11C13/00
所在地：Paris
A memory includes a matrix of resistive memory cells and an interfacing device to interface the matrix, the interfacing device including at least a co...
專利號(hào)：US17387954
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H01L29/423
所在地：Hsinchu
A method of fabricating a semiconductor device includes forming a first stack of semiconductor layers on a substrate. The first stack of semiconductor...
專利號(hào)：US17112635
申請(qǐng)人：YANGTZE MEMORY TECHNOLOGIES CO., LTD.
主分類號(hào)：H10B43/27
所在地：Wuhan
Embodiments of three-dimensional (3D) memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a subs...
專利號(hào)：US16950549
申請(qǐng)人：SK hynix Inc.
主分類號(hào)：H10B43/27
所在地：Icheon-si
A semiconductor memory device, and a method of manufacturing the semiconductor memory device, includes a gate stacked body, an insulating layer overla...
專利號(hào)：US18131097
申請(qǐng)人：Micron Technology, Inc.
主分類號(hào)：H10B12/00
所在地：ID Boise
Embodiments herein relate to vertical contacts for semiconductor devices. For instance, a memory device having vertical contacts can comprise a substr...
專利號(hào)：US18165692
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H10B12/00
所在地：Suwon-si
A semiconductor memory device includes a stack including a plurality of layers vertically stacked on a substrate, each of the layers including a bit l...
專利號(hào)：US18233172
申請(qǐng)人：Semiconductor Energy Laboratory Co., Ltd.
主分類號(hào)：H10B12/00
所在地：Kanagawa-ken
A semiconductor device with a large storage capacity per unit area is provided.A semiconductor device includes a memory cell. The memory cell includes...
專利號(hào)：US17194995
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H01L27/11
所在地：Suwon-si
A semiconductor memory device includes a static random access memory (SRAM) cell that is provided on a substrate and includes a pass-gate transistor, ...
專利號(hào)：US17896162
申請(qǐng)人：Manufacturing Resources International, Inc.
主分類號(hào)：H05K7/20
所在地：GA Alpharetta
A field customizable airflow system, method, and communications box are provided. A communications box is located above an electronic display subassem...
專利號(hào)：US17353401
申請(qǐng)人：Raytheon Company
主分類號(hào)：H05K7/20
所在地：MA Waltham
A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. T...
專利號(hào)：US17670113
申請(qǐng)人：Quanta Computer Inc.
主分類號(hào)：H05K7/20
所在地：Taoyuan
A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The fir...
專利號(hào)：US17546820
申請(qǐng)人：Hitachi Astemo, Ltd.
主分類號(hào)：H05K7/20
所在地：Hitachinaka
A circuit board of an electronic control device has a surface to which a connector is attached and on which a heat generating component is mounted. A ...
專利號(hào)：US17625438
申請(qǐng)人：Nippon Telegraph and Telephone Corporation
主分類號(hào)：H05K7/18
所在地：Tokyo
In the case in which a blank panel having holes is mounted obliquely on a rack having holes, the blank panel includes an alignment mechanism for align...
專利號(hào)：US17573694
申請(qǐng)人：CORNING INCORPORATED
主分類號(hào)：H05K5/02
所在地：NY Corning
Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a texture...
專利號(hào)：US17212245
申請(qǐng)人：Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H05K5/02
所在地：Chengdu
The present disclosure relates to the field of display technology, and proposes an attaching device for a flexible display panel, including a flexible...
專利號(hào)：US17542867
申請(qǐng)人：R&D Circuits
主分類號(hào)：H05K3/42
所在地：NJ South Plainfield
The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture ...
專利號(hào)：US18191427
申請(qǐng)人：TactoTek Oy
主分類號(hào)：H05K1/02
所在地：Oulunsalo
The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrat...
專利號(hào)：US17355672
申請(qǐng)人：International Business Machines Corporation
主分類號(hào)：H05K1/18
所在地：NY Armonk
A flexible circuit substrate that includes a conductive line on a flexible substrate and at least one slot in the conductive line on the flex substrat...
專利號(hào)：US17864562
申請(qǐng)人：Fulian Precision Electronics (Tianjin) Co., LTD.
主分類號(hào)：H05K1/14
所在地：Tianjin
A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main bo...
專利號(hào)：US17375307
申請(qǐng)人：Samsung Electronics Co., Ltd.; SNU R&DB Foundation
主分類號(hào)：G06F9/54
所在地：Suwon-si
An electronic device includes: a host box comprising a host processor configured to control an operation of the electronic device, a host motherboard ...
專利號(hào)：US17652104
申請(qǐng)人：Murata Manufacturing Co., Ltd.
主分類號(hào)：H05K1/11
所在地：Nagaokakyo
A stacked-layer board includes a base material including a plurality of dielectric layers stacked on each other, a first main surface being a surface ...
專利號(hào)：US17707196
申請(qǐng)人：IBIDEN CO., LTD.
主分類號(hào)：H05K1/11
所在地：Gifu
A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including pads, a solder resist layer formed o...
專利號(hào)：US17893366
申請(qǐng)人：Chung-Tai Chang; Chia-Hao Chang; Ting-Yi Chang
主分類號(hào)：H01H1/24
所在地：Tainan
A capacitor capable of releasing reactive oxygen species and reactive nitrogen species after powering of claim 1 is composed of the dielectric materia...
專利號(hào)：US18424732
申請(qǐng)人：LAMXON TECHNOLOGY BUILDING MATERIALS CO., LTD.
主分類號(hào)：H05B47/19
所在地：Dongguan
The present invention relates to the technical field of lamp mirrors, in particular to a cooperative synchronous control system for a plurality of pow...
專利號(hào)：US18001955
申請(qǐng)人：VALEO VISION
主分類號(hào)：H05B45/18
所在地：Bobigny
The invention provides a method for operating an automotive lighting device including the providing a first preliminary current profile, calculating a...
專利號(hào)：US17316898
申請(qǐng)人：Seven Networks, LLC
主分類號(hào)：H04W88/18
所在地：TX Marshall
A system with distributed proxy for reducing traffic in a wireless network satisfies data requests made by a mobile application. The system includes a...
專利號(hào)：US17538233
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H04W88/06
所在地：Suwon-si
A user equipment (UE) is provided. The UE includes a first subscriber identity module (SIM) configured to correspond to a first cellular network, a se...
專利號(hào)：US17532576
申請(qǐng)人：T-Mobile USA, Inc.
主分類號(hào)：H04W8/00
所在地：WA Bellevue
One or more service data feeds that indicate a plurality of consumer eSIM profiles received are loaded into one or more profile data stores of at leas...
專利號(hào)：US16905861
申請(qǐng)人：HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
主分類號(hào)：H04W8/00
所在地：TX Houston
Systems and methods are provided for detecting the presence of a hidden camera on a network. When video is encoded and transmitted over/across a netwo...
專利號(hào)：US18314349
申請(qǐng)人：Telefonaktiebolaget LM Ericsson (publ)
主分類號(hào)：H04W76/27
所在地：Stockholm
A method and wireless device for handling a periodic RNA update timer are disclosed. A method is implemented in a wireless device (WD) for stopping an...
專利號(hào)：US17517677
申請(qǐng)人：Xiaobo Zhang
主分類號(hào)：H04W76/27
所在地：Shanghai
A method and a device used in communication nodes for wireless communications. A communication node receives a first signaling, the first signaling co...