專利號(hào)：US18009530
申請(qǐng)人：XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
主分類號(hào)：H10B63/00
所在地：Fujian
A semiconductor device and a manufacturing method of the semiconductor device. The semiconductor device includes: a semiconductor substrate; a bottom ...
專利號(hào)：US18200388
申請(qǐng)人：Applied Materials, Inc.
主分類號(hào)：H10N60/01
所在地：CA Santa Clara
A method of fabricating a device including a superconductive layer includes depositing a seed layer on a substrate, exposing the seed layer to an oxyg...
專利號(hào)：US16909718
申請(qǐng)人：IMEC vzw
主分類號(hào)：H10N52/80
所在地：Leuven
The disclosed technology relates generally to magnetic devices, and more particularly to magnetic memory and/or logic devices. In an aspect, a spintro...
專利號(hào)：US18462887
申請(qǐng)人：ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA
主分類號(hào)：H10N50/80
所在地：AZ Tucson
Advanced magnetic tunneling junctions (MTJs) that dramatically reduce power consumption (switching energy, ESW) while maintaining a reasonably high tu...
專利號(hào)：US18381627
申請(qǐng)人：UNITED MICROELECTRONICS CORP.
主分類號(hào)：H10N50/80
所在地：Hsin-Chu
A semiconductor device includes a substrate, a first MTJ structure, a second MTJ structure, an interconnection structure including a first metal inter...
專利號(hào)：US17213573
申請(qǐng)人：TDK CORPORATION
主分類號(hào)：H10N30/50
所在地：Tokyo
Provided is a piezoelectric element according to the invention including a stacked body in which a piezoelectric layer and an internal electrode layer...
專利號(hào)：US18076845
申請(qǐng)人：Pawel Czubarow; Anthony Nicholas Czubarow; Philip Abraham Premysler
主分類號(hào)：H03K3/35
所在地：MA Wellesley
Methods of making various fibers are provided including co-axial fibers with oppositely doped cladding and core are provide; hollow core doped silicon...
專利號(hào)：US17893355
申請(qǐng)人：Semiconductor Energy Laboratory Co., Ltd.
主分類號(hào)：H01L51/00
所在地：Kanagawa-ken
A novel organic compound is provided. That is, a novel organic compound that is effective in improving element characteristics and reliability is prov...
專利號(hào)：US17347249
申請(qǐng)人：ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.; DuPont Electronics, Inc.
主分類號(hào)：C07D307/77
所在地：Chungcheongnam-do
The present disclosure relates to a plurality of light-emitting materials, an organic electroluminescent compound, and an organic electroluminescent d...
專利號(hào)：US15283672
申請(qǐng)人：NIKON CORPORATION
主分類號(hào)：B05B13/02
所在地：Tokyo
A film forming apparatus, a substrate processing apparatus, and a device manufacturing method are provided, which improve the film thickness uniformit...
專利號(hào)：US18062050
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類號(hào)：H10K59/65
所在地：Yongin-si
Systems and methods are described for a display device in which the recognition failure of a fingerprint recognition sensor disposed in a display area...
專利號(hào)：US18218188
申請(qǐng)人：Mianyang BOE Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.
主分類號(hào)：H10K59/40
所在地：Sichuan
Provided is a display panel, including: a substrate including a display region and a peripheral region; a first dam; a planarization layer disposed wi...
專利號(hào)：US17512396
申請(qǐng)人：LG DISPLAY CO., LTD.
主分類號(hào)：H10K59/65
所在地：Seoul
Discussed is a display device including a display panel that includes a substrate, a light shield layer disposed on the substrate, a light emitting el...
專利號(hào)：US18141643
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H01L23/00
所在地：Yongin-si
A display device includes a base layer on which a display area and a non-display area are defined, a circuit layer including a first power electrode a...
專利號(hào)：US17379462
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K59/122
所在地：Yongin-si
A display apparatus includes a display panel including a display element, a first film comprising an elastomeric material and disposed on the display ...
專利號(hào)：US17272397
申請(qǐng)人：Semiconductor Energy Laboratory Co., Ltd.
主分類號(hào)：H10K59/122
所在地：Atsugi
A display device having a photosensing function is provided. A highly convenient display device is provided. The display device includes a light-recei...
專利號(hào)：US17504161
申請(qǐng)人：WUHAN TIANMA MICROELECTRONICS CO., LTD.
主分類號(hào)：H10K50/856
所在地：Wuhan
A display panel and a display apparatus are provided. The display panel includes first to third light extraction modules. An angle α1 between the firs...
專利號(hào)：US18453198
申請(qǐng)人：Samsung Display Co., LTD.
主分類號(hào)：H10K50/844
所在地：Yongin-si
Provided is an organic electroluminescent display device, including a substrate, an organic light-emitting device on the substrate, and an encapsulati...
專利號(hào)：US17255569
申請(qǐng)人：BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H10K50/16
所在地：Beijing
A light-emitting structure, a display panel and a display device. The light-emitting structure comprises a first light-emitting element. The first lig...
專利號(hào)：US17842183
申請(qǐng)人：SONY SEMICONDUCTOR SOLUTIONS CORPORATION
主分類號(hào)：H01L27/30
所在地：Kanagawa
This technology relates to a solid-state image sensor configured to make smaller the chip size of a CIS that uses an organic photoelectric conversion ...
專利號(hào)：US17519340
申請(qǐng)人：SONY SEMICONDUCTOR SOLUTIONS CORPORATION
主分類號(hào)：H01L27/30
所在地：Kanagawa
The present disclosure relates to a solid-state imaging device that can achieve a high S/N ratio at a high sensitivity level without any decrease in r...
專利號(hào)：US18193965
申請(qǐng)人：STMicroelectronics (Rousset) SAS
主分類號(hào)：H10B63/00
所在地：Rousset
The disclosure concerns a resistive memory cell, including a stack of a selector, of a resistive element, and of a layer of phase-change material, the...
專利號(hào)：US17352862
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H10B43/50
所在地：Suwon-si
A semiconductor device includes a substrate; a stack structure on the substrate and including an alternating stack of interlayer insulating layers and...
專利號(hào)：US18132019
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H10B43/27
所在地：Suwon-si
A semiconductor device including vertical structures on a substrate; and interlayer insulating layers and gate layers on the substrate, wherein the ga...
專利號(hào)：US17517459
申請(qǐng)人：Lodestar Licensing Group LLC
主分類號(hào)：H10B43/27
所在地：IL Evanston
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alterna...
專利號(hào)：US17244311
申請(qǐng)人：SANDISK TECHNOLOGIES LLC
主分類號(hào)：H10B43/27
所在地：TX Addison
Two types of support pillar structures are formed in a staircase region of an alternating stack of insulating layers and sacrificial material layers. ...
專利號(hào)：US17113492
申請(qǐng)人：Yangtze Memory Technologies Co., Ltd.
主分類號(hào)：H10B43/27
所在地：Hubei
In a method for fabricating a semiconductor device, an initial stack is formed. The initial stack is formed of sacrificial layers and insulating layer...
專利號(hào)：US18344161
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H01L29/423
所在地：Hsin-Chu
Various embodiments of the present application are directed to a method for forming an integrated circuit (IC) comprising forming a multilayer film to...
專利號(hào)：US18138820
申請(qǐng)人：Kioxia Corporation
主分類號(hào)：G11C16/06
所在地：Tokyo
A method of controlling a memory device includes receiving a write instruction; starting a write operation to a first address in response to the write...
專利號(hào)：US17375933
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H10B41/27
所在地：Suwon-si
A semiconductor device includes a first substrate structure including a first substrate, circuit devices, first interconnection lines, bonding metal l...
專利號(hào)：US17309775
申請(qǐng)人：Institute of Microelectronics, Chinese Academy of Sciences
主分類號(hào)：H10B41/27
所在地：Beijing
Disclosed are a semiconductor device, a method for manufacturing the same, an integrated circuit, and an electronic apparatus. The semiconductor devic...
專利號(hào)：US17680208
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H10B41/00
所在地：Hsin-Chu
Various embodiments of the present application are directed to an IC device and associated forming methods. In some embodiments, a memory region and a...
專利號(hào)：US17194995
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H01L27/11
所在地：Suwon-si
A semiconductor memory device includes a static random access memory (SRAM) cell that is provided on a substrate and includes a pass-gate transistor, ...
專利號(hào)：US18657967
申請(qǐng)人：Manufacturing Resources International, Inc.
主分類號(hào)：H05K7/20
所在地：GA Alpharetta
A display assembly with cooling pathways includes a housing for an electronic display and a closed, continuous airflow pathway. Partition(s) located w...
專利號(hào)：US17701396
申請(qǐng)人：Baidu USA LLC
主分類號(hào)：H05K7/20
所在地：CA Sunnyvale
Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. The heterogenous data centers includes mult...
專利號(hào)：US17144605
申請(qǐng)人：BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
主分類號(hào)：H05K7/20
所在地：Beijing
The present disclosure relates to a heat sink assembly and control method, and an electronic device and manufacturing method. The heat sink assembly i...
專利號(hào)：US17935088
申請(qǐng)人：LENOVO (SINGAPORE) PTE. LTD.
主分類號(hào)：H05K7/20
所在地：Singapore
An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and ...
專利號(hào)：US17612943
申請(qǐng)人：ANTPOOL TECHNOLOGIES LIMITED
主分類號(hào)：H05K7/20
所在地：Hong Kong
Embodiments of the present disclosure relate to a cooling device, including a housing and a heat dissipation assembly. A sealed space for accommodatin...
專利號(hào)：US16762089
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H05K7/18
所在地：Suwon-si
The present invention proposes a device for fixing communication equipment, which couples communication equipment with a communication pole, the devic...
專利號(hào)：US18442059
申請(qǐng)人：Worksite Lighting LLC
主分類號(hào)：H05K7/14
所在地：TX Haltom City
An interoperable power distribution apparatus and systems includes N power distribution base units having a first configuration as sequentially arrang...
專利號(hào)：US17962166
申請(qǐng)人：LG DISPLAY CO., LTD.
主分類號(hào)：H05K5/02
所在地：Seoul
A flexible display device can include a back cover supporting a rear surface of a display panel, a first plate disposed on the rear surface of the bac...
專利號(hào)：US18353895
申請(qǐng)人：Innolux Corporation
主分類號(hào)：H05K5/00
所在地：Miao-Li County
An electronic device includes a first substrate, a second substrate, a first circuit board, and a first layer. The first substrate includes a first bo...
專利號(hào)：US17873796
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H05K5/00
所在地：Gyeonggi-do
Disclosed is an electronic device including a first housing, a second housing, a display disposed on the first housing and the second housing, a first...
專利號(hào)：US17866392
申請(qǐng)人：UNILUMIN GROUP CO., LTD
主分類號(hào)：G06F1/16
所在地：Shenzhen
Disclosed are a rotary knob lock, a maintenance tool and an LED display. The rotary knob lock includes a lock body, the lock body includes a head part...
專利號(hào)：US17078108
申請(qǐng)人：Jentech Precision Industrial Co., LTD.
主分類號(hào)：H05K3/44
所在地：Taoyuan
An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The ins...
專利號(hào)：US17805028
申請(qǐng)人：Inventec (Pudong) Technology Corporation; INVENTEC CORPORATION
主分類號(hào)：H01R13/60
所在地：Shanghai
The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanis...
專利號(hào)：US16157185
申請(qǐng)人：Intel Corporation
主分類號(hào)：H05K3/00
所在地：CA Santa Clara
Embodiments disclosed herein include a printed circuit board (PCB) with a non-uniform thickness and methods of fabricating such PCBs. In an embodiment...
專利號(hào)：US17446598
申請(qǐng)人：Liquid Wire Inc.
主分類號(hào)：H05K1/18
所在地：OR Portland
A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substr...
專利號(hào)：US17573102
申請(qǐng)人：Himax Technologies Limited
主分類號(hào)：H05K1/18
所在地：Tainan
A pad configuration adaptable to a display system includes a plurality of input bond pads, via which a driver of the display system is mounted and sig...
專利號(hào)：US17834971
申請(qǐng)人：Equal 1 Laboratories Ireland Limited
主分類號(hào)：H05K1/11
所在地：Wicklow
A novel and useful system wiring apparatus and related techniques that address the need to feed power and electronic signals to and from a sample boar...