專利號(hào)：US17007759
申請(qǐng)人：GLOBALFOUNDRIES Singapore Pte. Ltd.
主分類號(hào)：H01L45/00
所在地：Singapore
Structures for a resistive memory element and methods of forming a structure for a resistive memory element. The resistive memory element has a first ...
專利號(hào)：US16935631
申請(qǐng)人：TDK CORPORATION
主分類號(hào)：H10N52/80
所在地：Tokyo
A spin-orbit-torque type magnetoresistance effect element includes: a first ferromagnetic layer; a second ferromagnetic layer; a non-magnetic layer wh...
專利號(hào)：US16696810
申請(qǐng)人：Deep Science, LLC
主分類號(hào)：H10N30/80
所在地：WA Bellevue
A system includes a surface, an actuator, and a controller. The surface has a fluid flowing over the surface. The actuator is coupled to the surface t...
專利號(hào)：US17654050
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H01L51/00
所在地：Yongin-si
Provided are an organic light-emitting device including a capping layer including an amine-based compound represented by a set or predetermined formul...
專利號(hào)：US15869988
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H01L51/50
所在地：Yongin-si
An amine-based compound and an organic light-emitting device including the same are provided. The organic light-emitting device may include: a first e...
專利號(hào)：US16044620
申請(qǐng)人：UNIVERSAL DISPLAY CORPORATION
主分類號(hào)：H10K85/30
所在地：NJ Ewing
A compound having a structure of the formula Ir(LA)(LB), in which LA is a bidentate, tridentate, tetradentate, pentadentate, or hexadentate ligand and...
專利號(hào)：US16044583
申請(qǐng)人：UNIVERSAL DISPLAY CORPORATION
主分類號(hào)：H10K85/30
所在地：NJ Ewing
A compound having the formula [LA]yIr[LB]x is disclosed, where LA is selected from one of the following: The compounds have at least one pyridyl diben...
專利號(hào)：US16977207
申請(qǐng)人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H10K71/80
所在地：Beijing
The present disclosure relates to a method of fabricating a display panel. The method may include: forming a separation layer having first openings on...
專利號(hào)：US17884320
申請(qǐng)人：LG Display Co., Ltd.
主分類號(hào)：G06F3/041
所在地：Seoul
Disclosed are an organic light emitting display having a touch sensor, which may achieve process simplification and cost reduction, and a method of fa...
專利號(hào)：US17806919
申請(qǐng)人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H10K59/38
所在地：Beijing
Embodiments of the present disclosure provide an OLED device, a method of manufacturing the OLED device, and a display panel. The OLED device comprise...
專利號(hào)：US17327800
申請(qǐng)人：Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.
主分類號(hào)：H10K59/38
所在地：Sichuan
A display substrate, a preparation method thereof and a display apparatus. The display substrate comprises a substrate, multiple pixel units arranged ...
專利號(hào)：US17721023
申請(qǐng)人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H01L27/32
所在地：Beijing
The present disclosure generally relates to the field of display technology, and in particular, to an array substrate, a method of fabricating the arr...
專利號(hào)：US17322055
申請(qǐng)人：BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H01L27/32
所在地：Beijing
A display panel having a pixel defining layer defining subpixel apertures of subpixels is provided. The pixel defining layer is a unitary structure in...
專利號(hào)：US17237824
申請(qǐng)人：CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
主分類號(hào)：H01L29/08
所在地：Sichuan
The present application provides a display substrate and a method for manufacturing the same and a display device. In the display substrate, each sub-...
專利號(hào)：US17839864
申請(qǐng)人：Japan Display Inc.
主分類號(hào)：H01L27/00
所在地：Tokyo
A plurality of thin film transistors provided in a peripheral region are first staggered thin film transistors where a first channel layer configured ...
專利號(hào)：US17274348
申請(qǐng)人：SONY SEMICONDUCTOR SOLUTIONS CORPORATION; SONY CORPORATION
主分類號(hào)：H10K59/121
所在地：Kanagawa
A display device includes a light-emitting portion and a drive circuit. The drive circuit includes a transistor that drives the light-emitting portion...
專利號(hào)：US17731111
申請(qǐng)人：LG Display Co., Ltd.
主分類號(hào)：G09G3/30
所在地：Seoul
A display apparatus including two lines is provided. The two lines may extend in a first direction. A light-emitting device may be disposed between th...
專利號(hào)：US17012700
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K50/858
所在地：Yongin-Si
A light-emitting device includes: a first electrode; a second electrode facing the first electrode; and an interlayer disposed between the first elect...
專利號(hào)：US16912552
申請(qǐng)人：Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd.
主分類號(hào)：H10K50/858
所在地：Wuhan
Provided is a display panel, including: a base substrate, a light emitting device layer provided on the base substrate and including light emitting de...
專利號(hào)：US17341309
申請(qǐng)人：SAMSUNG DISPLAY CO., LTD.
主分類號(hào)：H10K50/842
所在地：Yongin-si
A display device includes a substrate including a display area and a peripheral area, a first insulating layer on the substrate, a first dam in the pe...
專利號(hào)：US16905570
申請(qǐng)人：Samsung Display Co., Ltd.
主分類號(hào)：H10K50/17
所在地：Yongin-si
A display device may include a substrate, a first electrode on the substrate, a pixel defining layer exposing the first electrode and covering a side ...
專利號(hào)：US17671970
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD
主分類號(hào)：H01L51/50
所在地：Suwon-si
A light emitting device including a first electrode and a second electrode, and an emission layer disposed between the first electrode and the second ...
專利號(hào)：US17876447
申請(qǐng)人：LG DISPLAY CO., LTD.; Korea Advanced Institute of Science and Technology
主分類號(hào)：H01L51/50
所在地：Seoul
The present disclosure provides a quantum dot (QD) light emitting diode including: a first electrode; a second electrode facing the first electrode; a...
專利號(hào)：US17364862
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H10B61/00
所在地：Hsinchu
A semiconductor device includes a semiconductor substrate, a gate structure, a source region, a drain region, an interconnect structure, a memory cell...
專利號(hào)：US16382519
申請(qǐng)人：International Business Machines Corporation
主分類號(hào)：H01L27/22
所在地：NY Armonk
A semiconductor device structure includes a metallization stack comprising one or more patterned metal layers. A bi-layer dielectric cap is disposed o...
專利號(hào)：US17085715
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H10B43/50
所在地：Suwon-si
A semiconductor device includes a substrate having a first region and a second region, gate electrodes stacked and spaced apart from each other in a f...
專利號(hào)：US17824582
申請(qǐng)人：Micron Technology, Inc.
主分類號(hào)：H10B43/27
所在地：ID Boise
Some embodiments include an integrated assembly having a memory array region, a staircase region, and an intervening region between the staircase regi...
專利號(hào)：US17672819
申請(qǐng)人：Kioxia Corporation
主分類號(hào)：H10B43/27
所在地：Minato-ku
A semiconductor memory device includes a connecting member including a semiconductor material, a first electrode film, a first insulating film, a stac...
專利號(hào)：US17530915
申請(qǐng)人：Samsung Electronics Co., Ltd.
主分類號(hào)：H10B43/27
所在地：Suwon-si
A semiconductor device includes gate electrodes and interlayer insulating layers that are alternately stacked on a substrate, channel structures space...
專利號(hào)：US17159719
申請(qǐng)人：Micron Technology, Inc.
主分類號(hào)：H10B12/00
所在地：ID Boise
A method of forming an array of capacitors comprises forming a vertical stack above a substrate. The stack comprises a horizontally-elongated conducti...
專利號(hào)：US17401251
申請(qǐng)人：Taiwan Semiconductor Manufacturing Company, Ltd.
主分類號(hào)：H10B10/00
所在地：Hsinchu
A memory device is provided. The memory device includes a plurality of memory cells. Each memory cell includes a latch circuit formed of N-type field ...
專利號(hào)：US17606697
申請(qǐng)人：3M INNOVATIVE PROPERTIES COMPANY
主分類號(hào)：H05K9/00
所在地：MN St. Paul
An electrically conductive multilayer film for providing an electrical path between two conductive surfaces includes a plastic backing layer, an elect...
專利號(hào)：US17409360
申請(qǐng)人：Manufacturing Resources International, Inc.
主分類號(hào)：H05K7/20
所在地：GA Alpharetta
A fan unit for improved airflow within a display assembly is provided. Fans are provided at a housing which includes a rear wall defining a curved sha...
專利號(hào)：US17479753
申請(qǐng)人：GM Cruise Holdings LLC
主分類號(hào)：H05K7/20
所在地：CA San Francisco
Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can incl...
專利號(hào)：US17119176
申請(qǐng)人：Valeo Siemens eAutomotive (Shenzhen) Co., Ltd.
主分類號(hào)：H01L23/31
所在地：Shenzhen
Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, and the electrical apparatus. In the a...
專利號(hào)：US17191317
申請(qǐng)人：KIOXIA CORPORATION
主分類號(hào)：H05K7/20
所在地：Tokyo
A semiconductor storage device includes a housing, a first substrate disposed in the housing and on which one or more first electronic components are ...
專利號(hào)：US17523692
申請(qǐng)人：QUALCOMM Incorporated
主分類號(hào)：H05K7/20
所在地：CA San Diego
An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive con...
專利號(hào)：US17354216
申請(qǐng)人：Baidu USA LLC
主分類號(hào)：H05K7/20
所在地：CA Sunnyvale
An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser cha...
專利號(hào)：US17361005
申請(qǐng)人：Amazon Technologies, Inc.
主分類號(hào)：H05K7/20
所在地：WA Seattle
An airflow duct can be arranged at least in part in a zone alongside an electronics board mounted to a motherboard. The airflow duct can include an in...
專利號(hào)：US17025798
申請(qǐng)人：Manufacturing Resources International, Inc.
主分類號(hào)：H05K7/20
所在地：GA Alpharetta
A rooftop mounted display assembly includes a first and second electronic display located at a housing for mounting to a roof of a vehicle. Apertures ...
專利號(hào)：US17228155
申請(qǐng)人：SAMSUNG ELECTRONICS CO., LTD.
主分類號(hào)：H05K5/00
所在地：Suwon-si
A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook ha...
專利號(hào)：US16940397
申請(qǐng)人：Wistron Corporation
主分類號(hào)：G06F1/16
所在地：New Taipei
A carrying structure including a carrying main body, two engaging components, two driven linkages, and a driving linkage is provided. The carrying mai...
專利號(hào)：US17880107
申請(qǐng)人：Appleton Grp LLC
主分類號(hào)：H05K5/00
所在地：IL Rosemont
An electrical enclosure including a housing having a plurality of side walls and a base, a housing cover positioned over, and secured to, the housing,...
專利號(hào)：US17149858
申請(qǐng)人：Gentherm Inc.
主分類號(hào)：H05K1/03
所在地：MI Northville
A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first con...
專利號(hào)：US17536429
申請(qǐng)人：Kyocera AVX Components (San Diego), Inc.
主分類號(hào)：H05K3/46
所在地：CA San Diego
A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-la...
專利號(hào)：US17537721
申請(qǐng)人：Texas Instruments Incorporated
主分類號(hào)：H05K3/22
所在地：TX Dallas
An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface inclu...
專利號(hào)：US17364083
申請(qǐng)人：CANON KABUSHIKI KAISHA
主分類號(hào)：H05K1/18
所在地：Tokyo
An electronic device capable of suppressing a temperature rise of a heat generating component and reducing the size of the heat generating component. ...
專利號(hào)：US16600191
申請(qǐng)人：Schott AG
主分類號(hào)：H05K1/11
所在地：Mainz
An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made...
專利號(hào)：US17523421
申請(qǐng)人：LG INNOTEK CO., LTD.
主分類號(hào)：H05K1/09
所在地：Seoul
A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second ...
專利號(hào)：US17198754
申請(qǐng)人：SAMSUNG ELECTRO-MECHANICS CO., LTD.
主分類號(hào)：H05K1/02
所在地：Suwon-si
A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and...